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Figure 7. Word Count and Address Register Command Codes PROGRAMMING

Dans le document LITERATURE In addition to the product line (Page 111-116)

The 8237A will accept programming from the host proc-essor any time that HLDA is inactive; this is true even if HRQ ,is active, The responsibility of the host is to assure that programming and HLDA are mutually exclusive.

Note that a problem can occur if a DMA request occurs, on an unmasked channel while the 8237A is being pro·

grammed, For instance, the CPU may be starting to reprogram the two byte Address register of channel 1 when channel 1 receives a DMA request. If the 8237 A is enabled (bit 2 in the command register is 0) and channel 1 is unmaSked, a DMA service will occur after only one byte of the Address register has been reprogrammed_

This can be avoided by disablin'g the controller (setting bit 2 in the command register) or masking the channel before programming any other registers. Once the pro-gramming is complete, the controller can be enabled/un·

masked,

After power·up it is suggested that all internal locations, especially the Mode registers, be loaded with some

8237 A/8237

~4/8237

A·5

APPLICATION INFORMATION

Figure 8 shows a convenient method for conflguril1g a DMA system with the 8237 A controller and an 8080AI 808.5AH microprocessor system. The multi mode DMA controller issues a HRQ to the processor whenever there is at least one valid DMA request from a peripheral device. When the processor replies with a HLDA signal, the 8237 A takes control of the address bus, the data bus and the cOl]trol bus. The address for the first transfer

operation comes out in two bytes - the least signifi-cant 8 bits on the eight address outpufs and the most significant 8 bits on the data bus_ The contents of the data bus are then latched into the 8282 8-bit latch to complete the full 16 b,its of the address bus. The 8282 is a high speed, 8-blt, three-state latch in a 2().pln package.

After the Initial transfer takes place, the latch is updated only after a carry or borrow Is generated in the least sig-nificant address byte. Four DMA channels are provided when one 8237A is used.

ADDRESS BUS AO-A15

)

AO-A15 BUSEN

HLDA HLDA

HOLD HRQ,

CPU CLOCK RESET MEMR MEMW

iIDi iOW

DBO-DB7

...

.... ~

....

....

i"--I - -

-"

I

....

I

...

AEN AO-A3 A4-A7

cs

ADSTB

8237A

.., ..,

l-

iI i 8

l2

w

~

~ gj I~ w a: u

..

u a:

" "

I ) f14

,

SYSTEM DATA BUS

Figure 8_ 8237A System Interface 2-96

DBO-DB7

y

A8-A15

~ 8282 STB

8·BIT LATCH

....

i"--,t -.l\

,

r

l~'

BUS

.... ~

r

)

AFN·OO789D

intJ

8237A/8237~4/8237~

ABSOLUTE MAXIMUM RATINGS·

AmblentTemperature under Bias ••••••••• O'C to 70'C Storage Temperature ••••••••••••• -55'Cto + 150'C Voltage on any Pin with

Respectto Ground •••••••••••••••••••• - 0.5 to 7V Power Dissipation •••••••••••••••••••••••• : 1.5 Watt

'NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is

a

stress rating only and functional opera-tion of the device at these or any other conditions above those indicated in the operational sections of this specifi-cation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

D.C. CHARACTERISTICS

(T A = O°C to 70°C, Vee = 5.0V ±5%, GND = OV)

Symbol Parameter Min. 1IJp.(1) Max. Unit Test Conditions

VOH Output High Voltage 2.4 V IOH = -200

"A

3.3 V IOH = -100

"A

(HRQ Only)

VOL Output LOW Voltage 45 V IOl = 2.0rnA (data Bus)EIW

IOl = 3.2rnA (other outputs) (Note 8 IOl = 2.5rnA (ADSTB) (Note 8)

VIH Input HIGH Voltage 2.2 Vcc+ 0•5 V

Vil Input LOW Voltage -0.5 0.8 V

III Input Load Current ±10

"A

OV ~ VIN ~ Vcc

ILO Output Leakage Current

.

