BOOK 8/16-BIT

8/16-BIT MICROPROCESSOR DATA BOOK

~HITACHI®

^M21T132

When using this document, keep the following in mind:

1. This document may, wholly or partially, be subject to change without notice.

2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi's permission.

3. Hitachi will not be held responsible for aIiy damage to the user that may result from accidents or any other reasons during operation of the user's unit according to this document.

4. Circuitry and other examples describe,d herein are meant merely to indi- cate the characteristics and performance of Hitachi's semiconductor prod- ucts. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein.

5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd.

6. MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate officer of Hitachi's sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi's products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS.

September 1991 @Copyright 1991, Hitachi America, Ltd. Printed in U.S.A.

INDEX

8/16-Bit Microprocessor Data Book

General Information

DATA SHEETS

HD6300, HD6800 8-Bit Microcomputer Family

HD64180 8-Bit Microprocessor Family

HD68000 16-Bit Microprocessor Family

• HITACHI

Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 iii

CONTENTS

SECTION 1

• GENERAL INFORMATION

• Quick Reference Guide. . . . ix

• Introduction of Packages ... . • Sockets for Evaluating Surface and Through-Hole Mount Packages. . . 14

• Device Packing. . . 15

• Reliability and Quality Assurance ... . . . 23

• Reliability Test Data of Microcomputer ... " 29 • Program Development and Support System. . . . 15

• Device Availability . . . 40

SECTION 2

• DATA SHEETS HD6303RI A03R/B03R HD6303XI A03X/B03X HD6303Y I A03Y IB03Y IC03Y HD6305X21 A05X2/B05X2 HD6305Y21 A05Y2/B05Y2 HD63B09/C09 HD63B09E/C09E HD6802 HD6802W HD6803/6803-1 HD68091 A09/B09 HD6809EI A09E/B09E

SECTION 3

HD64180R/Z HD64180S HD641180X/3180XI7180X HD648180W

SECTION 4

CMOS Microprocessing Unit. . . 47

CMOS Microprocessing Unit .. . . 86

CMOS Microprocessing Unit ... . . .. 127

CMOS Microcomputer Unit ... " '" 171 CMOS Microcomputer Unit . . . .. 202

CMOS Microprocessing Unit . , ... , . , ... , . . . .. 232

CMOS Microprocessing Unit . . . .. 277

Microprocessing with Clock and RAM ... , . . . .. 314

Microprocessing with Clock and RAM. . . .. 327

Microprocessing Unit. , . . . .. 340

Microprocessing Unit. ... , . . . .. 367

Microproccesing Unit. . . . .. 400

Microprocessing Unit. . . . .. 435

Network Processing Unit. . . .. 568

Microcontroller Unit . . . .. 697

Microcontroller Unit . . . .. 793

HD68000/HCOOO Microprocessor Unit ... 907

• Hitachi Sales Offices ... , . . . .. 992

• HITACHI

Hitachi America, Ltd .• Hitachi Plaza. 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 v

8/16-BIT MICROPROCESSOR DATA BOOK

Section One

General Information

• Quick Reference Guide

• Introduction of Packages

• Sockets

• Device Packing

• Reliability and Ouality Assurance

• Reliability lest Data of Microcomputer

• Program Development and Support System

• Device Availability

• HITACHI

QUICK REFERENCE GUIDE

• NMOS 8-BIT MICROPROCESSOR

HD6803 HD6809 HD6809E

Type No. HD6802 HD6802W

HD6803·1 HD68A09 HD68A09E

HD68B09 HD68B09E

1.0 (HD6803) 1.0 (HD6809) 1.0 (HD6B09E) Clock Frequency (MHz) 1.0 1.0 1.25 (HD680J.l) 1.5 (HD68A09) 1.5 (HD68A09E)

2.0 (HD68B09) 2D (HD68B09E)

Supply Voltage (V) 5.0 5.0 5.0 5.0 5.0

Operating Temperature'

-20-+75 -20-+75 0-+70 -20-+75 -20-+75

(oC)

RAM (byte) 128 256 128

- -

Oscillator Ves Ves Ves Ves

-

Package DP-40 DP-40 DP-40 DP·40 DP-40

01 nternal oscillator and RAM o Upward instruc· o The highest o Full software added to the H D6800 tion compatibil· version of the compatibil ity 032 byte RAM Battery backed ity with the HMCS6800 with the

up possible HD6BOO family HD6809

Features oOn·chip SCI o Powerful ad· oBus employ·

and timer dressing modes ment on time o Easy relocat· sharing basis

able/reentrant o External clock programming

MC6809 MC6B09E

Compatibility MC6802

-

MC6B03 MC68A09 MC68A09E

MC6BOJ.l MC68B09 MC6BB09E

• Wide Temperature Range 1-40-+8S"C) version is lVIil.ble.

~HITACHI

Hitachi America, Ltd.

0

Hitachi Plaza

0

2000 Sierra Point Pkwy.

0

Brisbane, CA 94005-1819 • (415) 589-8300 ix

Quick Reference Guide

• CMOS 8-BIT MICROPROCESSOR

HD6303R HD6303X HD6303Y

Type No. HD63A03R HD63A03X HD63A03Y

HD63B03Y

HD63B03R HD63B03X HD63C03Y

1.0 (HD6303R) 1.0 (HD6303X) 1.0 (HD6303Y)

Clock Frequency (MHz) 1.5 (HD63A03R) 1.5 (HD63A03X) 1.5 (HD63A03Y)

2.0 (HD63B03R) 2.0 (HD63B03X) 2.0 (HD63B03Y)

3.0 (HD63C03Y)

Supply Voltage (V) 5.0 5.0 5.0

Operating Temperature" (oC) 0-+70 0-+70 0-+70

RAM (byte) 12B 192 256

External Memory Expansion (byte) 65k 6Sk 6Sk

Package DP-40, FP-54 DP·64S, FP·BO, Dp·64S, FP-64,

CG-40, CP-52, CP-44 CP·68 CP-68

• On-chip timer and synchronous/asynchronous SCI Features • Upward instruction compatibility with the HD6BOO

• Low power consumption modes (sleep and standby)

HD6305X2 HD6305Y2 HD63B09/E

Type No. HD63A05X2 HD63A05Y2

HD63C09/E HD64180R/Z

HD63B05X2 HD63B05Y2

1.0 (HD6305X2) 1 .0 (HD6305Y2) 2.0 (HD63B09/E) 6.0 (HD64180R/Z-6)

Clock Frequency (MHz) 1.5 (HD63A05X2) 1 .5 (HD63A05Y2) 8.0 (HD64180R/Z-8)

2.0 (HD63B05X2) 2.0 (HD63B05Y2) 3.0 (HD63C09/E) 10.0 (HD64180R/Z-l0)

