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Measurements and quantitative model for edge influence on bulk resistance for circular semiconductor samples
J.J. Marchand, G. Chen, P. Pinard
To cite this version:
J.J. Marchand, G. Chen, P. Pinard. Measurements and quantitative model for edge influence on bulk
resistance for circular semiconductor samples. Revue de Physique Appliquée, Société française de
physique / EDP, 1987, 22 (1), pp.71-75. �10.1051/rphysap:0198700220107100�. �jpa-00245517�
Laboratoire de
Physique
de la Matière(associé
auC.N.R.S.),
Institut National des SciencesAppliquées
de Lyon, 20, avenue Albert Einstein, 69621 Villeurbanne Cedex, France(Reçu
le 28 juillet 1986, révisé le 16septembre,
accepté le 22septembre 1986)
Résumé. 2014
Lorsqu’on
étudie un composant ou un échantillon comportant deux contactsélectriques,
il intervienttoujours
une résistance due au volume. En fait, celle-cidépend
de lagéométrie
et des effets de bords car les échantillons sont de dimension finie. Les études effectuées par le passé sont basées sur deshypothèses théoriques,
desapproximations mathématiques
et n’ont pas vraiment été vérifiéesexpérimentalement :
ces formulations ne sont pas réellement utilisablesquantitativement.
Apartir
de mesures depotentiels
sur des échantillons circulaires, nous présentons un modèle donnant une formulationquantitative
des effets de bords, lelong
de l’axe reliant les deux contacts,qui
est en bon accord avec les résultatsexpérimentaux.
Nous calculons ensuite l’influence des effets de bords sur la résistance attribuée au volume.Abstract. 2014 The
study
of any two terminal device orsample always
involves the presence of a bulk resistance. In fact,this resistance
depends
on the geometry and onedge
effects due to the finite size ofsamples.
The former studies arebased upon theoretical
hypotheses,
mathematicalapproximations
and have not beenfully
checkedexperimentally :
these formulations are not really usable
quantitatively. Starting
frompotential
measurements on circular samples, we present a model foredge
effectsgiving
aquantitative
formulation,along
the contacts axis, that fits well theexperimental
results. Then, we calculate theedge
effect influence on bulk resistance.1. Introduction.
When
studying
any two terminal device orsample, everybody
is more or less concemed with the bulkresistance. In
fact,
this resistancedepends
on thegeometry and not
only,
inplanar technology
forexample,
on the distance between the two electrical contacts. If contacts are far from theedges
ofsample (let’s
say an infinite dimensionsample),
the formulation isquite
well known and theonly remaining
factor is thethickness of the semiconductor
[1, 2]
whenresistivity
isuniform. For finite size
sample, peoples
consider pure mathematicalgeometry
cases[1],
or nearer toexperi-
ment cases like circular or square devices
[3, 4].
How-ever, these studies are based upon theoretical
hypothes-
es, mathematical
approximations,
and have not been(*) Visitingscholar
at Laboratoire dePhysique
de la Matière, from Nanjing Aeronautical Institute,Peoples Repu-
blic of China.
(**)
This work is related to a C.N.R.S. contract(ATP
n°
2216).
checked
experimentally.
These formulations are notreally
usablequantitatively
forexperimental
cases. Forexample, Laplume [3]
concludes that for circular samp-les, edge
effects due to finite size arenegligible
whileour
experiments
prove it is not.Starting
frompotential
measurements on circular
samples,
wepresent
anexperimental-analog
model thatgives
thequantitative
formulation for
edge
effects. This paper deals first with thedescription
of thesamples
and then with thetechnique
used toget
rid of ohmic contacts influence.Starting
from the theoretical(infinite) formulation,
we find the necessary modifications fortaking
into accountthe
edge
effects and show howthey modify
the bulkresistance.
2.
Experimental procedure.
