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Power electronic modules

Bond graph multi-physics modeling of encapsulating materials in power electronic modules

Bond graph multi-physics modeling of encapsulating materials in power electronic modules

... in power electronic modules for transient and steady-state ...Si power chips, this passive element of the packaging appears as a few studied element sensitive to thermal and mechanical ...the ...

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Linear unknown input functional observer for thermal estimation in power electronic modules

Linear unknown input functional observer for thermal estimation in power electronic modules

... estimation, power electronic modules ...of power electronic mod- ules. Such modules should operate in severe environment and constraints: high temperature and high power ...

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Embedded set of sensors for power electronic modules

Embedded set of sensors for power electronic modules

... of power electronic modules. Such modules should operate in severe environment and constraints: high temperature high power density, fast switching, ...new modules are about ...

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Innovative embedded sensors for power electronic modules:
CAPTIF – ANR research project

Innovative embedded sensors for power electronic modules: CAPTIF – ANR research project

... for power electronic modules: CAPTIF – ANR research ...Micro Power Electronics And Packaging Workshop, International Microelectronics Assembly and Packaging Society (IMAPS), 13 October 2016 ...

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Electromagnetic antenna for power electronic modules : towards a real time electromagnetic characterization

Electromagnetic antenna for power electronic modules : towards a real time electromagnetic characterization

... The studied device is a buck power converter for high temperature applications. This converter is specially developed internally in order to illustrate the in-situ near field probes capability. It is made of a ...

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Electromagnetic antenna for power electronic modules : towards a real time electromagnetic characterization

Electromagnetic antenna for power electronic modules : towards a real time electromagnetic characterization

... Introduction New developments in power electronic design deals with power density, switching ranges and more generally with wide band gap semiconductors’ integration. This trend accentuates the ...

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3D-FE electro-thermo-magnetic modeling of automotive power electronic modules -Wire- bonding and Copper clip technologies comparison

3D-FE electro-thermo-magnetic modeling of automotive power electronic modules -Wire- bonding and Copper clip technologies comparison

... We used a finite element method to finely model the complex and heterogeneous assemblies of the modules. Attention was paid to the definition of the numerical model, the quality of the mesh especially for the ...

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Discrete linear functional observer for the thermal estimation in power modules

Discrete linear functional observer for the thermal estimation in power modules

... integrated power electronic modules are de- signed with the emergence of new semi-conductor ...of power modules induces the precise knowledge of the local temperature, even if it can ...

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Application of linear functional observers for the thermal estimation in power modules

Application of linear functional observers for the thermal estimation in power modules

... integrated power electronic modules are more and more designed with the emergence of new semi- conductor ...of power modules induces the precise knowledge of the local temperature, even ...

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Thermomechanical modeling and simulation of a silicone gel for power electronic devices

Thermomechanical modeling and simulation of a silicone gel for power electronic devices

... Extracted from experimental results, multiphysic behavioral models are developed and dedicated to the insulating material. Finally, the com- parison allows validating both models. First, a 3D finite element model- ing is ...

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DIMENSIONAL ANALYSIS AND SURROGATE MODELS FOR THERMAL MODELLING OF POWER ELECTRONIC COMPONENTS

DIMENSIONAL ANALYSIS AND SURROGATE MODELS FOR THERMAL MODELLING OF POWER ELECTRONIC COMPONENTS

... e-mail: [email protected] 2. Institut Clément Ader UMR CNRS 5312, INSA Toulouse, 3 rue caroline aigle, 31400 Toulouse, France. e-mail: [email protected] , [email protected] Abstract ...

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Cleaning process development and optimization in the surface mount assembly line of power modules

Cleaning process development and optimization in the surface mount assembly line of power modules

... was observed to be larger than the effect of concentration. This is due to the fact that 2 minutes is a very short time for even ultrasonic agitation to clean and cleaning grad[r] ...

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Field Grading Composites Tailored by Electrophoresis—Part 3: Application to Power Electronics Modules Encapsulation

Field Grading Composites Tailored by Electrophoresis—Part 3: Application to Power Electronics Modules Encapsulation

... a power systems in order to reduce the electrical ...in power electronics ...voltage power applications for improving the electrical aging of insulating materials and power system ...

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Optimization of the manufacturing process of macro and nano structures for power modules' interconnection

Optimization of the manufacturing process of macro and nano structures for power modules' interconnection

... revolutionized power electronics in the past few ...the power modules’ packaging. Power devices, based on silicon carbide (SiC) or gallium nitride (GaN), offer reduction of the switching time, ...

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Thermomechanical modelling and simulation of a silicone gel for power electronic devices

Thermomechanical modelling and simulation of a silicone gel for power electronic devices

... Fig. 8. Displacement field in silicone gel block. It can be observed in simulation that maximal displacement reaches about 100 µm in the middle of the block. This maximal displacement is close to the dimension of ...

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Modelling and design approaches for the preliminary design of power electronic converters

Modelling and design approaches for the preliminary design of power electronic converters

... 5. O PTİMİZATİON AND RESULTS 5.1. OPEN MDAO FRAMEWORK In order to optimize the system design, it is possible to associate optimization algorithms to the sizing procedure [25]. Multidisciplinary Design Optimization (MDO) ...

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Study of packaging reliability of two SiC Schottky diodes of power electronic

Study of packaging reliability of two SiC Schottky diodes of power electronic

... Microscopy) analyses of the failed devices highlight the occurrence and the propagation of delaminations or significant physicochemical changes in the die attach solders. Cross sections of the first six failed devices ...

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Design and implementation of power management strategies for long range radio modules with energy harvesting

Design and implementation of power management strategies for long range radio modules with energy harvesting

... low power use-cases, through the de- velopment of WiFi Hallow and Bluetooth Low Energy (BLE), ...usually power hungry, new types of long range wireless communication systems have been devel- oped in order ...

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Highly integrated power electronic converters using active devices embedded in printed-circuit board

Highly integrated power electronic converters using active devices embedded in printed-circuit board

... The dies are first attached to a patterned DBC substrate using silver sintering (fig 1a). This technology offers high electrical and thermal performance, and can sustain the remaining manufacturing steps. As it is a ...

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Development of specific materials for the high power electronic components in electric vehicles

Development of specific materials for the high power electronic components in electric vehicles

... SEMICONDUCTOR/SUBSTRATE ASSEMBLY Electric vehicles contain up to 8 pairs of transistors (IGBT type) and diode; hybrid vehicles may contain more, with a lower power level since the thermal engine makes use also of ...

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