±10

"A

O.45V ~ VOUT ~ Vcc

Icc VeeSupply Current 110 130 rnA TA=+25°C

130 150 rnA TA=O°C

Co Output Capacitance 4 8 pF

C1 Input Capacitance 8 15 pF Ic = 1.0 MHz, Inputs = OV

C1Q I/O Capacitance 10 18 pF

NOTES:

1 Typical values are for T A = 25°C, nominal supply voltage and nominal processing parameters

2. Input liming panimeters assume transition times of 20 ns or less. Waveform measurement pOints for both input and output signals are 2 OV for HIGH and 0 8V for lOW. unless otherwise noted.

3. OUlput loading is 1

m

gate plus 150pF capacitance, unless otherwise noted.

4. The net lOW or MEMW Pulse wtdth for normal wrHe will be TCY-1 00 ns and for extended write wtll be 2TCY-100 ns. The net lOR or MEMR pulse WIdth for normal read will be 2TCY-SO ns and for compressed read wtll be TCY-SO ns.

5. TOQ Is specified for two different output HIGH levels TOQ1 is measured at 2.0V. TOQ2 is measured at 3.3V. The value for TOQ2 assumes an external 3.3k2 pull-up resIstor connected form HRQ to Vcc.

6. DREQ should be held active unHI DACK Is returned.

7 DREQ and DACK signals may be active high or active low. Timing diagrams assume the active high mode.

8. A revision of the 8237 A Is planned for shipment In April 1964, which wtllimprove the folloWing charactaristics.

1. VIH from 2.2V to 2.0V

2. VOL from 0.45V to 0.4V on all outputs. Test condHion IOl = 3.2 mA Please contact your local sales office at thai time for more Information.

9. Successive read andlor write operations by the external processor 10 program or examIne the controiler must be bmed to allow at least 600 ns for the 8237 A, at least 500 ns for the 82~7 A-4 and alleast 400 ns for the 8237 A-5, as recovery time between active read or wrila pulses

10.

Emi

is an open collector output. This parameter assumeslhe presence of a 2.2K puilup to Vcc.

11. Pin 5 is an Input thai should always be at a logic high level An Internal puil-up resistor wtll establish a logic high when the pin is left floating. II is recom-mended however, thai pin 5 be tied to Vcc.

A.C. TESTING INPUT, OUTPUT WAVEFORM

INPUT/OUTPUT

u~.. . >

TEST POINTS

< . ux=

~ ~ u

A C TESTING INPUTS ARE DRIVEN AT 2 4V FOR A LOGIC "1" AND 0 45V FOR

~~ggl~v"~~~I~[NpGG:t:E.~S,~(=~rs ARE MADE AT 2 OV FOR A LOGIC "1"

2-97

AFN·OO789D

8237 A/82~7 A..4/8237 A-5

A.C. CHARACTERISTICS~DMA (MASTER) lI/IODE

(TA=O·C

to

70·C, Vee= +5V:t5%. GND=OV)

8237A 8237A-4 8237A-S

Symbol Parameter Min. Max. Min. Max. Min. Max. Unit

TAEl AEN HIGH from ClK lOW (S1) Delay Time 300 225 200 ns

TAET AEN lOW from ClK HIGH .(81) Delay Time 200 150 130 ns

TAFAB ADR Active to Float Delay from ClK HIGH 150 120 90 ns

TAFC READ or WRITE Float from ClK HIGH 150 120 120 nS

TAFDB DB Active to Float Delay from ClK HIGH 250 190 170 ns

TAHR ADR from READ HIGH Hold Time TCY-100 TCY-100 .rCY-100 ns

,

TAHS DB from ADSTB lOW Hold Time 50 40 30 ns

TAHW ADR from WRITE HIGH Hold Time TCY-50 TCY-50 TCY-50 ns

DACK Valid from ClK lOW DelayTime (Note 7) 250 220 170 ns

TAK EOP HIGH from eLK HIGH Delay Time (Note 10) 250 190 170 ns

EOP lOW from ClK HIGH Delay TIme 250 190 170 ns

TASM ADR Stable from ClK HIGH i 250 190 170 ns

TA$S DB to ADSTB LOW Setup Time I 100 • 100 100 ns

TCH Clock High Time (Transitions,,; 10 ns) 120 100 80 ns

TCl Clock lOW Time (Transillons,,;10 ns) 150 110 68 ns

TCY ClK Cycle Time 320 250 200 ns

TOCl ClK HIGH to READ or WRITE lOW Delay (Note 4) 270 200 190 ns

TDCTR READ HIGH from ClK HIGH (S4) Delay Time

(Note 4) ! 270 210 190 ns

TOCTW WRITE HIGH from ClK HIGH (84) Delay Time

(Note 4) 200 150 130 ns

TOO1 160 120 120 ns

HROValid from ClK HIGH Delay Time (Note 5)

