Major Challenge 7: Increasing compactness and capabilities by functional and physical systems integrationphysical systems integration

6.3.7.1.

Vision

Smart ECS will be used in a variety of application fields (chapters 1-5), introducing an increasing level of

“smartness”, being more user-friendly, interacting with each other as well as with the outside world and being reliable, robust and secure, miniaturised, networked, predictive, able to learn and often autonomous.

They will be integrated with existing equipment and infrastructure - often by retrofit. Enabling factors will be:

interoperability with existing systems, self- and re-configurability, scalability, ease of deployment, sustainability, and reliability, e.g. by self-repair capabilities. SoS, upgradable and automatically configurable suits of sensors and actuators may share computer power or – alternatively – will be customised to the application scenario (sparse, slim and ubiquitous). A hierarchy of SoS will help industries to cope with the growing variety of production processes, enabling all the applications described in Chapters 1–5 and facilitate better living for individual end users.

6.3.7.2.

Scope and ambition

Many of the new ECS will benefit from the same transversal technologies. For the sake of European R&D&I efficiency, common challenges in smart systems for different applications need to be addressed by application-independent developments of system and application level integration technologies. Thus, shared usage of these technologies (like heterogeneous 3D integration) of building blocks needed for advanced driver assistance systems as well as minimally invasive surgery devices, or wireless communication devices needed for intraocular measurement devices and for environmental sensors. Harsh environments with high temperatures, humidity, vibration and electromagnetic fields must often be endured for a very long lifetime, with zero defects and error-free. In the case of human health monitoring (hyperpiesia, diabetes, stroke, infarct), solutions increasingly need to be based on non-invasive principles. In all cases, the highest quality raw sensor signals with high reproducibility need to be provided by the next generation of extremely miniaturised innovative sensors, with lowest power consumption and at mass production levels.

6.3.7.3.

High priority R&D&I areas on System & Application Level Integration

The main R&D&I activities identified are: i) Physical systems integration, ii) Functional systems integration.

Detailed actions are listed under “Timeframes” and in section 14 “Appendix to Chapter 6” of this document.

Physical systems integration

Smart systems integration in the final product will need to satisfy the specific requirements of the application in terms of compactness, safety and reliability. The systems must also adapt to the resources available in

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the final applications, e.g. in terms of available power, down to the limit of energy scavenging, footprint and compatibility with demanding environments (harsh, in vivo …). The innovation potential of smart systems can be exploited only if their integration in the application goes beyond the mere introduction of add-on modules, but instead is the result of a full co-development.

Functional systems integration

Full integration of ECS also requires mastering the integration of smart systems SW with the general SW layers of the final application and the development of testing procedures for systems of much higher complexity at the level of comprehensiveness and efficiency at the same time, which is needed for high-volume consumer and industrial products (automated cars, production robots, …). The high requirements on functional safety and availability of the new applications for complex systems comprising several modules with heterogeneously integrated components will need the implementation of efficient and safe health monitoring for systems with many different critical elements and a multitude of similarly probable failure modes.

6.4.

EXPECTED

ACHIEVEMENTS

Overcoming the challenges in section 6.3 will enable European Industry to maintain and increase its leading position in developing, producing and selling future Electronic Components and Systems that meet societal needs in a way that is cost-efficient, yet yields products of highest quality. Especially expected achievements are:

„ the creation and extension of modelling and specification techniques and languages matching the new properties and requirements for critical, autonomous, cooperating and evolvable systems, supporting various new technologies like Artificial Intelligence, Deep Learning, Big Data Gathering and Handling, etc.

„ the development of standardised architectural measures and design methods and tools to enable and/or ease validation and testing of such systems as well as appropriate V&V and Test methodologies to ensure their expected and needed qualities.

„ the establishment of standard languages and ontologies and associated tools and methods to develop system models, that can be shared across the system design value chain.

„ the establishment of standard languages plus associated tools and methods to build integrated design flows and platforms, targeting heterogeneous SoC and SiP.