Samples
are 2 inch diameter silicon wafers(p type)
withtwo ohmic contacts, as shown in
figure
1. Ohmiccontacts are 2 mm diameter
evaporated
aluminiumdisks annealed at 400 °C for half an hour. Their characteristics are
presented
in table I.Article published online by EDP Sciences and available at http://dx.doi.org/10.1051/rphysap:0198700220107100
72
Fig.
1. -Geometry
of samples. Silicon wafer with 2 ohmic contacts(1
and4).
Table I.
in which :
da
and e : as defined infigure
1f
: thickness of the wafers(0.3
mm for allcases)
1 : current
injected (0.2
mA for all thesamples)
p : semiconductor
resistivity
C = 4
03C0 f/03C1I :
constantindependent
ongeometry, intervening
as well for infinite size orfinite size wafers.
Electrical contacts are made of
gold
wires stuckby
the means of silver
paint.
Atungsten
carbide needle is used to measurepotentials everywhere
on thesample.
The measurement network is shown in
figure
2. Wefirst set the 1 kil
potentiometer
in series with 180 kfl resistors in order toget VPl
=VP/2 (accuracy
betterthan 1
%).
Then thetungsten
carbide needle isput right
in the middle of the
sample (x
=0, y
=0)
and we tunethe 1 kfl variable resistor until the
high input impe-
dance
(>
100Mfl)
millivoltmetermeasuring
Vgives
zero
reading.
Weget
in such a way the real electricalzero
because,
with or withoutedge effects,
thegeomet-
ry is so that the
voltage
at x = 0 isjust
half the totalvoltage drop
across terminals 1 and 4 if ohmic contactsare
perfect (zero resistance). Consequently,
theequilib-
rium of the
bridge
means that the difference betweenFig. 2. - Measurement
technique.
Ohmic contacts 1 and 4are
compensated by high
impedance Wheatstone bridge.the two ohmic contacts is zero, and that the ohmic contact resistances won’t intervene anymore in measurements. The 10 ka series resistors whose value is much greater than ohmic contacts ones insure a very low error if the ohmic contacts vary.
3.
Comparison
of results with theoretical noedge
effectcase
along x
axis. For an infinite sizesample,
that ise = oo in
figure
1, the formulation forpotential Vt
is[2] :
The finite dimension of the
sample
means thatcurrent streamlines will be forced into the bulk. The main
compression
isalong
the x axisand,
to compare results to theoretical case, we first of all calculated what should bed,
the new value ofdo,
so thatequation (1)
fits
experimental
results. Results are shown infigure
3for
samples
1 and 4. We can concludethat,
thehigher
isx, the lower is the difference
between do
and d.So,
forhigh
values of x, thecompression
effect due toedge
effects is less and goes down to zero when x =
do.
Fig.
3. - Twoexamples
of thecomparison
of d calculated to fitexperimental
data(with edge effect) with do along
the xaxis.
The finite size
sample
iscomparable
to the infiniteone whose electric field has been modified
everywhere
so that we get the
equivalent
of all the streamlinespushed
inside thesample
in order to have the total current inside this finite area.So,
the main effect ofedge
limitations is to increase the currentdensity,
andconsequently
the electricfield,
for any xposition.
Thisis shown
by experimental
d(cf. Fig. 3)
which is lowerthan
do
anddFtx0/dd0
0. The absolute value ofdFtx0/dd0
increases versus the field and thechange
ofthe theoretical field and
consequently
ofdo
due toedge
effects will be lower when the field is
higher.
We shallconsider,
in a firstapproach,
that ddepends
on1/Ftx0.
Since1/ FtxO is proportional
tod20 - x2,
we havefitted
d,
as a function ofx2
with apolynomial
andcomparing
to well knownseries,
it turned out that thelaw was
exponential. Figure
4 shows thisexponential
variation for the four
samples.
Fig.
4. - The variation of d is anexponential
whose exponent is inverselyproportional
to the electric field calculated without any edge effect(for
which d =do).
