PN JUNCTION THEORY
1
Prof. Philippe LORENZINI Polytech-Nice Sophia
PN Homojunction
• Non linear device
• rectifier devices (composants redresseur)
• 2 devices reach the same results:
• PN Junction(this chapter)
• Schottky barrier or Metal / SC contact (next chapter)
2
The Junction’s formation mechanism
3
Flat Fermi level:
No current / thermal equilibrium
•PN Junction at equilibrium
1st Step: diffusion mechanism
2nd Step: built in Electric Field appears compensates diffusion forces
E int
e-h pair’s recombination
« built in potential V
B i»
4
• Definition : Potential drop between N and P regions
P N
bi V V
V
) 0 ) (
( ) ( )
(
dx
x D dp
x E x p e
x
JP P p
dx x dp x x p
Dp E
p ( )
) ( ) 1
(
dx x dp x p dx
x dV kT
e ( )
) ( 1 )
(
) ln(
n p
bi p
p e
V kT Holes current equation:
or or
Integrating from P to N region:
finally: )
n N ( N
e V kT
V
i D A bi
D ln 2 )
n N ( N
e V kT
V
i D A bi
D ln 2
•Field, potential and Space Charge width(1)
• Poisson’s equation:
5 sc
x dx
x V d
( ) )
(
2
2
In N and P region
:
D sc
e N dx
x V d
2
2 ( )
WN
x
0
A sc
e N dx
x V d
2
2 ( )
0
WP x
-WP -WN
6
Electric Field E(x)
) (
)
( N
sc D
n eN x W
x
E
( ) sc ( P)
A
P eN x W
x
E
Continuity of Field on x=0
:
P A N
D
W N W
N
sc P A sc
N D
M
W eN W
E eN
-WP -WN
•Field, potential and Space Charge width(2)
7
Built in potential V(x)
n N
sc D
n eN x W V
x
V ( )2 ) 2
(
p P
sc A
p eN x W V
x
V ( )2 ) 2
(
Depletion layer (ZCE)
sc p A sc
n D d
p n
W W eN
V eN W
V W
V( ) ( ) 2 2
2 2
d D A
A sc D d
p V
N N
N N V e
W ( )
) 2
(
d D A
D
A sc
d
n V
N N
N
N V e
W ( )
) 2
(
d D
A
A D
sc
d V
N N
N N
V e
W
2 )
( -WP WN
•Field, potential and Space Charge width(3)
WARNING: WHEN A VOLTAGE V IS APPLIED ON P SIDE, V
BIHAVE TO
BE REPLACED BY V
BI- V
8
BIASED PN JUNCTION
•
When a positive voltage is applied on p side, the equilibrium is destroyed and a net current can flow
9
simplifying assumptions :
Depletion layer with no free carriers (e‐ and h+)
Low injection
Boltzmann’s approximation
Drop voltage only in depletion layer
No generation‐recombination mechanisms present
•
Foward Biasing
• Positive voltage on P
• lowering of built in potential
• Diffusion mechanism dominates
• High current
10
BIASED PN JUNCTION
• Forward biasing
• Lowering of built in Field due to opposite external field
• Electrons injected from N to P regions: minoritary carriers injection
• High current due to full
« reservoir »
11
Fdiff e-
Fdiff h+
BIASED PN JUNCTION
Forward Biasing
12
Eext
Jonction PN sous polarisation
• Reverse Biasing
• Global Electric Field increases (External Field added to built in Field)
• Injection of electrons from P to N and holes injection from N to P: majority carriers injection
• Low current ( leak current) due to empty « reservoir »
• Reverse Biasing
• Global Electric Field increases (External Field added to built in Field)
• Injection of electrons from P to N and holes injection from N to P: majority carriers injection
• Low current ( leak current) due to empty « reservoir »
13
Fconde‐
Fcond h+
PN Junction under biasing
14
•Boltzmann’s Approximation: The Boltzmann approximation is to say that the resulting current being small compared with the
components of this current, we consider that we are still in quasi equilibrium and therefore that the current's equation is still valid by replacing Vbi by Vbi‐VA :