„ the establishment of common platforms and libraries of parts/components that enable modular development, reusable IP, standardised software and middleware solutions, etc.

„ enabling systematic reuse of (models of) components, environments, contexts, etc.

„ a drastic increase in the scalability of methods to match the increased complexity of systems.

„ improved capabilities to develop, validate and optimise system properties and qualities (from power consumption, distributed control functions, maintaining robust stability of feedback control to functional and non-functional system properties like safety, security, reliability and real time).

„ methods and tools to facilitate online monitoring and diagnostics with embedded context awareness.

The general strategic actions required are:

„ Demand – individual manufacturing, personalised (medicine, smart home, smart transportation und smart environments)

„ Shortening time-to-market – from research and testing to production

„ Automation of fabrication processes for smart devices

„ Creating open-innovation platforms to enable easier stakeholder cooperation

„ Securing R&D&I financing in a complex ecosystem (regarding SMEs)

„ ‘Deploy and forget’ retrofitability – self-sustaining IoT devices requiring no maintenance

6.5.

MAKE

IT HAPPEN

Design Ecosystem: The key success factor of this roadmap is the actual adoption by European Industry of the new methodologies in Systems and Components Engineering. This implies not only traditional technology transfer but also changes in the way of working in industry towards a much more comprehensive structured approach.

Many of the R&D&I topics described in the previous sections cannot be solved by a single company or organisation. Most noteworthy, this includes all standardisation and pre-standardisation activities, but also

„ the development of a common design and validation methodology applicable along the value chain, that is (a) accepted by public (certification) authorities, (b) accepted by the general public as yielding trustworthy products, (c) based upon a V&V and Test methodology using standardised catalogues of system contexts/scenarios as test cases, and (d) enabling cost-efficient processes and allowing reuse and re-certification.

„ support for validation of methodologies in industrial practice

„ support for industry in the process of adopting new methodologies

„ support for heterogeneous applications addressing yield, heat and mechanical stress in a more holistic way.

Therefore, a seamless, open, sustainable and extendable design ecosystem for processes, methods and tools for cost-efficient design is needed, focusing on design technologies based on standards, enabling cooperation between leading European industries. It has to start at system level and has to contain flexible, seamless design flows for all design domains and heterogeneous subsystems to (co-)design ECS with and for sophisticated feature-rich innovative products of superior performance and quality.

PFSI Technologies and Production Processes: The ambition is to find optimal models to enable effortless processes for the production of smart devices, while taking into account the overall spectrum of relevant aspects and the entire palette of stakeholders – from manufacturers and users to decision-makers, regulators, product- and service providers and researchers and developers.

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When speaking about the smart ECS ecosystem in Europe, it is essential to develop new forms of stakeholder cooperation on market-ready products, thereby creating a special impact on SMEs and start-ups to maintain or increase their presence and competitiveness in international markets through their innovation, autonomy and agility capabilities. Besides, companies that are not yet visible on the smart systems radar should be motivated to join and enrich the community with their innovations and expertise.

The creation of such ecosystem(s), involving all stakeholders along the respective value chain, is a key success factor for European industry to maintain its leading role in Engineering ECS.

6.6.

TIMEFRAMES

The timeframes given in this section denote for each R&D&I activity (topic) in each high priority R&D&I area the foreseen development lines. Each timeline is divided in three parts, for producing results of TRL2-4, 4-6, and 6-8 respectively. The concrete meaning of this section is that we envisage in a given year projects producing results of this TRL level or higher to be started (cf. Section 0.6.2).

The Topics (actions) are abbreviated if necessary and therefore also listed with a full description in section 14 of the document “Appendix to Chapter 6”.

2020 2021 2022 2023 2024 2025 2026 2027 2028 2029

Major Challenge 1: MANAGING CRITICAL, HIGHLY AUTONOMOUS,

Dans le document domaines couverts par l’agenda stratégique des composants et systèmes (Page 185-189)