Supply Voltage (V) 5.0 5.0 5.0 5.0

Operating Temperature' (oG) 0- +70 0- +70 -20- + 75 -20- +75

RAM (byte) 128 256 -

-

External Memory

Expansion (byte) 16k 16k 65k 512k11M'

DP-40 DP-64S

Package DP-64S, FP-64 DP-64S, FP-64

CP-44 CP-68

FP-80

• Software compatibility • On-chip MMU, DMAC, with the HD6809/E synchronous/

• On-chip timer and synchronous SCI • Easy relocatable/ asynchronous SCI and timer

Features • Powerful bit manipulation instruction reentrant programming • Software compatibility

• Low power consumption modes (wait, • Flexible system with Z80/8080

stop and standby) expansion capabilities

• R version-68/63, 80xx

• Powerful addressing interface

mode • Z version-Z80 interface

~HITACHI

x Hitachi America, Ltd. • Hitachi Plaza. 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

Type No. HD641BOS

B.O (HD641 BOSLP-B) Clock Frequency (MHz)

100 (HD641 BOSLP-10)

Supply Voltage (V) 5.0

Operating Temperature' (0G) -20-+ 75

RAM (byte)

-

External Memory Expansion (byte) 1M

Package CP-84

• Software compatibility with

Features HD64180R/Z

• 2-Channel Senal Interface

·Wide Temperature Range (-40-+8SoC) version is available.

CP/M@isthe registered trade mark of Digitsl Research Inc,

Quick Reference Guide

HD6411BOX HD6431 BOX HD6471BOX

4.0 (HD6411BOX-4) 4 0 (HD6431 BOX-4) 4.0 (HD6471 BOX-4) 6 0 (HD6411BOX-6) 60 (HD6431BOX-6) 6.0 (HD6471BOX-6) S.O (HD6411S0X-SL) SO (HD6431S0X-SL) B.O (HD6471 BOX-SL)

5.0 5.0 5.0

-20-+ 75 -20-+ 75 -20-+ 75

512 512 512

1M 1M 1M

CP-90S, FP-80B, DP-90S, FP-80G, DP-90S, FP-BOB,

CP-84 CP-84 CP-84, CG-84

• Software

compatibility with • Software compatibility • Software compatibility HD64180R/Z with HD64180R/Z with HD64180R/Z

• No internal ROM • 16K byte Mask ROM • 16K byte PROM (Romless)

~HITACHI

Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589-8300 xi

Quick Reference Guide

• NMOS 16-BIT MICROPROCESSOR

Type No. HDS8000-8 HDS8000Y8 HDS8000P8 HD68000PSB HDS8000CP8

HDS8000-10 HD68000Yl0 HD68000-12 HD68000Y12

Clock Frequency (MHz) S.0(HDS8000·S) S.O(HDS8000Y-8) S.0(HDS80001!8) S.0(HDS8000PSS) S.0(HDS8000C~)

10.0(HDS8000-10) 10.0(HDS8000Y-l0 12.5(HDS8000·12) 12.5(HDS8000Y-12

Supply Voltage (V) 5.0

Operating Temperature tC) 0-+70

Power Dissipation (W) 1.5 (f = SMHz, SMHz, 10MHz), 0.9 (f = SMHz) 1.75 (f = 12.5 MHz)

Package DC-64 PGA-SS DP-S4 DP-64S CP-SS

Feature High performance MPU featuring 32-bit data processing function

Compatibility MCS8000LS MCS8000RS MCS8000PS MCSSOOOFNS

MCS8000LS MCS8000RS MCS8000PS MCS8000FNS

MCS8000LlO MCS8000Rl0 MCS8000LI2 MCS8000RI2

• CMOS 16-BIT MICROPROCESSOR

HDS8HCOOO-8 HDSSHCOOOY-8 HD68HCOOO~ HDSSHCOOOPS8 HDSSHCOOOCP-S

Type No. HDSSHCOOO-l0 HDSSHCOOO't(.10 HDSSHCOOOP10 HD68HCOOOPS-l0 HDSSHCOOOCP-l0 HDSSHCOOO-12 HDSSHCOOOY42 HDSSHCOOOP-12 HDSSHCOOOPSl2 HDS8HCOOOCItl2 Clock S.O(HDSSHCOOO-S ) S.O(HDSSHCOOO¥8 ) S.O(HDSSHCOOOPS ) S.O(HDSSHCOOOP98 ) S.O(HDSSHCOOOCPS ) Frequency 10.0(HDSSHCOOO-l0) 10.0(HDSSHCOOOY10) 10.0(HDSSHCOOOP-10) 10.0(HDSSHCOOOPS'l0) 10.0(HDSSHCOOOCItl0) (MHz) 12.5(HDSSHCOOO-12) 12.5(HDSSHCOOOYI2) 12.5(HDSSHCOOO~2) 12.5(HDSSHCOOOPS12) 12.5(HDSSHCOOO~ 2) Supply

Voltage 5.0

(V) Operating Tempera- ture (oC)

0-+70

Current 25 (f = S MHz)

Dissipa- 30 (f= 10 MHz)

tion (mA) 35 (f = 12.5 MHz)

Package DC-S4 PGA-SS DP-S4 DP-64S CP-SS

Feature High performance MPU featuring 32-bit data processing function

Compati· MCSSHCOOOLS MCSSHCOOORS MCSSHCOOOGS MCSSHCOOOFNS

bility MCSSHCOOOLlO MCSSHCOOOR10 MCSSHCOOOG10 MCSSHCOOOFN10

MCSSHCOOOL 12 MCSSHCOOOR12 MCSSHCOOOG 12 MCSSHCOOOFN 12

~HITACHI

xii Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

INTRODUCTION OF PACKAGES

Hitachi microcomputer devices include various types of package which meet a lot of requirements such as ever smaller, thinner and more versatile electric appliances. When selecting a package suitable for the customers' use, please refer to the following for Hitachi microcomputer packages.

multi· function types, applicable to each kind of mounting method. Also, plastic and ceramic materials are offered ac·

cording to use.

Fig. I shows the package classification according to the mounting types on the Printed Circuit Board (PCB) and the materials.

1. Package Classification

There are pin insertion types, surface mounting types and

Package ClaSSification

Pin Insertion Type

Su rface Mounting Type

Multl·functlon Type

Standard Outline

Shrink Outline

Flat Package

ChIP Carrier

EPROM on the Package Type

DIP; DUAL IN LINE PACKAGE S·DIP;SHRINK DUAL IN LINE PACKAGE PGA PIN GRID ARRAY

FLAT·DIP; FLAT DUAL IN LINE PACKAGE FLAT·QUIP. FLAT QUAD IN LINE PACKAGE CC CHIP CARRIER

SOP;SMALL OUTLINE PACKAGE FPP; FLAT PLASTIC PACKAGE PLCC; PLASTIC LEADED CHIP CARRIER LCC ; LEADLESS CHIP CARRIER

PlastiC DIP CaramtC DIP

Shrink Type PI .. tl~ DIP Shrink Type Ceramic DIP

Fig. 1 Package Classification according to the Mounting Type on the Printed Circuit Board and the Materials.

