DATA BOOK LCD CONTROLLER/DRIVER

LCD CONTROLLER/DRIVER LSI DATA BOOK

HITACHI4D

^M24T026

1. This document may, wholly or partially, be subject to change without notice.

2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi's permission.

3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user's unit according to this document.

4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Hitachi's semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from Bi>p!ications based on the examples described herein.

5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd.

6. MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the approprtate officer of Hitachi's sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi's products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS.

INDEX

General Information

LCD Driver

Character Display

LCD Controller/Driver

Graphic Display LCD Driver for Small System

Graphic Display LCD Driver 1 (Negative LCD Power Supply Type) Graphic Display LCD Driver 2 (Positive LCD Power Supply Type)

Segment Display LCD Controller/Driver

LCD Controller

TFT Type LCD Driver

• GENERAL INFORMATION

• Quick Reference Guide··· ... ... 9

• Type Number Order ... 13

• Selection Guide ... ... ... ... ... ... ... ... ... ... ... ... ... .... 14

• Differences Between Products ... 17

• Package Information··· .. 24

• Notes on Mounting ... 31

• The Information of TCP ... 38

• Chip Shipment Products ... 100

• Reliability and Quality Assurance··· ... 123

• Reliability Test Data of LCD Drivers ... 130

• Flat Plastic Package (QFP) Mounting Methods ... 134

• Liquid Crystal Driving M€~hods··· ... 137

• DATA SHEETS • LCD Driver HD44100R LCD Driver with 40·Channel Outputs ... 151

HD66100F LCD Driver with 80·Channel Outputs ... 161

HD61100A LCD Driver with 80·Channel Outputs ... 174

HD61200 LCD Driver with 80·Channel Outputs ... 186

• Character Display LCD Controller IDriver HD43160AH Controller with Built·in Character Generator··· ... 199

HD44780U LCD· II Dot Matrix Liquid Crystal Display Controller/Driver ... 214

HD66702 LCD·II/E20 Dot Matrix Liquid Crystal Display Controller/Driver ... 273

HD66710 LCD·II/F8 Dot Matrix Liquid Crystal Display Controller/Driver ... 334

HD66712 LCD·II/F12 Dot Matrix Liquid Crystal Display Controller/Driver ... 411

• Graphic Display LCD Driver for Small System HD44102 Dot Matrix Liquid Crystal Graphic Display Column Driver ... 489

HD44103 Dot Matrix Liquid Crystal Graphic Display Common Driver ... 511

HD44105 Dot Matrix Liquid Crystal Graphic Display Common Driver ... 519

HD61102 HD61103A Dot Matrix Liquid Crystal Graphic Display Column Driver ... 528

Dot Matrix Liquid Crystal Graphic Display Common Driver ... 556

HD61202 Dot Matrix Liquid Crystal Graphic Display Column Driver ... 580

HD61203 Dot Matrix Liquid Crystal Graphic Display Common Driver ... 612

HD66108 RAM· Provided 165·Channel LCD Driver for Liquid Crystal Dot Matrix Graphics··· 638

• Graphic Display LCD Driver 1 (Negative LCD Power Supply Type) HD66204 Dot Matrix Liquid Crystal Graphic Display Column Driver with 80·Channel Outputs ... 691

HD66205 Dot Matrix Liquid Crystal Graphic Display Common Driver with 80·Channel Outputs ... 706

HD66214T 80·Channel Column Driver in Micro·TCP ... 722

HD66224T Dot Matrix Liquid Crystal Graphic Display Column Driver with 80·Channel Outputs· ... 737

HD66215T Common Driver for a Dot Matrix Liquid Crystal Graphic Display with 100·Channel Outputs ... 751

• Graphic Display LCD Driver 2 (Positive LCD Power Supply Type) HD66106F LCD Driver for High Voltage···· ... 772

HD66107T LCD Driver for High Voltage" ... 787

HD66110RT Column Driver··· ... 807

HD66115T 160·Channel Common Driver Packaged in a Slim Tape Carrier Package··· ... 824

• Segment Display LCD Controller IDriver HD61602/HD61603 Segment Type LCD Driver ... 841

