Corporate Headquarters De Run 6501
5504 DR Veldhoven The Netherlands Mailing Address P.O. Box 324 5500 AH Veldhoven The Netherlands
United States Main Office 2650 W Geronimo Place Chandler, AZ 85224 U.S.A.
Asia Main Office
Suites 3704-6, Tower Two, Times Square 1 Matheson Street
Causeway Bay, Hong Kong Investor Relations phone: +31 40 268 3938
email: investor.relations@asml.com
For additional contact information please visit our Website.
Name Description
2018 AGM The Annual General Meeting of Shareholders of April 25, 2018 3TG Tin, tantalum, tungsten and gold
AFM Autoriteit Financiële Markten; Authority for the Financial Markets of the Netherlands AGM Annual General Meeting of Shareholders
ArF Argon Fluoride
ArFi Argon Fluoride Immersion
ASC Accounting Standards Codification
ASML ASML Holding N.V. and / or any of its subsidiaries and / or any investments in associates, as the context may require
ASML Foundation The ASML Foundation supports projects in the regions where ASML operates. It’s aim is to increase the self-sufficiency of disadvantaged youngsters (4 - 18 years old) through educational initiatives that develop their talents and unlock their potential
BEPS Base Erosion and Profit Shifting
BoM Board of Management
Brion Brion Technologies, Inc.
Business Principles Business principles of ASML
Canon Canon Kabushiki Kaisha
CCIP Customer Co-Investment Program
CEO Chief Executive Officer
CFO Chief Financial Officer
CGU Cash Generating Unit
CGU ASML Cash Generating Unit ASML (which is ASML excluding CGU Cymer Light Sources) Code Dutch Corporate Governance Code
Code of Conduct Code of ethics and conduct
Company ASML Holding N.V.
CO2 Carbon Dioxide
CO2 footprint
-direct scope 1 Consists of the combustion of natural gas and purchased CO2
CO2 footprint
-indirect scope 2 Calculated by multiplying electricity consumptions of the manufacturing locations by the local conversion factors
COO Chief Operations Officer
CTO Chief Technology Officer
Cymer Cymer Inc., Cymer LLC and its subsidiaries D&E Development and Engineering
DRAM Dynamic Random Access Memory (often called performance memory)
Dutch Central Bank The Dutch Central Bank (De Nederlandsche Bank), which is the supervisor of all pension companies in the Netherlands
Dutch GAAP Generally Accepted Accounting Principles in the Netherlands
DUV Deep Ultraviolet
EHS Environment, Health and Safety EHS Competence
Center Defines EHS standards for ASML, gathers best-known practices and helps managers across the business to implement these
EMEA Europe, the Middle East and Africa
EPS Earnings per share
ESOP Employee Stock and Stock Option Plans EURIBOR Euro Interbank Offered Rate
Name Description
Eurobonds Our EUR 600 million 5.75 percent senior notes due 2017 (issued 2007, redeemed on June 13, 2017), our EUR 750 million 3.375 percent senior notes due 2023 (issued 2013), our EUR 500 million 0.625 percent senior notes due 2022 (issued 2016), EUR 1,000 million 1.375 percent senior notes due 2026 (issued 2016) and our EUR 750 million 1.625 percent senior notes due 2027 (issued 2016)
Euroclear
Nederland Nederlands Centraal Instituut voor Giraal Effectenverkeer B.V.
Euronext
Amsterdam Euronext Amsterdam N.V.
EU European Union
EUV Extreme Ultraviolet
Exchange Act US Securities Exchange Act of 1934 Fab Fabrication plant (semiconductors) FASB Financial Accounting Standards Board
FMSA Financial Markets Supervision Act (Wet op het financieel toezicht (Wft)) Foundation Stichting Preferente Aandelen ASML
Foundry Contract Manufacturers of Logic Chips FTEs Full-time equivalents
Functional Ownership
Functional Ownership maturity measures the level of required knowledge among our teams of experts about the system functions they are responsible for
GRI Global Reporting Initiative
GRI G4 Fourth generation of sustainability reporting guidelines as issued by the Global Reporting Initiative
H2 Hydrogen
High-NA High Numerical Aperture
HMI Hermes Microvision, Inc.