2. Type No. and Package Code Indication

Type No. of Hitachi microprocessor is followed by package material and outline specifications, as shown below. The package type used for each device is identified by code as follows, illus-

Type No. Indication

trated in the data sheet of each device.

When ordering, please write the package code beside the type number.

HDxxxx-P

(Note) The HD68000 with shrink type plastic DIP (DP-64S) has a dif- ferent type No. from other devices.

TypeNo.

HD68000PS8

~HITACHI

PackaA! Clanificatlon No IndICation : Ceramic DIP

P ; PI .. tlc DIP F ; FPP CP ; PLCC CG ; LCC

Y ; PGA U6·bit microcomputer device)

Hitachi America, Ltd. • Hitachi Plaza. 2000 Sierra Point Pkwy. • Brisbane, CA 94005·1819 • (415) 589·8300

Introduction of Packages

Package Code I ndication

I

DP-64S

2lUti!!J.

o ;DIP C;CC F ; FLAT

'--M-.tL.er-i.-'s---'I-N-um-be~r-Of-P-in"j

^{1 , o o . . . . , . j}

P ; Plastic S; S-DIP

G ; Glass Sealed ceramic C ;Ceramic

(Note) PGA packages of 16-bit microcomputer devices have a different indication.

Package Code Indication;

P G A -6 8

Date Code Indication

Assembly lot date code_

OA3

;(ur 0;1990

9;1999

~

H;Aug.

J;TPt.

M' Dec .

'tl!!!s.

1; 1st week 5' 5th week

~

• HITACHI

2 Hitachi America, Ltd .• Hitachi Plaza. 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589·8300

Introduction of Packages

3. PieD. Dimension .. Outline Table I according to the mounting method on the PCB.

Hitachi microprocessor employs the packages shown in Table 1 Package List

Method of Mounting Package Classification Package Matenal Package Code

Plastic DP-40

DP-64 Standard Outline (DIP)

Ceramic DC-64

Pin Insertion Type

S-DIP Plastic Dp·64S

Dp·90S Shnnk Outline

PGA Glass Sealed Ceramic PGA-68

FP·S4

Flat Package FLAT-QUIP (FPP) Plastic FP-64

FP-80 FP80B CP·44

Surface Mounting Type CP-S2

PLCC Plastic

CP·68

Chip-Carrier CP-84

LCC Glass Sealed Ceramic CG-40

CG-84

PluticDIP

Unit: mm(inch)

• DP-40

528(2079)

40 54.0ml'. (2 126m .. .) 21

~~ ~

.. ^;

~

(0047) ²⁰

~ ^~a~!~

(OiOQ±OOIO) ^2.54±02S (0019±0004) ^048±01

! ^5E a ~

^D'-IS' D . t . _

N

e

(D.DIDt'/;

~HITACHI

Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 3

Introduction of Packages

Unit: mm(inch)

• DP-64 82.04 (3.Z30)

83.ZZmax.(J,Z76max.)

64 33

I

^ZZ.86

• HITACHI

4 Hitachi

America. Ltd .• Hitachi Plaza. 2000 Sierra Point Pkwy .• Brisbane. CA 94005-1819 • (415) 589·8300

Introduction of Packages

I

Ceramic DIP

8 28

eDC-64 ₍₃₂₀₀₎ ^I

64 33

~

0 IF"""'"

i

_o

Shrink Type PI_tic DIP

eDP-648

576(2268) 64 58.6max.(2.301mal(~) rot,

,"nnn~

-

0

~ .wwwwwwwlz

(0039)

_ _ " 19.05 5 • ~ (0.750)

~~i!lil~ 'r----~

.nQ

~1

I; 1.778±0.25 0.48±0 10 II 55 -

O.2~!\"!il)

~±0010) ^(0019±00r- ~~ ^0'-15' lOOIO!' ' S

~HITACHI

Unit: mm(inch)

025~

(0010!8118l)

Unit: mm(inch)

Hitachi America, Ltd .• Hitachi Plaza. 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589-8300 5

Introduction of Packages

• DP-90S

r::::::::::::::::::~~~:~:~~~~:::::::::::::::::I~I1~l!

¹ _H

^{II (}

^{1.00.03 9) 45}

^~ _·E

^c

_{~ ~}

^~ _{22.86 (0.900) >}

~4~t~l; _.!:.=:il-;;-

_{E E·E}

-aA

_025.0.11

^II l

_II

~ 00." !:!'_~'!=I!.ll~*

=====

0.019_0.004)

~ ~ ~O""'~ (O.01~S811 .e

I

Pin Grid Array

• PGA·68

2642 (1.040)

s

0

.;

0

2UUO.45 (0.900 ± 0.0187)

.HITACHI

Unit: mm(inch)

6 Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

I

Flat Package

• FP-54

• FP-64

• FP-80

015±005 (0006 ± 0 002)

~HITACHI

Introduction of Packages

Unit: mm(inch)

Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 7

Introduction of Packages

• FP·80A

17 2±0 3(0 677±0 012) 14.0(0.551)

[60 41

Jj

_=I-~IHIIIIIDIIIIIIIIIIIIIIIIIIIIIIIIIII 40

~

^'"

^{I j}

2.90(0.114)max

c::

0.1 (0.004)

~ II (STAND OFF)

C>

'"

-H

::::

'"

'"

~" I ^'"

^C>

M

C>

-H

N

r-

U

(0

0.dQ+O]l5

II

.012±0.002)

• FP·80B

\D

C; d~

+1 ~ C) ' "

~ ~

de

~ C)

'of •

• 'of

o ~

:

+1

20

1<$1 0.13(0.OOS)~ (0.006 ± 0.002) ^0.15±0.OS

~HITACHI

8 Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

I

Plastic Leaded Chip Carrier

• CP-44

u;

39

0 40

0 28

0 +1 0 en

'"

44 0 1 0

N

0 +1

PI 11'1 6

...:

7 0.74(0.029)

• CP-52

20.07tO.12(0.790tO.005) 019.12 (00.753)

46 34

~ 47

0

0 +1 0 en ..., 52

~ N ^{1 0}

0 +1

...

0

0 7

N

,

... _-- ^. __ ^...

8

0.75(0.030)

'"

^o

II'I~

- 0

d +1 +10 11'10 11'1- N~ '0

15.50tO.50 0.610tO.020) '-0"0"."1 0=0". 0"'0-":4

33

21

'"

II'I~ o

_ 0

0+1 +1⁰

11'10 11'1"";

' 0 N~

~HITACHI

Introduction of Packages

Unit: mm(inch)

Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 9

Introduction of Packages

• CP-68

2515+012(099+0005)

- . - .