HD61830/HD61830B LCD Timing Controller (LCDC) ... 898

HD63645/HD64645/HD64646 LCD Timing Controller (LCTC) ... 934

• Low Power LCD Chipset HD66503 240 Channel Row Driver with Internal LCD Timing Circuit ... 979

HD66520 4-Level Grayscale Display Column Driver with Internal Bit-map RAM ... 996

• TFfType LCD Driver HD66300T Horizontal DriverforTFf-Type LCD Color TV ... 1027

HD66310T TFT-Type LCD Driver for VDT ... 1088

HD66330T 64-Level Gray Scale Driver for TFT Uquid Crystal Display ... 1108

• LCD MODULE liNE UP Graphic Display LCD Module ... 1129

Character Display LCD Module ... 1130

Graphic Display LCD Module (Reflection type) ... 1132

Graphic Display LCD Module (with EL backlight) ... 1132

Graphic Display LCD Module (with CFL backlight) ... 1132

Character Display LCD Module ... 1134

Character Display LCD Module (with LCD backlight) ... 1134

Segment-Type LDC Module ... 1134

HITACHI SALES OFFICE ... 1136

General

Information

Quick Reference Guide

Type Extension Driver

Type Number HD44100R HD66100F HD61100A HD61200

Power supply for 2.7 to 5.5 4.5 to 5.5 4.5 to 5.5 4.5 to 5.5

internal circuits (V)

Power supply for 13 6 17 17

LCD driver circuits (V)

Power 5 5 5 5

dissipation (mW)

Operating -20 to +75·' -20 to +75·' -20 to +75·' -20 to +75 temperature (DC)

Memory ROM (bit) RAM (bit) LCD driver Common 20

Column 40 (20) 80 80 80

Instruction set

Operation 0.4 2.5 2.5

frequency (MHz)

Duty Statio-ll33 Statio-1/16 Statio-1/100 1/32-1/128

Package FP-60A FP-100 FP-100 FP-100

Chip

Type Column Driver

Type Number HD66204 HD66214T HD66224T HD66106 HD66107T HD66110RT

Power supply for 2.7105.5 2.7105.5 2.5105.5 4.5105.5 4.5 10 5.5 2.7105.5 internal circuits (V)

Power supply for 28 28 28 37 37 40

. LCD driver circuits (V)

Power 15 15 15 15 25 25

dissipation (mW)

Operating -2010 +75·' -2010 +75 -2010 +75 -20 10 +75 -2010 +75 -2010 +75

temperature (OC) Memory ROM (bit)

RAM (bit) LCD driver Common

Column 80 80 80 80 160 160

Instruction set

Opera~on 8 8 8 MHz at5 V 6 8 12MHzat5V

frequency (MHz) 6.5 MHz at3 V 10MHzat3V

Duty 1164-11240 1164-11240 1164-11240 1/100-1/480 1/100-1/480 11100-11480

Package FP-l00 TCP SLiM-TCP FP-l00 TCP SLiM-TCP

TFP100 TFP100

Chip Chip

*1 -40 to +80°C (special request). Please contact Hitachi agents.

*2 Under development

1YfIe Column Drive (within RAM)

1YfIe Number HD44102CH HD81102 HD61202 HD86106T Power supply for 4.5105.5 4.5105.5 4.5105.5 2.7105.5 inlernal circuits (V)

Power supply for 11 15.5 17 15

LCD driver circuits (V)

Power 5 5 5 5

dissipalion (mW)

Operaling -2010+75" -2010 +75 -2010 +75" -2010 +75 temperature (OC)

Memory ROM (bil)

RAM (bil) 200x8 512x8 512x8 165x65

LCD driver Common ^()...65

Column 50 64 64 100-165

Instruclion set 6 7 7 7

Operalion 0.28 0.4 0.4 4

frequency (MHz)

Duty Slalic-1132 Statio-l/64 1132-1/128 1132,1134, 1136,1/48, 1150,1/64, 1/66

Package FP-80 FP-l00 FP-l00 TCP

Chip TFP-l00

Chip

TYpe Segment Display

TYpe Number HD61602 HD61603

Power supply for 2.7 to 5.5 2.7 to 5.5 internal circuits (V)

Power supply for 5 5

LCD driver circuits (V)

Power 0.5 0.5

dissipation (mW)

Operating -20 to +75" -20 to +75"

temperature (OC) Memory ROM (bit)

RAM (bit) 204 64

LCD driver Common 4 1

Column 51 64

Instruction set 4 4

Operation 0.52 0.52

frequency (MHz)

Duty Static, 112. 1/3, 1/4 Static

Package FP-80 FP-80

FPBOA

*1 -40 to +80°C (special request). Please contact Hitachi agents.

