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On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

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Academic year: 2021

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Figure

Fig. 1. (a) Optical microscopy image showing a global view of the distribution of b-Sn dendrites and (b) SEM micrograph showing the microstructures near the interface of bulk solder and Cu substrate of a SAC405/Cu solder joint.
Fig. 3. Geometry of the soldered TDCB specimen designed and employed in the fracture tests.
Fig. 4. Stress–strain curves obtained from shear tests of SAC405/
Fig. 6. Optical microscopy image of TDCB solder joint during the fracture test performed at a displacement rate of 0.0035 mm s 1 , showing the development of plastic wrinkles in the bulk solder.
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