Holistic Lithography Adjusting the patterning process steps as a whole, in order to support optimization of the entire chip making process
IASB International Accounting Standards Board
IC Integrated Circuit
i-line Lithography system with a mercury lamp as light source IFRS International Financial Reporting Standards
IFRS-EU International Financial Reporting Standards as adopted by the European Union Imaging Transferring the pattern structure on the wafer
imec Interuniversitair Micro-Elektronica Centrum Installed Base
Management Net service and field option sales Integrated Report
2016 The Integrated Report 2016 as published on the Website
Intel Intel Corporation
Intel NRE Funding
Agreements The Intel Funding Agreements related to the development of 450mm and EUV lithography equipment Internet of Things The internetworking of physical devices, vehicles, buildings and other items—embedded with electronics,
software, sensors, actuators, and network connectivity that enable these objects to collect and exchange data ISO International Organization for Standardization
KPI Key Performance Indicator
KPMG KPMG Accountants N.V.
KrF Krypton Fluoride
kWh kilo Watt hour
LED Light-Emitting Diode
Name Description
LGBTI Lesbian, gay, bisexual, transgender and intersex LIBOR London Interbank Offered Rate
Logic Integrated Device Manufacturers and Foundries
LTI Long-Term Incentive
Memory NAND-Flash Memory and DRAM Memory chip makers mm Millimeter (one thousandth of a meter)
MRI Magnetic Resonance Imaging
NAND A binary operator composite of ‘NOT AND’ (often called storage memory)
NASDAQ NASDAQ Stock Market LLC
Nikon Nikon Corporation
Nikon
Cross-License Agreement The patent Cross-License agreement between Nikon and ASML related to lithography equipment used to manufacture semiconductor devices
nm Nanometer (one billionth of a meter)
Node The ‘technology node’ (also known as the ‘process node’ or simply ‘node’) is a common metric used in the semiconductor industry to describe and differentiate the technologies used in fabricating microchips. Generally, a smaller technology node means a smaller feature size, allowing the production of smaller transistors which are both faster and use less power. Marketing claims and discrepancies among chip producers (foundries) means that the numbers assigned to a node - such as 45 nm, 32 nm, 22 nm, 16 nm, 14 nm, or 10 nm - have lost the exact meaning they once held. The numbers now refer more to a specific generation of chips, made using a particular technology.
Non- GAAP A numerical measure of a company’s historical or future financial performance, financial position, or cash flows which are not calculated or presented in accordance with the most comparable Generally Accepted Accounting Principles (GAAP) measure
NRE Non Recurring Engineering
NRE Funding
Agreements The Intel NRE Funding Agreements, the Samsung NRE Funding Agreement and the TSMC NRE Funding Agreements
NXE NXE platform; a new platform utilizing the concepts of the TWINSCAN platform with complete new technologies in three areas: light source, lens system, and vacuum body
NXT TWINSCAN NXT systems; an improved version of the TWINSCAN systems, introducing new stages and stage position control technology, which enables improved imaging and overlay
OCI Other Comprehensive Income
OECD Organization for Economic Co-operation and Development Overlay The layer-to-layer alignment of patterning structures
Pattern Fidelity Improving how accurately a structure is printed and transferred compared to the design by use of metrology solutions (e.g. ASML YieldStar), inspection solutions (e.g. HMI e-beam tools) and statistical modeling to guide inspection on the wafer
Patterning The interaction of lithography and resist with etching, deposition, cleaning and metrology in order to produce a pattern on the wafer
Participating
Customers The participants in the Customer Co-Investment Program: Intel, TSMC, and Samsung
Patent Selection As included in the Nikon Cross-License Agreement, a selection of a limited number of the other party’s patents, where the license for such patents expired in 2009, which is subject to a permanent covenant not to sue in respect of patent infringement claims
Pattern Fidelity
Control Measuring how good a structure is printed and etched compared to the structure on the reticle PME Bedrijfstakpensioenfonds Metalektro
Preference Share
Option An option to acquire cumulative preference shares in our capital R&D Research and Development
RDA Research and Development Deduction ("Research and Development Aftrek") REACH Registration, Evaluation, Authorization, and Restriction of Chemicals Recoverable
Amount The higher amount of fair value less costs to sell and value in use