Microassembly research at IMTI

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Microassembly research at IMTI

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Precision Micro Fabrication

Microfabrication de précision

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Microassembly Research at IMTI

Ajit Pardasani & Shafee Ahamed

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Outline

1. Introduction

2. What is

microassembly

3. Major Issues

4. IMTI Research

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What is a microsystem*

• Microsystem is a

multifunctional device

with micron-scale

features.

• Aka MEMS (Micro Electro Mechanical Systems) in the US micromachines in Japan

Source: Sandia National Labs BioMicroFuelCell™

Micro Robot

Sensor Actuator

Interfaces

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Tricumed Medizintechnik GmbH Implantable Infusion Pump

Implex AG Middle Ear Implant Dropped Foot Stimulator

ETB Codicote Innovation Centre

Micro-diaphragm pump

ThinXXS Microtechnology _{Bartels Mikrotechnik}

Micropump

Microsystems Examples

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Microsystems Market

Year

Market

(Billions)

2004

12 2009

25 16% Growth

Source: NEXUS (The Network of Excellence in Multifunctional Microsystems) Market Analysis for MEMS and Microsystems III, 2005-2009

New products in 2009 will

include micro fuel cells, MEMS memories, chip coolers, liquid lenses for cell phone.

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Market for MST Products

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Microassembly

• Assembly of objects with microscale/mesoscale features

under microscale tolerances

• Assembly of microcomponents/microsystems where

contact and surface forces dominate over the volume

related properties (gravity) affecting:

– Handling

• pick, place, release – Accuracy of Placement

• move, rotate, orient, mate

• Microassembly can account upto 80% of total production

cost

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Why Microassembly?

• To integrate heterogeneous micro components

and microsystems into

hybrid

functional

devices/3D structures.

• Choice of materials: Components can be made

using non-semiconductor materials

• Diverse manufacturing processes can be used

for making components

• Microparts with a range of geometrical shapes

and sizes can be assembled.

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Microsystems in Medical & Life

Sciences - Assembly Required

• Lab on a chip

• Components for catheter systems

• Micro surgical instruments

• Implants (micropumps, microvalves, sensors)

• Drug atomizers

• Endoscopes

• Cell separation systems

• Components for non-invasive power transfer

• Electrodes for nerve stimulation

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Current Status

Manual

• Tedious

• Tiresome

• Very low repeatability

• High flexibility

• High rejection rate

• High operational

costs

Automation

• Specific to product

type

• High accuracy and

repeatability

• Low flexibility

• High capital costs

• Suitable for very high

production volumes

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The Future Needs

“There is an urgent industrial need for

re-configurable, easily deployable, cost-effective,

micro assembly system solutions with a

supportive application methodology” European

Precision Assembly Roadmap 2010

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Key Processes for

Microassembly

• Part feeding

• Handling of microcomponents including grasp and release

• Precise positioning

• Precise manipulation to align and mate parts

• Sensing for finding parts position and orientation

• Verification for quality control

• Joining or Bonding

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Major Issues:

Microcomponent Handling (1)

Scaling effect

creates problems

for handling:

– Stiction due to surface

tension and

intermolecular forces

– Mechanical Clamping

– Repulsion/attraction due

to electrostatic forces

– Careful handling to avoid

damage

• Volume ∝ L3

• Surface Area ∝ L2

• Part1:

– Volume: 1000 – Surface area: 600

• Part2:

– Volume: 1 – Surface area: 6

• The surface area went

down by 100 but the

volume by 1000

10 10 10 1 1 1

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Microcomponent Handling

• Techniques for releasing

microcomponents from

mechanical grippers:

– Use adhesion forces between the part and the substrate

– Join part to the substrate

– Relative motion between part and the gripper

– Vibration assisted release The proper method depends on

the task

Handling

With Contact Without Contact

Reducing Overcoming Exploiting Avoiding

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Major Issues:

Gripping

21.7 49.5 97.4 52.7 149. 9 99.0 879.7 528.5 201.2 849.4 47.9 530.1 diam 206.0 2161.9

Normally open microgripper developed by IMTI in collaboration with UWO

(Marco Zeman, Prof. George Knopf) All dimension in microns.

Microgripper Micro-tweezer Resolution: 15 nm Force: > 200 μN Span range: > 25 μm Model: MGS2-EM

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Major Issues:

Sensing

• Loss of direct hand-eye

coordination

• Tools limit the ability to sense

objects being handled

• High magnification restricts

operator’s view:

– Restricted field of view

– Small depth of focus restricts clear image of non-planar objects, or moving objects

• Optical microscope is limited to a

max resolution of 0.2 microns.

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Major Issues:

Micromanipulation

• High Precision

• High dexterity

• Confined spaces

– Small working distance

under the light microscope

– Scanning Electron

Microscope

• Alignment of parts

• Insertion of parts

Mobile Micromanipulation Robot

Source: Institute for Process Control and Robotics, University of Karlsruhe

MM3A Micromanipulator.