• CP-84

II>

o o

C>

+ _o en 1

75

• 84

N o + ¹

'"

N

o

'"

1

11

~

61

'"

o ~ o + en en ¹ 68

e

~ + o ¹

~

'"

N

1

9

024.20(00.953) 60

0

10

0.74(0.029)

3023+012(1 190+0005)

- . - .

029.28(01.153) 74

0

12 0.74(0.029)

44 43

~

~ 27 26

54 53

~

32

og

GO

N • . 0 0+1 +1", 0 ....

.. -

~e

'"

^o

","1

- 0 +10 0+1

" ' 0

~d N~

00.10 0.004

'"

o

",,,!

_ 0

c:i +1 +10 " , 0

"!:;i

N~

• HITACHI

Unit: mm(inch)

23.12±0.50 (0.910±0.020

10 Hitachi America, Ltd. • Hitachi Plaza. 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589-8300

I

Lead less Chip Carrier

• CG·40

D12.19±O.3 (O.480±O.012)

I b = = = = d

,1

^NS

Ii nnnnnnnnnn h

• CG·84

029.21 ±O.3S (01.1 SO±O.OlS)

0

0

)(

)(

..

.. E Eo>

I " l ' "

o~

..is.

~HITACHI

Introduction of Packages

~ ~

Unit: mm(inch)

Hitachi America, Ltd. • Hitachi Plaza. 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 11

Introduction of Packages

4. Mounting Method on Board

Lead pins of the package have surface treatment, such as solder coating or solder plating, to make them easy to mount on the PCB. The lead pins are connected to the package by eutectic solder. The following explains the common connecting method ofleads and precautions.

4.1 Mounting Method of Pin Insertion Type Package Insert lead. pins of the package into through·holes (usually about 4>0.8mm) on the PCB. Soak the lead part of the package in a wave solder tub.

Lead pins of the package are held by the through·holes.

Therefore, it is easy to handle the package through the process up to soldering, and easy to automate the soldering process.

When soldering the lead part of the package in the wave solder tub , be careful not to get the solder on the package, because the wave solder will damage it.

4.2 Mounting Method of Surface Mounting Type Package Apply the specified quantity of solder paste to the pattern on any printed board by the screen printing method, and put a package on it. The package is now temporarily fixed to the printed board by the surface tension of the paste. The solder paste melts when heated in a reflowing furnace, and the leads of the package and the pattern of the printed board are fIXed together by the surface tension of the melted solder and the self alignment.

The size of the pattern where the leads are a~tached, partly depending on paste material or furnace adjustment, should be

1.1 to 1.3 times the leads' width.

The temperature of the reflowing furnace depends on pack·

age material and also package types. Pig. 2 lists the adjustment of the reflowing furnace for FPP. Pre-heat the furnace to 150°C.

The s~rface temperature of the resin should be kept at 235°C max. for 10 minutes or less.

(1) The temperature of the leads should be kept at 260°C for 10 minutes or less.

(2) The temperature of the resin should be kept at 235°C for 10 minutes or less.

(3) Below is shown the temperature profile when soldering a package by the reflowing method.

t

!

! ~

Tlme---'

Figure 2 Reflowing Furnace Adjustment for FPP

Ensure good heater or temperature controls because the material of a plastic package is black epoxy-resin which damages easily. When an infrared heater is used, if the temperature is higher than the glass transition point of epoxy-resin (about 150°C), for a long time, the package may be damaged and the reliability lowered. Equalize the temperature inside and outside the packages by l~ssening the heat of the upper surface of the packages.

Leads of PPP may be easily bent under shipment or during handling and cannot be soldered onto the printed board. If they are, heat the bent leads again with a soldering iron to re- shape them.

Use a rosin flux when soldering. Don't use a chloric flux because the chlorine in the flux tends to remain on the leads and lower the reliability of the product.

Even if you use a rosin flux, remaining flux can cause the leads to deteriorate. Wash away flux from packages with alcohol, chlorothene or freon. But don't leave these solvents on the packages for a long time because the marking may disappear.

5. Marking

Hitachi trademark, product type No., etc. are printed on packages. Case I and Case II give examples of marks and Nos.

Case I applies to products which have only a standard type No.

Case II applies to products which have an old type No. and a standard type No.

~HITACHI

12 Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

Case I; Includes a standard type No.

'. 'mDB

(C)B DB809B

(d)

(]~ B~ ISJ

Case \I; Includes an old type No. and a standard type No.

(a) (b)

'. mOG

(e)

B D ^~ B ^{800 DB}

(d)

(]~B~ISJ

(c)

BDB800B

~HITACHI

Introduction of Packages

Mean ing of Each Mark (al Hitachi Trademark (bl Lot Code (el Standard Type No.

(dl Japan Mark (el Old Type No.

Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 13

SOCKETS FOR EVALUATING SURFACE AND THROUGH-HOLE MOUNT PACKAGES

1. SOCKET LIST

Thble I lists the sockets available on the market for evaluating the characterislics of surface and through-hole package devices. For details, please inquire directly to the socket manufacturer.

Table 1 IC Socket list

Package Type Package Code Socket Code Manufacturer Name

FP-S4 ICS1-0S44-S17-2 Yamaichi Denkl

FP-64 ICS1-0644-472-2 Yamaichi Denki

FPQ-64-1.0-08A Enplas

FP-64A ICS1-0644-692-3 Yamaichi Denki

QFP FPQ-64-0.8-01A Enplas

FP-80 ICS1-0804-394-2 Yamaichl Denki

FPQ-80-0.8-11 A Enplas

ICS1-0804-819-1 Yamaichi Denkl Kogyo

FP-80B FPQ-80-0.8-11 A Enplas

FPQ-80-0.8-13A Enplas

CP-44 ICS1-0444-400 Yamalchi Denkl Kogyo K.K.

CP-S2 ICS1-0S24-411 Yamaichi Denki Kogyo K.K.

PLCC CP-68 ICS1-0684-390 Yamaichl Denkl Kogyo K.K.

PLCC-68-1.27-02 Enplas

CP-84 PC 1-0840S0-003 Nepenthe

ICS1-0844-401-1 Yamaichi Denki Kogyo

DP-40 IC37NR-4006-G4 Yamaichl Denkl

DIP (Plastic)

DP-64 IC8620-6409-G4 Yamaichl Denkl Kogyo

IC86-6409

DP-64S IC7620-6407S-G4 Yamaichi Denki

DIP (Plastic, Shrink) IC38-6407S-G4 Yamalchi Denki

DP-90S IC121-9009-G4 Yamalchi Denki Kogyo

Dip (Ceramic) DC-64 IC8620-6409-G4 Yamaichi Denki Kogyo

PGA (Glass Sealed Ceramic) PC-68 PPS68-AG2D AUGAT

CG-40 240-S084-00-1102 TEXTOOL

LCC (Glass Sealed Ceramic) PC 1-0840S0-003 Nepenthe

CG-84 SHIM-0844-401-047 Nepenthe

ICS1-0844-401-1 Yamalchi Denkl Kogyo

~HITACHI

14

Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

DEVICE PACKING

1. SHIPPING CONTAINERS AND HANDLING 1.1 SHIPPING CONTAINER FORMS

Figures I and 2 illustrate the shipping container forms for ordinary Ie devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain magazines, trays, or tape reels, which the Ie devices are shipped in.