At equilibrium, null current two components compensate between it. Taken separately, the magnitude of these
components 104 A / cm² (ie 1A for typical diode) and at low injection I is of the order of few mA (max 10mA)
dx x dp x
p dx
x dV kT
e ( )
) ( 1 )
(
Density of carriers injected to the limits of depletion layer
•
If Va=0
•
If Va
15
) ) exp(
(
kT eV p
p p
W
p bi
p n p
N
0
'( ) ' exp( ( )) exp( )kT eV p
p kT
V V
e p
p p
W
p A
p n A
bi p
n p
N
) exp(
) exp(
'
2
kT eV N
n kT
p eV
p A
D i A
n
n ' exp( ) exp( )
2
kT eV N
n kT
n eV
n A
A i A
p
p
) exp(
*
*
' 2'
kT n eV
n p
p
n
p p
n n
i aHoles density injected versus bias voltage V
a0,0 0,1 0,2 0,3 0,4 0,5 0,6 0,7
104 105 106 107 108 109 1010 1011 1012 1013 1014 1015 1016 1017
Na= 1E17 cm-3 Vd=0.7 V
P'(Wn) (cm-3 )
Va (V)
16
Minority carriers distribution in neutral region
• Due to gradient concentration, carriers will diffuse and
produce diffusion current (no electric field in neutral region
!)
• Distribution is geometry dependant
• Discrimatory parameter : length diffusion LDn,p of electrons and holes and neutral region widths dn,p
17 -WP 0 WN
Minority carriers distribution in neutral region
• Long regions ( )
18
n p p
n L
d , ,
p N
a
L x kT W
eV n
n p e e
p x
p'( ) ( kTa 1) (WNx)/Lp
eV n
n p e e
p x
p'( ) ( 1) ( )/
n a
L Wp kT x
eV p
p n e e
n x
n'( ) ( kTa 1) (xWp)/Ln
eV p
p n e e
n x
n'( ) ( 1) ( )/
Short (narrow) regions ( )dn,p Lp,n ) )(
1 (
) (
' e x x
d p p
x
p kT c
eV
n n n
a
( 1)( )
) (
' e x x
d p p
x
p kT c
eV
n n n
a
) '
)(
1 (
) (
' e x x
d n n
x
n kT c
eV
p p p
a
( 1)( ' )
) (
' e x x
d n n
x
n kT c
eV
p p p
a
General case
p kT c
eV
p n n
n L
x sh x
e L
sh d p p
x p
a
) 1 (
) ( )
( '
n kT c
eV
n p p
p L
x sh x
e L
sh d n n
x n
a '
) 1 (
) ( )
( '
Minority currents in neutral region
Knowing minority distribution we are in position to calculate the current wich is a diffusion current (very low field in neutral region):
19
dx x eD dp
x
J p p ( )
)
(
dx x eD dn
x
Jn n ( ) )
(
Hypothesis : no G‐R process in depletion layer (ZCE) ) (
) (
) (
) (
)
(V J p Wp Jn Wp J p Wn Jn Wp
J
We get the classical and well known diode equation:
) 1 (
)
( V J
Se
eV /kT J
Js is the theorical saturation current or reverse current
20 -WP 0 WN
p A
n i n
D P i
S N d
D en d
N D J en
2
2
Long region
n A
n i
P D
P i
S N L
D en L
N D J en
2 2
General case
) ) (
(
2 2
n p n
A
n i
P n P
D
P i S
L th d L N
D en L
th d L N
D
J en
Minority currents in neutral region
Short (Narrow) region
• The model is refinedwe take into account G‐R process in depletion layer
• Well understood mechanism (Shockley‐Read)
The real diode: genération‐ recombinaison mechanism in depletion layer
21
n p
n
n r pn
i
i
2
1 2
We know that
If we suppose np constant in depleted region and np >>
(in forward bias) , the rate r is max when n=p, and it can be rewritten
) exp(
) (
) (
) (
)
( 2
kT n eVa
W n W p W
n W
p N N P P i
2
n
i
kT eV
r n
i aexp 2
max
2
•
Generation‐Recombinaison current in depletion layer can be expressed as:
22
N
P
W GR W
p n
n
n W J W J e rdx
J ( ) ( )
For reverse biasing ( ), we have a negative rate ( ) . It means dans we have a net generation process
2
ni
pn
2 0
i r n
For forward bias, r
max=cte>0 and the current is due to recombinations.