TOO2 250 190 120 ns

TEPS EOP lOW from ClK lOW Setup Time 60 45 40 ns

TEPW EOP Pulse Width 300 225 220 ns

TFAAB ADR Float to Active Delay from ClK HIGH 250 190 170 ns

TFAC READ or WRITE Active from ClK HIGH 200 150 150 ns

TFADB DB Float to Active Delay from ClK HIGH 30~ 225 200 ns

THS HlDA Valid to ClK HIGH Setup Time 100 75 75 ns

TlDH Input Data from MEMR HIGH Hold Time 0 0 0 ns

TIDS Input Data to MEMR HIGH Setup Time 250 190 170 ns

/

TODH Output Data from MEMW HIGH Hold Time 20 20 10 ns

TODV Output Data Valid to MEMW HIGH 200 125 125 ns

TOS DREO to elK lOW (SI, 84) Setup Time (Note 7) 0 0 0 ns

TRH elK to READY lOW Hold Time 20 20 ,20 ns

TRS READY to ClK lOW Setup Time 100 60 60 ns

TSTl ADSTB HIGH from elK HIGH Delay Time 200 150 130 ns

TSTT ADSTB lOW from CLK HIGH D~layTime 140 110

.

90 ns

2-98 AFN-00789D

intJ

8237A/8237~4/8237~5

A.C. CHARACTERISTICS-PERIPHERAL (SLAVE) MODE

(TA

=

OOC to 70°C, VCC =5.0V ±5%, GND

=

OVr

Symbol Parameter 8237A 8237A-4 8237A-5

Unit Min. Max. Min. Max. Min. Max.

TAR ADR Valid or CS LOW to READ LOW 50 50 50 ns

TAW ADR Valid to WRITE HIGH Setup Time 200 .1 SO 130 ns

TCW CS LOW to WRITE HIGH Setup Time 200 150 130 ns

TOW Data Valid to WRITE HIGH Setup Time 200 lS0 130 ns

TRA ADR or CS Hold from READ HIGH

'"

0 0 0 ns

TRDE Data Access from READ LOW (Note 3) 200 200 140 ns

TRDF DB Float Delay from READ HIGH 20 100 20 100 0 70 ns

TRSTD Power Supply HIGH to RESET LOW Setup Time 500 SOO 500 ns

TRSTS ,RESET to First IOWR 2TCY 2TCY 2TCY ns

TRSTW RESET Pulse Width 300 300 300 ns

TRW READ Width 300 2S0 200 ns

TWA ADR from WRITE HIGH Hold Time 20 20 20 ns

TWC CS HIGH from WRITE HIGH Hold Time 20 20 20 ns

TWO Data from WRITE HIGH Hold Time 30 30 30 ns

TWWS Write Width 200 200 160 . ns

WAVEFORMS

SLAVE MODE WRITE TIMING

L TCW

- -i

~TWC

I,

TWWS

) I

(NOTE I)

'-

- T W A

TAW ----,.

AO-A3

---.J

INPUT VALID

-

-TWO

TOW

DBO-DB7

=:)

INPUT VALID

(

Figure 9. Slave Mode Write SLAVE MODE READ TIMING

cs~

AO-A3~

ADDRESS MUST BE VALID

(

H'"l

TRW

~-iliA

(NOTE I)

t.. TRDE

t

T R D F 3

-DBO-DB7

Figure 10. Slave Mode Read DATA OUT VALID _ _ _

2-99 AFN·Q0789D

intJ 8237A/8237 Ao4/8237 A-S

Dans le document LITERATURE In addition to the product line (Page 111-116)

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