1 OUTER

BOX

Packing List

Plastic surface mount packages containing large chips can crack if they absorb moisture and are mounted by retlow soldering. These surface mount devices are packed with a moisture-proof material to prevent the packages from absorbing moisture during shipping and storage.

---"""";;;.,:;0..,

j_+-"":::'"

Carton tape (blue)

Label

2 INNER

BOX ~

_ _ _ _ _ _ _

^'

\_\"" _ _ _

^K--" ~_'

^Cardboard

\

^Carton

3

MAGAZINE,

TRAY, &

MaS-PACK

4 IC (LSI)

Label

Tr ...

Magazine

R

^{Product Tray}

Figure 1. Shipping Containers

_HITACHI

Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589-8300 15

Device Packing

1.2 NOTES ON HANDLING

(I) Handles the outer cardboard carton with care. Sudden drops or shocks can cause damage to the enclosed products. Be sure not to overstack the cartons.

(2) Prevent water leakage. Do not leave shipping contamers outside or store them in high-temperature, high-humidity areas.

(3) Handle the inner cartons with care. Dropping a box may dis- lodge a magazine stopper, allowing devices to slide out in which care their leads may be deformed. Dropping may also cause damage to cerdmic packages and cause leaks to air-tight seals.

The surface of transparent vinyl-chlonde magazines are treated with an antistatic coating to prevent static charge. Be aware of the following notes concerning this coatmg:

1.3 PARTIAL SHIPMENTS PACKING

~HITACHI

DIMENSION IN MM

WxHxL

250 x 250 x 500 250

x

225

x

550 175

x

150

x

550

* Materials or placement may vary.

• Water leakage WIll cause the anti-static material to peel off and lose it effectiveness.

• The anti-static material may become sticky in high- temperature, high-humidity environments.

• The anti-static material may warp over time; avoid storage beyond six months. Do not reuse the material.

• Note that the surface resistance of transparent magazines is less than I x 1010 Ohms, and the surface resistance of black magazines is less than I x 1!J6 Ohms.

• Store vinyl-chloride tmys between -25°C and +40°C. Both the shape and color may change in an environment above 55°C.

~PinkFoam*

/ (Antistatic)

I

Inner Box or

I

MOS Pack

Packing List*

Label (Bar Coded)*

DIMENSION IN INCHES

WxHxL

10

x

10

x

20 10

x

9

x

22

7

x

6

x 22

Figure 2. Partial Shipments

@HITACHI

1 6 Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

Device Packing

2. MOISTURE-PROOF (DRY PACK) PACKING AND HANDLING If a surface mount package is mounted with solder reflow after it has absorbed moisture, then package cracks may occur. In order to prevent moisture absorption during shipping or storage, the pack-

ages are encased m vacuum packed moisture-proof (dry pack) pack- ing material as shown in figure 3 The following sections describe how to handle this material.

Stopper MagaZine

Band

D

"-..- , / ; '

.t::. __ / <4 _ _ . /

Magazine

DIP or PLCC LSI

~ =-_.--- ^{'-"7 '-~}

^DeSiccant

Vapor-proof bag (containing aluminum foil)

Water vapor-proof packing~~A~========7~~ Label

Inner case

Product

!

^Tray

Carton

V !

Figure 3. Vacuum Packed MOisture-Proof (Dry Pack) Packing

~HITACHI

Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy • Brisbane, CA 94005-1819 • (415) 589-8300 17

Device Packing

---~---

2.1 SlORAGE METHOD:

Stonng packed res under lOappropnate condItIOns can cause de- terioratIOn m soldcrablhty and performance. HitachI recommends that products III vacuum packed mOIsture-proof (dry pack) packmg matenal be stored ^In tray boxed If thIs IS not possIble, packages should be stored under the followmg condItIOns:

• Temperature- 5 to 30°C

• Hurmdlty less than 60 % RH

p..,rts stored ^In unopened vacuum packed mOIsture-proof (dry pack) condllloll may r(mam solderable for three (3) to five (5) years.

2.2 HANDLING AFTER OPENING:

In order to prevent n.:-absorplIt.m alter openmg the mOIsture- proof material. store under the conditions h~ted above and retlow mount the poc kages wllhm onc week If thc packages mllst be placed Into ~toragc ag~lin after openmg. then seal 10 a new (non-mOi~ture cont:1mmatcd) SIlica gel (confIrm \'l/Jth blue-colored mdicator) and

~tore under the cnndltlons llstcd above Try to reseal In vacuum pack('d 1l100'-.illff'-prnnf (Jry pack) packing matcnal

3. PACKING SPECIFICATIONS FOR VARIOUS PACKAGES 3.1 PACKING SPECIFICATIONS for DIP Packages

---r---

Package Code illustration In Quantity (correspondIng '--- ---

diagram) fIgure 4(b} ICs/Magazrne IC/MOS Pack

DP-40 (A or B) 9 -

- DP-64

---

(DP·64S) (C) 8 -

Dp·90S

DC-64 (D) - ¹⁰

2.3 BAKING BEFORE SOLDER REFLOW:

Baking ^IS necessary If the mdicator of the sihca gel does not appear blue-colored throughout; more than one week has elapsed smce openrng (even stored under the conditlOns listed above); or the affixed label mdlcates bakmg IS requIred.

2.4 RECOMMENDED BAKING CONDITIONS:

Bakmg should be performed under the following condItions:

• Temperature. l25"C

• DuratIon: 16 to 24 hours

The magazmes, trays, and tape reels normally used for shIpment are not heat-proof. therefore contamers cannot be baked as shIpped.

DeVIces mu:;;t first be transferred into a heat-proof contamer Heat- proof magazInes and trays are currently under development.

Tray labelled as heat-proof can be used, however do not bake with the mOl sture-proof bag Sake on a level plane to prevent sliding.

Inner Box' DImenSions Magazlnes/lnner Box W x H x LIn mm. and (inches)

112.5 x 59.4 x 500 20

(4'/:, x 2% x 20) 75 x 59.4 x 500

12 (3 x 2% x 20)

N/A 80 x 16 x 240

(3% x % x 9%) FIgure 4(a). PackIng Specifications for DIP Packages '(see FIg 1, thIS section)

~HITACHI

18 Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300

Nnoll'1'llr.l,onplnl,ruN InftcMorOfthylentstllPper (II rl"

Nflh mllC"r~llon pIA~l1nl~d fillftrhlorlM'lh)ll'nt&tnPLIt'r (<<rIY)

Magazine board thickness: 0.8 ± 0.31111 Length: 500 ± 2 ...

