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Design for reliability applied to RF-MEMS devices and circuits issued from different TRL environments

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Academic year: 2021

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Figure

Figure 1: Description of the studied fabrication process in the TRL classification [3]
Table 1-1: Summary of possible solutions to main reliability issues in RF-MEMS [10]
Fig. 1-6: Image of the MEMS+BIST (top-left) and block diagram of intelligent CMOS control circuit (top-
Fig. 1-22: Weibull curve for Radant MEMS [11]. Benchmark 4b is the evolution of benchmark 3
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