Size: 60 x 22 x 25 mm, Wt: 45gm

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Cost-effective Assembly of

Microsystems

New Project –started in

2005

Project Goal

• Develop cost effective, flexible,

modular, microassembly cell & processes:

– High product yield

– Co-existence of manual

and automation

– Incremental step-wise

automation

– Easy operator interface

– Able to handle large

product variety

∑

= Costs Recurring Costs Capital y Flexibilit

Re-programming, new part handling new fixtures, new grippers

Motion stages, robots, vision system, vibration isolation, etc.

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Microassembly Station Architecture

X Linear Motion Stage

Y Linear Motion Stage

Rotary Motion Stage Rotary Plate

Vertical Positioning Unit (XYZ motion stages)

Zoom Lens

Granite Bridge Camera

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Model, Simulate, Operate

Assembly cell simulation “drives”

the hardware

• Augmented reality interface for teleoperation

• Model, simulate, and validate handling processes

– Ways to pick and release – Safe handling of components

• Create, simulate and analyze assembly plan

– Microcomponent mating strategies – Task sequencing

– Collision avoidance

– Analyse tolerance stackups

• Hardware in the Loop Simulation

• “Show and Train” the assembly system

Simulation

Hardware

control

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High Magnification Zoom Lens

System

Navitar 12x zoom motorized Range Magnification 1.16 - 14 Horizontal Field Of View (mm) 0.62 – 7.5 mm Depth of Field (um) 27.5 – 687.5 um Resolving Power (um) 2.75 - 13.75 um Numerical Aperture 0.02 -0.10

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This is Not the Conclusion

• New Research Project

• Looking for Industrial Case Studies for

Validation of Research Objectives

• Currently system is being setup

Ajit.Pardasani@nrc-cnrc.gc.ca

519-430-7085

Shafee.Ahamed@nrc-crnc.gc.ca

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References

• Europractice,http://www.europractice.com/technologies/microsystem

s/index.asp

• NEXUS Medical Devices USC and the Healthy Aims Project,

http://www.nexus-mems.com/documents/NEXUS%202003%20FORUM%20USCs%20 and%20Healthy%20Aims%20Presentations.pdf

• WTEC Study on Micromanufacturing, http://www.wtec.org/micromfg/

• University of Toronto, Dept of Mechanical & Industrial Engineering,

http://www.mie.utoronto.ca/staff/projects/cleghorn/Microassembly/Mi croassembly-Examples/MicroassemblyExamples.html

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Camera System

Attribute Desired Range

Model/Type Pulnix TM-1325CL Digital Camera Scan Mode Area Scan Color/B&W Color CCD Sensor Size (HorizontalXVertical) 8.7 mm X 6.9 mm No. of Pixel (RowXColumn) 1392 X 1040 Aspect Ratio 4 : 3 Frame Rate 15 /30 fps Type of Lens Mount C type

Output Interface CameraLink (Base) Dimensions

(WXDXH)

44 mm X 44 mm X 64 mm

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Micro Manipulation

Size (L x W x H) 60 x 22 x 25 mm Weight 45 gm Operating Range X, Y 240o Operating Range Z 12 mm Resolution X, Y 5 and 3.5 nm Resolution Z 0.25 nm Lift Y 5 gms

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Specific Needs/Research Topics

(as ranked by participants):

1. Sensing: 3D machine vision, visual servoing, pose identification, imaging of features at or near the wavelength of light.

2. Part Interaction

3. Material Delivery (handling)

4. Fastening and Packaging 5. Intelligent End Effector

6. Process Modeling and Simulation 7. Theory of Design for Micro-Assembly 8. Materials Science

9. Systems Engineering 10. Test Methods.

11. Design Verification

Source: Proceedings of Manufacturing Technologies for Integrated

Nano- to Millimeter (In2m) Sized Systems: The State of the Art, and Opportunities for Further Advances Workshop

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Micro/Nano: The Difference

• Micro

– Feature size of the order of microns

– Miniaturization based on processing of bulk materials

• Nano

– Feature sizes of the order of nanometers

– Most fundamental (i.e. molecule) level of

understanding

– Buildup structures that we can use at micro level

• Micro is1,000 times larger than the nano ~ the

size difference between a 12” ruler and three

football fields lined up

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Micro/Nano: The Difference

Source: WTEC Study on Micromanufacturing

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Electromagnetic Spectrum

Source: http://acept.la.asu.edu/PiN/rdg/color/color.shtml

Figure: The electromagnetic spectrum, which encompasses the visible region of light, extends

from gamma rays with wave lengths of one hundredth of a nanometer to radio waves with wave lengths of one meter or greater.