17H.

~

Dimensional tolerance.

~W

±O.SlIIm

Illustration (A)

Ibrdchlnrtthylene ml.la-ne (or.n,,,,)

Magatlne board lhiekl\f>55: I.O±O,alllll Length: 495.± 311111

lI.rdpoly""renemIIUln"

(bl.d)

Device Packing

Nnn millar.llon pla_urlz....!

'lojt,hluro<'lhyl",,' 8Io l'l"'r Igray)

Clear

Magazine board thlcknes:.: 1 O±O.31111 Length: 495 1.. 311\.

(500 t3ra .. )

Illustration (6)

f---

^{240,0 mm}

-,,---1

[ If"

Black Foam Cardboard

(carbon treated) (Ffaday) ~

16'~.' iiiiiiiiiiiiiiiiiiii_, :

^4.0:mm

Pink' Foam Cardtfoard 1,01mm (anti-static) (Faraday)

Illustration (C) Illustration (0)

Figure 4(b), Packing Materials for DIP Packages

• HITACHI

Hitachi America, Ltd, • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 19

Device Packing

3.2 QFP AND LCC PACKING SPECIFICATION

Vmyl-Chlonde (dntl-~Iatlt charge tr~ated)

lIIustralion (A)t IllustratIon (B)t

illustration (c)t IllustratIon (0)*

illustration (E);

twlthout holes :twrth holes

.HITACHI

20 Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 .' (415) 589-8300

Device Packing

Package Code Illustration in Quantity Inner Box' Dimensions

Figure 5 IClTray Trays/Inner Box W x H x L in mm. (in.)

FP-54 (C or D) 147 x 70 x 325

50 10

(5% x 2% x 13)

FP-64 (C or D) 147 x 70 x 325

50 10

(5% x 2% x 13)

FP-64A (B) 147 x 70 x 325

50 10

(5% x 2% x 13)

FP-80 (C or D) 147 x 70 x 325

50 10

(5% x 2% x 13)

FP-80B D 50 147 x 70 x 325

10 (5% x 2% x 13)

147 x 70 x 325

CG-40 (A) 50 10

(5% x 2% x 13) Figure 5. QFP and LCC Packing Specifications and Materials '(see Fig. 1, this secllOn) 3.3 PACKAGE PACK SPECIFICATIONS

PLCC PACKING SPECIFICATIONS

c~,,, ... ,bI. PC V <>1,,»

~

^0:0'

c~.""

.. ",,

Magazine board Magazine board Magazine board

thickness: 0.8 ± 0.3 mm thickness: 1.1 ± 0.3 mm thickness: 0.8 ± 0.3 mm length: 495 ± 3 mm length: 495 ± 3 mm length: 495 ± 3 mm

20.1 13.~ 2i.tI.!i

~ h

^{13.~ r}

h

^{13.' r}

h

*~I~1

u

ili~l

^{.r I"': 0": ' (}

1I~1

^lrir-:~

IR.S 21.1 26.25

Dimensional tolerance: ± 0.5 mm Dimensional tolerance: ± 0.5 mm Dimensional tolerance: ± 0.5 mm

Illustration (A) Illustration (B) Illustration (C)

Package Code Illustration in Quantity Inner Box' Dimensions

Figure 6 ICs Magazine Magazines/Inner Box W x H x Lin mm. (in.)

CP-44 (A) 26 113 x 56.3 x 493.8

30 (4% x 2% x 19%)

CP-52 (B) 23 118.8 x 65.6 x 500

18 (4% x 2% x 20)

CP-68 (C) 18 28 118.8 x 65.6 x 493.8

(4% x 2% x 20)

CP-84 (D) 15

Figure 6. PLCC Packing Specifications and Materials '(see Fig. 1, this section)

~HITACHI

Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589·8300 21

Device Packing

4,0 PACKING LABELS

CUST PART

44444444444444444444

C

!ill!llililllll!1 I!IIII!I!I 1[111 11111 I!III 111!1 11111 II III 111!llillllll!II!!III!II!I!IIIIII!II!IIIIII!1 III!II!II IIII I$HITACHI

~ALPART 44444444444444444444 I

^{FRCW'l :}

! lillilil il'IIJlill!llll:li'I;li'II:I!"lil'llilill;lill:IIII:1Ii lilli'ltlllll:":II'IIII'11,'I:lli lill'I!llllil,I'I!11 ill'l i j ~~~~~~~~~~~~~~:~~~:~~~~:~~::~

i 1 Ii ; ; I Iii 'I ! I i ,I i r ^II !,' i' ; II iii' ; iii ~ ^{I ;} i i iii

;1

i! i

,I

i ^II

44444444444444444444444444444

II!: Ii! Ii:

I, ,t " " " 1 . , , 1,1" i :

1'1/ II/

1[, I

,III: i'l I, :, ;

I I, <, ' I

"11111/ " .'

" I , . · J II

I' I' III

III 1.11

!

:TO=

QUANTITY !,. 44444444444444444444444444444

Q ; !11!11 ",I:

;! ^{'I.. /} 1 Ii' 'I': ill,

1:1:1 ~;I 1111111111 ' !I Ill: ,I ;

I'lill'\:' I ! ,! ^,I Ii II : 'I'I Iii 1:1' ,:!,

i

ill~ I : 4444444 ER , ;

! 4444-1444444-14444444-144444444-1 ":4444-14-1444444-14444444-1-1-1444-1 444-144444444444444444444-14444

'I

'i-.

if ill, I! :!I '

I! III

1.111: !! '

i

44-14444-1444-1444-144444-14444444

~~Cf~RGE LO,

444444444444444

:~~TE CODE

444444 '!'jll:!i.lillllilillililliltll:'i'I'l'i'lilillil:.'llilillilill:lrli'lillilil'llll!I'i'lij'ililli',iI'l:lill:liIIII!

^I

::;111: :

iih:!n [: !I:.!lill iii, '11 iii! ill! il ⁱ it: ii 1 iJ ^llh!! ill:

¹¹

!.I i ! _! i _,II 11,1111

_II

_:II,

!I"II!I

11:111111 I!I!IIIIIII lilll 1'111111111111

I! "I ," I, ! II 'I ; I I

L , i

CUST

p,o, 44444444444444444444 lsox mum

K

Illmlil:11

. , . ,I , I

illl!III~li~!li 1:~li~[illl!~liJlilll!~IIIIII~lllillli~11i IIII!~ "I, ,.

,I ..

"I '" " ".

