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Chemically resistant encapsulant to enable a novel MEMS fabrication process

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Academic year: 2021

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Figure

Figure  1:  Top  and  cross-section  schematic  of the test 3D MEMS device, before (a) and after  (b) release
Figure 2: Visual observation after HF test,  from  left  to  right:  sample  1  to  sample  6
Figure  5:  Equivalent  electrical  circuit  of  the  tested 3D capacitive MEMS sensor

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