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Bottom electrodes impact on Hf0.5Zr0.5O2 ferroelectric tunnel junctions

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HAL Id: hal-03275569

https://hal.archives-ouvertes.fr/hal-03275569

Submitted on 1 Jul 2021

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Bottom electrodes impact on Hf0.5Zr0.5O2 ferroelectric tunnel junctions

Greta Segantini, Pedro Romeo, Benoit Manchon, Nicolas Baboux, Ingrid Infante, Rabei Barhoumi, Cosmin Istrate, Lucian Pintilie, Damien

Deleruyelle, Bertrand Vilquin, et al.

To cite this version:

Greta Segantini, Pedro Romeo, Benoit Manchon, Nicolas Baboux, Ingrid Infante, et al.. Bottom electrodes impact on Hf0.5Zr0.5O2 ferroelectric tunnel junctions. EMRS Spring Meeting 2021, May 2021, Virtual, France. �hal-03275569�

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Bottom electrodes impact on Hf 0.5 Zr 0.5 O 2 ferroelectric tunnel junctions

Greta Segantini

1

, Pedro Rojo Romeo

1

, Benoit Manchon

2

, Nicolas Baboux

2

, Ingrid C. Infante

2

, Rabei Barhoumi

2

, Cosmin M. Istrate

4

, Lucian Pintilie

4,

Damien Deleruyelle

2

, Bertrand Vilquin

1

, Sharath Sriram

3

1

Université de Lyon, Ecole Centrale de Lyon, Institut des Nanotechnologies de Lyon, CNRS UMR5270

2

Université de Lyon, INSA de Lyon, Institut des Nanotechnologies de Lyon, CNRS UMR5270, 7 avenue Capelle, 69621 Villeurbanne cedex, France

3

Functional Materials and Microsystems Research Group and Micro Nano Research Facility, RMIT University, Melbourne, VIC, 3001, Australia

4

National Institute of Materials Physics, Atomistilor 405A, Magurele, 077125, Romania

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03-June-21

Introduction

• Emulation of synaptic plasticity

• Parallel process of data

• High energy efficiency

Memristor

• ReRAM

• Ferroelectric tunnel junction (FTJ)

• CMOS Compatibility

• Stable orthorhombic phase at low thickness

• Optimisation of electrical performances

Impact of:

• Bottom electrode (BE)

• Ultra-thin buffer layer the electrode/HZO interface

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Experimental Results

Post-annealing Grazing Incidence X-Ray Diffraction Characterisation:

𝐓𝐢𝐍 Bottom Electrode:

Impact of an ultra-thin 𝐓𝐢 buffer layer: analysis for different thickness of HZO n

+

Si(001)/TiN/HZO/TiN/Ti/Pt n

+

Si(001)/TiN/𝐓𝐢/HZO/TiN/Ti/Pt

Roughness ≈ 0,3 nm

z-scale= 5,5 nm Atomic force microscopy on HZO surface 2x2 μm2

Transmission Electron Microscopy (TEM)

Not to scale

(a) HRTEM image of the TiN/HZO/TiN multistructure, (b) magnified view of two HZO crystallites with different crystalline structures from an area marked by the two blue circles from the HRTEM image, (c) Fast Fourier Transform picture performed on the HRTEM image, (d) reconstructed image of the two HZO crystallites using the two different spots marked on the FFT picture.

HZO layer ~ 11 nm

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03-June-21

Discussion

Impact of an ultra-thin 𝐓𝐢 buffer layer: analysis for different thickness of HZO:

Post-annealing the 𝐓𝐢 turns into 𝐓𝐢𝐎 𝟐 which:

• Stabilize ferroelectric layer in HZO

• Increase oxygen vacancies in the HZO barrier

• Creates defects at the electrode/HZO interface

Ti layer

2P

r

(𝜇C.𝑐𝑚 −2 )

Cycling voltage (V)

Endurance (cycles)

No 13.68 4.5 10 6

Yes 28.12 4.5 10 6

• Increase of remnant polarisation

• No impact on endurance

• Decrease of wake up effect

𝐇𝐙𝐎 𝐥𝐚𝐲𝐞𝐫 ~ 𝟏𝟏 𝐧𝐦

• Prevents degradation of ferroelectric phase

• Provides large ferroelectric polarization

𝐓𝐢𝐍 Bottom Electrode:

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Conclusions

 Realisation of thin ferroelectric layers by magnetron sputtering

 Ultra-thin buffer layer to promote ferroelectricity at low thickness

 Positive impact of the buffer layer on the electrical performances

References:

[1] L. Chen et al., “Ultra-low power Hf0.5Zr0.5O2 based ferroelectric tunnel junction synapses for hardware neural network applications,” Nanoscale, vol. 10, no. 33, pp. 15826–15833, 2018, doi: 10.1039/c8nr04734k.

[2] J. Bouaziz, P. R. Romeo, N. Baboux, and B. Vilquin, “Huge Reduction of the Wake-Up Effect in Ferroelectric HZO Thin Films,” ACS Appl. Electron. Mater., vol. 1, no. 9, pp. 1740–1745, 2019, doi: 10.1021/acsaelm.9b00367.

The I3E ECLAUSion project has received funding from the European

Union's Horizon 2020 research and innovation programme under the

Marie Skłodowska-Curie grant agreement No 801512

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