I, ,,' I, ,

I ,.,' ,

II "I . " ,,' ,. "I

II , 14444444444

Figure 7. Outer Box Label Figures I and 2 on pages 13 and 14 show the outer box label

placement on the end and left adjacent side of the box, Placement is within one-half inch ('12") of the box's corner. Figures I and 2 show the inner box label placement is on the end of the inner box. A packing list is alixed to the left adjacent side of the outer box's end

and next to the bar code label.

PIN: _ _ _ _ _ _ _

QTY: _ _ _ _ _ _ _ Date Code: - _ _ _ _ _

Figure 8. Inner Box Label

@>HITACHI

22 Hitachi America, Ltd. • Hitachi Plaza. 2000 Sierra Point Pkwy .• Brisbane, CA 94005·1819 • (415) 589·8300

RELIABILITY AND QUALITY ASSURANCE

1. VIEWS ON QUALITY AND RELIABILITY

Basic views on quality in Hitachi are to meet individual user's purchase purpose and quality required, and to be at the satisfied quality level considering general marketability. Quality required by users is specifically clear if the contract specifica·

tion is provided. If not, quality required is not always defmite.

In both cases, efforts are made to assure the reliability so that semiconductor devices delivered can perform their ability in actual operating circumstances. To realize such qUality in manufacturing process, the key points should be to establish quality control system in the process and to enhance morale for quality.

In addition, quality required by users on semiconductor devices is going toward higher level

as

performance of elec·

tronic system in the market is going toward higher one and is expanding size and application fields. To cover the situation, actual bases Hitachi is performing is as follows;

(1) Build the reliability in design at the stage of new product development.

(2) Build the quality at the sources of manufacturing process.

(3) Execute the harder inspection and reliability confmnation of fmal products.

(4) Make quality level higher with field data feed back.

(5) Cooperate with research laboratories for higher quality and reliability.

With the views and methods mentioned above, utmost efforts

are

made for users' requirements.

2. RELIABILITY DESIGN OF SEMICONDUCTOR DEVICES

2.1 Reliability Targets

Reliability target is the important factor in manufacture and sales as well as performance and price. It is not practical to rate reliability target with failure rate at the certain common test condition. The reliability target is determined correspond·

ing to character of equipments taking design, manufacture, irmer process quality control, screening and test method, etc.

into consideration, and considering operating circumstances of equipments the semiconductor device' used in, reliability target of system, derating applied in design, operating condition, maintenance, etc.

2.2 Reliability DeSign

To achieve the reliability required based on reliability targets, timely sude and execution of design standardization, device design (including process design, structure design), design review, reliability test are essential.

(1) Design Standardization

Establishment of design rule, and standardization of parts, material and process are necessary. As for design rule, critical items on quality a1id reliability are always studied at circuit design, device design, layout design, etc. Therefore, as long as standardized process, material, etc. are used, reliability risk is extremely small even in new development devices, only except for in the case special requirements in function needed.

(2) Device Design

It is important for device design to consider total balance of process design, structure design, circuit and layout design.

Especially in the case new process and new material are em·

ployed, technical study is deeply executed prior to device

development.

(3) Reliability Evaluation by Test Site

Test site is sometimes called Test Pattern. It is useful method for design and process reliability evaluation of Ie and LSI which have complicated functions.

I. Purposes of Test Site are as follows;

• Making clear about fundamental failure mode

• Analysis of relation between failure mode and manufac·

turing process condition

• Search for failure mechanism analysis

• Establishment of QC point in manufacturing 2. Effectiveness of evaluation by Test Site are as follows;

• Common fundamental failure mode and failure mecha·

nism in devices can be evaluated.

• Factors dominating failure mode can be picked up, and comparison can be made with process having been experi·

enced in field.

• Able to analyze relation between failure causes and manu- facturing factors.

• Easy to run tests.

etc.

2.3 Design Review

Design review is organized method to confmn that design satisfies the performance required including users' and design work follows the specified ways, and whether or not technical improved items accumulated in test data of individual major fields and field data are effectively built in. In addition, from the standpoint of enhancement of competitive power of prod- ucts, the major purpose of design review is to ensure quality and reliability of the products. In Hitachi, design review is performed from the planning stage for new products and even for design changed products. Items discussed and determined at design review are as follows;

(1) Description of the products based on specified design documents.

(2) From the standpoint of specialty of individual participants, design documents are studied, and if unclear matter is found, sub-program of calculation, experiments, investiga- tion, etc. will be carried out.

(3) Determine 'contents of reliability and methods, etc. based on design document and drawing.

(4) Check process ability of manufactUring line to achieve design goal.

(5) Discussion about preparation for production.

(6) Planning and execution of sub-programs for design change proposed by individual specialist, and for tests, experiments and calculation to confmn the design change.

(7) Reference of past failure experiences with similar devices, confmnatlon of method to prevent them, and planning and execution of test program for confmnation of them.

These studies and decision~

are

made using check lists made individually depending on the objects.

3. QUALITY ASSURANCE SYSTEM OF SEMICONDUCTOR DEVICES

3.1 Activity of Quality Assurance

General views of overall quality assurance in Hitachi are as follows;

(1) Problems in individual process should be solved in the

~HITACHI

Hitachi America, Ltd. • Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819 • (415) 589-8300 23

Reliability and Quality Assurance

process. Therefore, at final product stage, the. potential failure factors have been already removed.

(2) Feedback of information should be made to ensure satisfied level of process ability.

(3) To assure reliability required as an result of the things mentioned above is the purpose of quality assurance.

The followings are regarding device design, quality approval at mass production, inner process quality control, product inspection and reliability tests.

3.2 Quality Approval

To ensure quality and reliability required, quality approval is carried out at trial production stage of device design and mass production stage based on reliability design described at section 2.

The views on quality approval are as follows;

(I) The third party performs approval objectively from the standpoint of customers.

(2) Fully consider past failure experiences and information from field.

(3) Approval is needed for design change and work change.

(4) Intensive approval is executed on parts material and pro·

cess.

(5) Study process ability and fluctuation factor, and set up control points at mass production stage.

Considering the views mentioned above, quality approval shown in Fig. I is performed.

3.3 Quality and Reliability Control at Mass Production For quality assurance of products in mass production, quality control is executed with organic division of functions

in manufacturing department, quality assurance department, which are major, and other departments related. The total function flow is shown in Fig. 2. The main I'oiots are described below.

3.3.1 Quality Control of Pam and Material

As the performance and the reliability of semiconductor devices are getting higher, importance is increasing in quality control of material and parts, which are crystal, lead frame, fine wire for wire bonding, package, to build products, and materials needed in manufacturing process, which are mask pattern and chemicals. Besides quality approval on parts and matenals stated in section 3.2, the incoming inspection is, also, key in quality control of parts and materials. The in·

coming inspection is performed based on incoming inspection specification following purchase specification and drawing, and sampling inspection is executed based on MIL·STD·' 050 mainly.