*2 Under development

*3 -20 to +75°C in 12 MHz version, -20 to +65°C in 15 MHz version

TFT Column Driver

HD66300T HD66310T HD66330T 4.5105.5 4.5105.5 4.5105.5

15 23 5

160 100 100

-2010+75 -2010 +75'3 -20 10 +75 (-2010+60)

120 160 192

4.8 12115 28

TCP TCP SUM-TCP

HD61604 HD61605

2.7 to 5.5 2.7 to 5.5

5 5

0.5 0.5

-20 to +75" -20 to +75"

204 64

4

51 64

4 4

0.52 0.52

Static, 112, 1/3, 1/4 Static

FP-80 FP-80

Type Common Driver

Type Number HD44103CH HD44105H HD61103A HD61203 HD6620S HD66215T HD66115T Power supply for 4.5 to 5.5 4.5105.5 4.5105.5 '4.5 to 5.5 2.7105.5 2.5 to 5.5 2.5 to 5.5 internal circuits (V)

Power supply for 11 11 17 17 28 28 40

LCD driver circuits (V)

Power 4.4 4.4 5 5 5 5 5

dissipation (mW)

Operaling -2010 +75" -2010 +75'1 -20 to +75" -20 to +75" -20 to +75" -2010 +75 -20 to +75 temperature (OC)

Memory ROM (btt) RAM (bit)

LCD driver Common 20 32 64 64 80 1001101 160 (80 +80)

Column Instruction set

Operation 2.5 2.5 0.1 0.1 2.5

frequency (MHz)

Duty 118. 1112. 118. 1112. Slali0-1Il O. 1/32-1/64 1164-11240 1164-11240 11100-11480 1116. 1124. 1/32.1148 1/64

1/32

Package FP-60 FP-60 FP-l00 FP-l00 FP-l00 SuM-TCP SuM-TCP

Chip TFP100 TFP100

Chip Chip

1\'pe Character Display Controller

HD44780U HD66702R HD66710 HD66712'2

1\'pe Number HD43160AH (LCD-II) (LCD-IIIE20) (LCD-IIIFa) (LCD-II/F12) Power supply for 4.5 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 2.7 to 5.5 internal circuits (V)

Power supply for 11 7 13 13

LCD driver circuits (V)

Power 10 2 2 2 2

dissipation (mW)

Operating -20 to +75 -20 to +75'1 -20 to +75" -20 to +75" -20 to +75 temperature (OC)

Memory ROM (bit) 6420 9920 7200 9600 9600

RAM (bit) 80x8 80 x8.64x8 80x8.64x8 80x8.64x8. 80x8.64x8

8x8 8x8

LCD driver Common 16 16 33 33

Column 40 100 40 60

Instruction set 6 11 11 11 11

Operation 0.2510.375 0.25 0.25 0.25 0.25

frequency (MHz)

Duty 1/8. 1/12. 1/16 1/8. 1/11. 1/16 1/8. 1/11. 1/16 1117. 1/33 1/17. 11338

Package FP-54 FP-80B FP-144A FP·100A TCP

TFP-80 Chip TFP-100

Chip Chip

*1 -40 to +80°C (special request). Please contact Hitachi agents.

*2 Under development

~ Graphic Display Controller

HD63645F HD64645F HD61830 HD61830B HD64646FS

~Number LCDC LCDC LCTC

Power supply for 4.5 to 5.5 4.5 to 5.5 4.5 to 5.5

internal circuits

M

Power supply for LCD driver circuits (V)

Power 30 50 50

dissipation (mW)

Operating -20 to +75 -20 to +75*1 -20 to +75

temperature eC)

Memory ROM (bit) 7360 7360

RAM (bit) LCD driver Common Column

Instruction set 12 12 15

Operation 1.1 2.4 10

frequency (MHz)

Duty Static-1/128 Static-1/128 Static-1/512

Package FP-60 FP-60 FP-80

FP-80B

*1 -40 to +80°C (special request). Please contact Hitachi agents.