The real diode: genération‐ recombinaison
mechanism in depletion layer
• Finally GR current present in depletion layer can be expressed as:
23
If we take into account the diffusion current, we get:
) 1
exp(2
0
kT J eV
JGR GR a
) 1
exp(2 1
) exp(
)
( 0
kT J eV
kT J eV
V
J a S a GR a
T i
GR en W
J 2
0
The expression above can be generalized by introducing Ideality factor:
exp( ) 1
)
( 0
nkT J eV
V
J a
The real diode: genération‐ recombinaison
mechanism in depletion layer
Reverse biasing:
Junction breakdown
• Thermal Effect (Narrow bandgap)
• Zener Effect:
• direct flowing from VB to CB by tunnel effect (0), if electric field above critical Field Ec
• Avalanche Effect:
• before« tunneling », hot electrons
(accelerated electrons) excite by impact ionisation electrons from VB to CB
(1,2,3) etc….
• « Punchtrough »
24
B C
BD eN
V E
2 . 2
tun nel
Tunnel
Avalanche
Small signal model of the diode: capacitances
• Capacitance associated to charges
• 2 types of charges present in the junction
• Fixed charges (ionised dopants) in depletion layer
• Mobiles (e- et h+) injected when forward biasing
• 2 types of capacitance
• Junction (or Transition) Capacitance
• Charge Storage (or diffusion) Capacitance
25
Junction capacitance
26
Simply associated to charges present in depletion layer
dV C dQ
C
T
j Q eAN
AW
P eAN
DW
NT D
A
D A
A D
j
T
W
A N
N
N N
V V
e C A
C
( ) ( )
2 2
or:
Charge Storage (diffusion) capacitance
•
Reflects the delay between the voltage and current
•
Associated with charges injected into the neutral
regionsTraduit le retard entre la tension et le courant
27 P
P
Sp J
Q
n n
Sn J
Q
CN
X
W n
Sp
A e p x p dx
Q ( ' ( ) )
Holes density in excess present in N region
) (
) 1 coth(
) )
0 ( ' (
P P n
n P
n Sp
L sh d L
L d p
p e Q
28
Charge Storage (diffusion) capacitance
• We can transform the previous expression by:
29
) (
NP
Sp
J W
Q
avec
) (
1 1
P n P
L ch d
Time expression can be simplified, depending of the neutral geometry:
Narrow diode: transit time
Long diode: lifetime
P n
t
D
d 2
2
P
Charge Storage (diffusion) capacitance
• The previous expression, valid in N region, can be
generalized in P region and we obtain for the whole diode
:
30
) (
)
( ( )
)
(n n P p p N
Sp Sn
S Q Q J W J W
Q
If we use:
dV C dQ
CS d S
) (
(n) n (p) pSp Sn
d
S
K J J
kT C e
C C
C
K : Geometry dependant Factor (2/3 narrow)
(1/2 long)
Charge Storage (diffusion) capacitance
Equivalent circuit of foward diode
31
rd : diode resistance (dynamic resistance) given by the differential slope of the I‐V characteristics
rs : serie resistance of neutral region n and p
I e rd kT 1
(from Neamen)
Large signal switching of diode
32
As long as the stored charge is positive
forward bias diode voltage across diode is small (few 10 mV)
) 1 (
' kT
eV n n
n
a
e p p
p
sd Storage time ie p'(WN) pnWn
• Storage time :The main problem in minoritary carriers devices:
• Storage time:
• Rise (or fall) time :
• Cj: mean value of capacitance between zero and –V2
33
ln(1 ) ln(1 )
m f
f m
f p
sd I I
I I
I
m f
f j
F
f I I
I RC
avec
3 1 . 2
Large signal switching of diode
Diode Tunnel – diode Backward
34
3
2 exp 4
* b t
e m
T a
pe a pe
a pe
t V
V V
I V
I exp 1
(a)
(e) (d) (c) (b)