The other activities of quality assurance are as follows:

(I) Outside Vendor Technical Information Meeting

(2) Approval on outside vendors, and guidance of outside vendors

(3) PhYSical chemical analysis and test

The typical check points of parts and materials are shown in Table I.

3.3.2 Inner Process Quality Control

Inner process quality control is performing very important function in quality assurance of semiconductor devices. The following is description about control of semi·fmal products, final products, manufacturing facilities, measuring equipments,

Step Contents Purpose

I

^,Target SpeCification

^I I

DeSign Re'flew

I

t

loesi9n ~;riaIS.

P.;rt.]

Characteristics of Matenal and Confirmation of

Tnal Parts Charactenstics and

Production App~oval ~ Appearance Reliability of Matenals

Dimension and Parts

Heat ReSistance Mechanical Electrical Others

llCharacteristics Approval Electrical Confirmation of Target

Characteristics Spec. Mainly about

Function Electrical Charactenstlcs

Voltage Current Temperature Others

Appearance, DimenSion

1~lty Appr~v.1 (1) Reliability Test Confirmation of Quality

life Test and Reliability In DeSign

Thermal Stress Moisture ReSIstance Mechanical Stress Others l~lity APJ>roval (21

- : 1 -

Reliability Test

J

Confirmation of Quality

=r:--

Process Check same a~ and Reliability In Mass

QualIty Approval (11 Production

Mas!i

Figure 1 Flow Chart of Quality Approval

~HITACHI

24 Hitachi America, Ltd .• Hitachi Plaza • 2000 Sierra Point Pkwy. • Brisbane, CA 94005-1819· (415) 589·8300

Reliability and Quality Assurance

circumstances and sub-materials. The quality control in the manufacturing process is shown in Fig. 3 corresponding to the manufacturing process.

measures

• Transmission of information about quality

(2) Quality Control of Manufacturing Facilities and Measuring Equipment

(1) Quality Control of Semi-fmal Products and Final Products Potential failure factors of semiconductor devices should be removed preventively in manufacturing process. To achieve it, check points are set-up in each process, and products which have potential failure factor are not transfer to the next process.

Especially, for high reliability semiconductor devices, manu- facturing line is rigidly selected, and the quality control in the manufactUring process is tightly executed - rigid check in each process and each lot, 100% inspection in appropriate ways to remove failure factor caused by manufacturing fluctuation, and execution of screening needed, such as high temperature aging and temperature cycling. Contents of inner process quality control are as follows;

Equipments for manufacturing semiconductor devices have been developing extraordinarily with necessary high perform- ance devices and improvement of production, and are important factors to determine quality and reliability. In Hitachi, auto- matization of manufacturing equipments are promoted to im- prove manufacturing fluctuation, and controls are made to maintain proper operation of high performance equipments and perform the proper function. As for maintenance inspection for quality control, there are daily inspection which is perform- ed daily based on specification related, and periodical inspection which is performed periodically. At the inspection, inspection points listed in the specification are checked one by one not to make any omission. As for adjustment and maintenance of measuring equipments, maintenance number, specification are checked one by one to maintain and improve quality.

• Condition control on individual equipments and workers, and sampling check of semifmal products.

• Proposal and carrying-out improvement of work

• Education of workers

• Maintenance and improvement of yield

(3) Quality Control of Manufacturing Circumstances and Sub- materials

• Picking-up of quality problems, and execution of counter- Quality and reliability of semiconductor device is highly

Products

Process Quality Control

Inspection on Matenal and Parts for Semiconductor Devices

ManufactUring Equipment, Environment, Sub·material, Worker Control

I nner Process Quality Control

l(){)1)i1i. Inspection on Appearance and Electrical Characteristl~

Sampling Inspection on Appearance and Electrical Characteristics

Reliability Test

r - - - , : Quality Information I

I Claim :

I field Experience : General Quality

Information I

L _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ .J

Method

Lot Sampling, Confirmation of Quality Level

Confirmation of Quality Level

Lot Sampling, Confirmation of Quality Level

Testing, Inspection

Lot Sampl ing

Confirmation of Quality Level, Lot Samplmg

Feedback of Information

Figure 2 Flow Chart of Quality Control in Manufacturing Process

~HITACHI

Hitachi America, Ltd .• Hitachi Plaza· 2000 Sierra Point Pkwy • Brisbane, CA 94005-1819 • (415) 589-8300 25

Reliability and Quality Assurance

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affected by manufacturing process. Therefore, the controls of manufacturing circumstances - temperature, humidity, dust - and the control of sub materials - gas, pure water - used in manufacturing process are intensively executed. Dust control is described in more detail below.

Dust control is essential to realize higher integration and higher reliability of devices. In Hitachi, maintenance and im- provement of cleanness in manufacturing site are executed with paying intensive attention on buildings, facilities, air- conditioning systems, materials delivered-in, clothes, work, etc., and periodical inspection on floating dust in room, falling dusts and dirtiness of floor.

3.3_3 Final Product Inspection and Reliability Assurance (I) Final Product Inspection

Lot inspection is done by quality assurance department for products which were judged as good products in 100% test, which is fmal process in manufacturing department. Though 100% of good products is expected, sampling inspection is executed to prevent mixture of failed products by mistake of work, etc. The inspection is executed not only to confIrm that the products meet users' requirement, but to consider potential factors. Lot inspection is executed based on MIL-STD-IOSD.

(2) Reliability Assurance Tests

To assure reliability of semiconductor devices, periodical reliability tests and reliability tests on individual manufacturing lot required by user are performed.

Table 1 Quality Control Check Points of Material and Parts (Example)

Material. Important

Point for Check Parts Control Items

Appearance Damage and Contamina- tion on Surface

Wafer Dimension Flatness

Sheet Resistance Resistance Defect Density Defect Numbers Crystal Axis

Appearance Defect Numbers. Scratch

Mask Dimension Dimension Level

Resistoration

Gradation Uniformity of Gradation

Fine Appearance Contamination. Scratch.

Wire for Bend, Twist

Wire Dimension

Bonding Purity Purity Level

Elongation Ratio Mechanical Strength Appearance Contamination, Scratch Dimension Dimension Level Processing

Frame Accuracy

Plating Bondability. Solderability Mounting Heat Resistance

Characteristics

Appearance Contamination, Scratch Dimension Dimension Level Leak Resistance Airtightness

Plating Bondability. Solderability

Ceramic Mounting Heat Resistance

Package Characteristics Electrical

Characteristics

Mechanical Mechanical Strength Strength

Composition Characteristics of Plastic Material Electrical

Characteristics Plastic Thermal

Characteristics

Molding Molding Performance

Performance

Mounting Mounting Characteristics Characteristics

$HITACHI

26 Hitachi America, Ltd. • Hitachi Plaza. 2000 Sierra Point Pkwy .• Brisbane, CA 94005-1819 • (415) 589-8300