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Sealing SU-8 microfluidic channels using PDMS

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Figure

FIG. 1. DSC trace of post-exposure baked SU-8. The bake was done at 95  C for 5 min.
FIG. 3. Lab sheet specimen for testing the bonding between SU-8 and PDMS. (a) before the testing; (b) after the testing.
FIG. 4. The process for sealing SU-8 channels using PDMS. Chemical bonding is achieved between PDMS and SU-8.
Fig. 5 shows the effects of post-exposure bake temperature on the residual epoxy groups in SU-8 and the maximum fluidic holding pressure of PDMS-sealed SU-8 straight microfluidic channels
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