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Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

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Academic year: 2021

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Figure

Fig. 1. Embedding of a MOSFET using pressed metal  foam. (a): the die is soldered on the bottom PCB; (b):
Fig. 2 and Fig. 4 show that the contact between the  foam  and  the  die  top-side  metallisation  are  highly  localised
Fig. 7. Inset: measured characteristic (blue) and model  (red)  of  a  diode,  for  a  given  current
Fig.  10.  Schematic  of  the  press-pack-like  mechanical  set-up used for the tests
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