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Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes

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Academic year: 2021

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Figure

Figure 2.7:  Sample  array on metal  level  two of GA303  mask
Figure  2.11:  Profilometer scan  of large  feature  array  after  the  bulk copper and the bamrer  are  completely  cleared  on  wafer
Figure  3.13:  Profilometer  scans  of two regular arrays,  showing  the density  effect on erosion:
Figure 3.22:  Amount of copper removed  and average  removal  rate for experiment  #4
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