However, the
compression
of current streamlines is relative to the local electric field ascompared
to the lessstrong
one, that is to :But from
figure 3,
we know that d tends todo
whenx =
do,
that is forFtx0 reaching «
infinite value ». Fromdo
logical
to think it willdepend
on a ratio of twoparameters associated with the
edge
effect. This ratio could bee/do
ordole. Since, physically,
we musthave
a finite solution when e =
0,
we choosee/do
as theparameter. From these last comments, one can suppose that B is
proportional
to anexponential
ofe/do
ofcourse with a
negative
exponent. We show infigure
5Fig.
5. - First attempt to find a formulationrelating
thedependence
on the electric field to theedge
effect characteris- tic parametere/do.
the
plot
of In B versuseld..
This curve has beenfitted, by
the means of the least squaremethod,
to aparabola.
We get :
The term in the
parentheses
looks very much like(1+ e/2d0)2.
We haveplotted,
infigure 6,
ln Bversus this new
edge
effectparameter.
This fit is verygood
and the linearregression gives finally :
with a correlation factor
equal
to 0.9985.So,
we have :This last relation
gives
then the solution for theedge
effect
along
the x axis. Theprocedure
is thefoflowing :
2022 calculate B from
equation (8)
74
Fig.
6. -Representation
of the final formulation used to relate the electric field to theedge
effect characteristic parametere/do.
2022
put
this value of B inequation (5)
toget
d2022 then the use of
equation (1), replacing do by
dgives
thepotential
withedge
effect( Ve ) .
We have
compared
theexperimental
data to thecalculations issued from our model. This one agrees
pretty
well with theexperiment.
The differencesalong
the x axis are less than 2
%,
for all thesamples
whenx/da
isgreater
than 0.4. Infact,
this covers a great partof
sample
surface and issatisfactory
for conditions involved whencalculating
the bulk resistance for the two contact geometry.Fig.
7. -Representation
of current stramline paths interven-ing
in bulk resistance calculation.Fig.
8. - Resistance of the bulk, without anyedge
effects, forthe
region
locatedfrom - xl
to xl.5. Bulk resistance with
edge
effects.When we consider the two ohmic contact
geometry
offigure 1,
the current streamlines distribution isqualita- tively
the one shown infigure
7.So,
theequivalent
Fig.
9. - Bulk resistance withedge
effects ascompared
to theone without any
edge
effects.streamline
paths
in the bulk outside ohmic contacts.In order to show the influence of
edge
effects on thebulk
resistance,
we calculateRBl
without anyedge
effect (RB1t)
and withedge
effect(RB1e).
For thebulk
extending from - xl
to xl, we get fromequation (1) :
and
measurements,
quantitative edge
In this paper, we present an
analog-experimental
solution for the x axis
(axis
of the two ohmiccontacts)
that agrees very well with
experimental
data.We have used our formulation to calculate the
equivalent
bulk resistance in the two contactgeometry.
The effect of
edges
is then to increase this resistance and this could be of someimportance
whenstudying
barriers like
grain
boundaries. Ourquantitative
modelis then the very
specific
tool to be used.We think
that, physically,
the 0.932 constant inequation (8) ought
to be 1. We intend to extend ourmodel in order to have the solution over all the
sample.
Then the many more data involved should
probably
enable us to get an even more
precise
formulation forequation (8). Finally,
our formulation combined with Valdes[1]
calculations for thickness influencegives
thesolution for different thickness circular
samples.
References
[1]
VALDES, L. B.,Resistivity
measurements on Ger- maniumfor
transistors, Proc. I.R.E., p. 420-427,1954.
[2]
LEGROS, R., Les semiconducteurs. Tome 1(Ed.
Eyrol-les),
1974.[3]
LAPLUME, J., Basesthéoriques
de la mesure de larésistivité et de la constante de Hall par la méthode des pointes. L’Onde
Electrique.
XXXV, n° 335
(1955)
113-125.[4]
WIEDER, H., Electrical and galvanometric measure-ments on thin films and