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timing requirments clock timing (see Figure 3)

Dans le document and Telecommunications (Page 172-178)

Input signal at PCMIN is 0 dBmO

tc(MCLK) Clock period for MCLK (2.048 MHz systems) tr Rise time for MCLK

tf Fall time for MCLK

tw(MCLK) Pulse duration for MCLK (see Note 7) Clock duty cycle [tw(CLK)/tc(CLK)l for MCLK t All typical values are at VBB = -5 V, VCC = 5 V, and TA = 25°C NOTE 7: FSX CLK and FSR CLK must be phase-locked with MCLK.

transmit timing (see Figure 3)

Delay time (frame sync), FSR high or low before MCLK J,

2-112

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TCM37C13, TCM37C14, TCM37C15 PCM COMBO WITH PROGRAMMABLE GAIN CONTROL

receive timing (see Figure 4)

PARAMETER MIN

td(FSR) Delay time, frame sync high or low before MCLK J.. 100

tsu(PCMIN) Setup time, PCMIN high before MCLK J.. 50

th(PCMIN) Hold time, after PCMIN J.. 60

switching characteristics

propagation delay times (see Figure 3 and 4)

PARAMETER TEST CONDITION

tpd1 Propagation delay times, MCLK i to bit 1 data valid at PCMOUT

CL = 0 pF to 100 pF (data enable time on time slot entry) (see Note 8)

tpd2 Propagation delay times, MCLK i bit n to bit n data valid at PCMOUT (data

CL = 0 pF to 100 pF valid time)

tpd3 Propagation delay times, MCLK J.. low bit 8 to bit 8 Hi-Z at PCMOUT

CL= 0 pF (data float time on time slot exit) (see Note 8)

tpd4 Propagation delay times, MCLK i bit 1 to TSX active (low)

CL = 0 pF to 100 pF (time slot enable time)

tpd5 Propagation delay times, MCLK J.. to bit 8 to TSX inactive (high)

CL= 0 pF (timeslot disable time) (see Note 8)

NOTE 8: Timing parameters tpd1' tpd3, and tpd5 are referenced to the high-impedance state.

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SLWS018-JUNE 1996

MAX UNIT tc(MCLK) -100 ns

ns ns

MIN MAX UNIT

0 145 ns

0 145 ns 60 215 ns 0 145 ns 60 190 ns

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0.15 dB 0.15 dB

0 0

-1

Typical Filter Transfer Function

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-40 -40

-50 -50

-60~~--~~~~~~~~----~--__ ~~~~~~~~ ____ ~ __ ~~~~~~~-60

10 50 100 1 k 10 k

f - Frequency -Hz

NOTE A: For this figure, gain (voltage amplification) is defined as gain relative to gain at 1 kHz in dB.

2-114

Figure 1. Transmit Filter Transfer Characteristics

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For this figure, gain (voltage amplification) is defined as gain relative to gain at 1 kHz in dB.

Figure 2. Receive Filter Transfer Characteristics

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PCM COMBO WITH PROGRAMMABLE GAIN CONTROL

SLWS018 - JUNE 1996

MCLK 6

td(FSX)

1 :.- : I

FSX---"~----~ ~ ____ ~ ___________________ ~_-_-__ -_-_-_~~I~t_C(_M_C_L_K) ____________ : __ __

tpd1

Figure 3. Transmit Timing

MCLK

NOTE A: Inputs are driven from 0.45 V to 2.4 V. Time intervals are referenced to 2 V when the high level is indicated and 0.8 V when the low level is indicated.

2-116

Figure 4. Receive Timing

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TCM37C13, TCM37C14, TCM37C15 PCM COMBO WITH PROGRAMMABLE GAIN CONTROL

SLWS018 - JUNE 1996

PRINCIPLES OF OPERATION system reliability and design considerations

General TCM37C13, TCM37C14, and TCM37C15 system reliability and design considerations are described in the following paragraphs.

latch-up

Latch-up is possible in all CMOS devices. It is caused by the firing of a parasitic SCR that is present due to the inherent nature of CMOS. When a latch-up occurs, the device draws excessive amounts of current and will continue to draw heavy current until power is removed. Latch-up can result in permanent damage to the device if supply current to the device is not limited.

Even though the TCM37C13, '14, and '15 are heavily protected against latch-up, it is still possible to cause latch-up under certain conditions in which excess current is forced into or out of one or more terminals. Latch-up can occur when the positive supply voltage drops momentarily below ground, when the negative supply voltage rises momentarily above ground, or possibly if a signal is applied to a terminal after power has been applied but before the ground is connected. This can happen if the device is hot-inserted into a card with the power applied, or if the device is mounted on a card that has an edge connector, and the card is hot-inserted into a system with the power on.

To help ensure that latch-up does not occur, it is considered good design practice to connect a reverse-biased Schottky diode (with a forward voltage drop of less than or equal to 0.4 V - 1 N5711 or equivalent), between each power supply and GND (see Figure 5). If it is possible that a TCM37C13-, '14-, or '15-equipped card that has an edge connector could be hot-inserted into a powered-up system, it is also important to ensure that the ground edge connector traces are longer than the power and signal traces so that the card ground is always the first to make contact.

device power-up sequence

Latch-up can also occur if a signal source is connected without the device being properly grounded. A Signal applied to one terminal could then find a ground through another signal terminal on the device. To ensure proper operation of the device and as a safeguard against this sort of latch-up, it is recommended that the following power-up sequence always be used:

1. Ensure no signals are applied to the device before the power-up sequence is complete.

2. Connect GND.

3. Apply VBB (most negative voltage).

4. Apply

Vee

(most positive voltage).

5. Force a power down condition in the device.

6. Connect the master clock.

7. Release the power-down condition.

8. Apply FSX and/or FXR synchronization pulses.

9. Apply signal inputs.

When powering down the device, this procedure should be followed in the reverse order .

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2-117

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