*2 Under development

Type Low-Power LCD Chipset

Type Number HD66503 HD68520

Power supply for 2.7-5.5 2.7-5.5

internal circuits M

LCD driver circuits M 28 28

Power 0.5 0.5

dissipation (mW)

Operating -20° to +75° -20° to +75°

temperature (OC)

Memory ROM (bit)

RAM (bit) 76800

LCD driver Common 240

Column 160

Operation 65KHz 65KHz

frequency (MHz)

Duty 1/120,1/240 1/120, 11240

Package TCP TCP

Sorted by Type Name

Type HD43160AH HD44100RFS HD44102CH HD44103CH HD44105H

HD44780UAOOFS/OOTF/Ol FS/

02FSlUB**FSfTF LCD-II HD61100A

HD61102RH HD61103A HD61200 HD61202fTFIA HD61203fTFIA HD61602R1RH HD61603R HD61604R HD61605R HD61830AOOH LCDC HD61830BOOH LCDC HD63645F LCTC HD64645F LCTC HD64646FS LCTC HD66100F/FH HD66106FS

HD66107TOO/Ol/ll/12124/25 HD66108TOO

HD66110RTA8IRTBO/RTBlfTA4 HD66115TAO/l

HD66204F/FLfTFfTFL HD66205F/FLfTFfTFLfTAlfTA2I TA3ITA6fTA7/TA9L

HD66214TA 1I213/619L HD66215TAO/l/2 HD66224TA l/TA2ITBO HD66300TOO HD66310TOOfT0015 HD66330TAO HD66503 HD66520

HD66702RAOOF/00FUOl F/02F/

RB**F/FL LCD-II/E20 HD66710***F8 LCD-II/F8 HD66712 LCD-II/F12

Function Reference Page

LCD controller 199

4O-channel LCD driver 151

5O-channel column driver within RAM 489

20-channel common driver 511

32-channel common driver 519

LCD controller/driver (8 x 2 character)

214

80-channel column driver 174

64-channel column driver within RAM 528

64-channel common driver 556

8o-channel column driver 186

64-channel column driver within RAM 5SO

64-channel common driver 612

Segment display type LCD driver 841

Segment display type LCD driver 841

Segment display type LCD driver 871

Segment display type LCD driver 871

LCD controller 898

LCD controller 898

LCD timing controller (68 family) 934 LCD timing controller (80 family) 934 LCD timing controller (SO family) 934

80-channel LCD driver 161

80-channel column/common driver 772

160-channel column/common driver 787

165-channel graphic LCD controller/driver 638

160-channel column driver 807

160-channel common driver 824

8o-channel column driver 691

8o-channel common driver

706

80-channel column driver 722

l00-channel common driver 751

8O-channel column driver 737

120-channel TFT analog column driver 1027 160-channel TFT digital column driver (8 gray scale) 1088 192-channel TFT digital column driver (64 gray scale) 1108 240-channel row driver with internal LCD timing circuit 979 160-channel 4-level grayscale display column

with internal bit-map RAM

LCD controller/driver (20 x 2 character) LCD controller/driver (8 x 4 character) LCD controller/driver (12

x

4 character)

996 273 334 411

Selection Guide

Hitachi LCD Driver System

Type TFT Full Color System

Color LCD-TV System

Display System lor CRT Compatible

Graphic Display System

Graphic Display System (Bitmap)

Character Display System

Segment Display System

Reference Figure

Screen Size (maxi (800x3)x520 dots

720 x 480 dots

640 x 400 dots

Character 80x16 Graphic 480 x 128 dots

480 x 128 dots

40 Charac- ters

x2 Columns 80 Charac- ters

x 1 Column 25 Digits

xl Column

Lineup HD66310T(Drain) HD66330T(Drain) HD66205(Gate) HD66215T(Gate)

HD66300T(Drain) HD66205(Gate) HD66215T(Gate)

H D63645/64645/

64646(Controller) HD66204(Column)/

66205(Common) HD66224T(Column)/

HD66215T(Common) HD66106F(Driver) HD61100A(Column).

HD61830B(Controller) HD61200(Column) HD611 03A(Common), HD61203(Common)

HD44102(Column)/

61102(Column) HD44103(Common) HD61202(Column) HD44105(Common)/

61103A(Common) HD61203(Common) HD66108 (Column)/Common) HD44780U(LCD- II ) (Controller/Driver) (Controller/Driver) HD44100R(Column) HD66100F(Column) HD66702(LCD- II /E20) HD66710(LCD-1I /F8) HD66712(LCD-1I /F12) HD61602

(Controller/Driver) HD61604 (Controller/Driver) HD61603 (Controller/Driver) HD61605 (Controller/Driver)

Application Personal Com- puter Terminal Work- station Navigation Sys- tem LCD-TV Portable Video

Personal Com- puter, Word- processor, Ter- minal

Laptop Computer, Facsimile, Telex, Copy machine

Laptop Computer, Handy Word- processor, Toy

Electrical Type- writer, Multilunc- tion Telephone, Handy Terminal

ECR, Measure- ment System, Telephone Industrial Mea- surement System

J: ~

o :!:

1.11

Cc~~U;;D?Wfl

160 HD66702

(LCD-II/E20)

, I

HD66712 (LCD-II/F12)

HD61603 HD61605 HD61604

HD66710 HD61602

(LCD-II/F8) HD44780U

H

I

I

^(LCD-II)

I

80

60

40

20

I I

I HD61102 tD61202

I

I HD44102

[COI~mn Driver (Built in RAM)

I I I I I

StStic

I I I I I

1/480 .1/200 1/128 1/64 1/32 1/16 1/8

I

^{1/8 1/16 1/32 1/64 1/128 1/200 1/480}

Duty 1/240 1/100 1/100 Duty 1/240

I HD61103A I HD61203

I

HD66205/

HD662~1~5T~I::::::::::~~

I HD66106F HD66107T/HD66115T

I I

I HD44103 HD441 05

[5O;;;'onDriV~~

20 32

~40 HD44100R

60

I HD66100F I HD61200

IHD61100A 80

HD66204/HD66214T/HD66224T I .. _!6106F

160 Driver Output

[COtum~-Driver HD66107T/HD66110RT

I I

rn

CD

CD n C. o ::s

~ ....

~

Application

Character and Graphic Display

1 character=7 X 8 dot (15 X 7 dot

+

cursor)

Character

8 16

I

^{20 24}

I

³²

I

⁴⁰

I

^OverBO

Line 1

HD66100F 2

3

HD44100R 4

6 to 8

I

12 to 15 HD61200 (Column) + HD61203 (Common)

16 to 25 HD66204 (Column) + HD66205 (Common)

HD66214T/HD66224T (Column) + HD66215T (Common)

26 to 50 HD66106F, HD66107T

HD66110T (Column) + HD66115T (Common)

Graphic Display

Horizontal

48

I

⁹⁶

^I

¹²⁰

^I

¹⁸⁰

^I

²⁴⁰

^I

^{480 Over 640}

Vertical 16

32 HD61202 (Column) + HD61203 (Common)

48 64 128

HD66204 (Column) + HD66205 (Common)

400 HD66214T/HD66224T (Column) + HD66215T (Common) HD66106F, HD66107T

Over 400 HD66110T (Column) + HD66115T (Common)

Note: Applications on this page are only examples, and this combination of devices is not the best.

1. HD66100F and, HD44100R

HD88100F HD44100H

LCD drive circuits 80 20><2

Power supply for internal logic (V) 3 to 6 3 to 13

Display duty Static to 1/16 Static t01 /33

Package 100 pin plastic OFP 60 pin plastic OFP

2. HD61100A and HD61200

HD61100A HD61200

LCD drive circuits common

column 80 80

Display duty static to 1/128 1/32 to 1/128

Power supply for LCD drive circuits (V)

o

to 17 8 to 17 Power supply limits of LCD driver

circuit voltage VCC to Vee

(no limit)

shown in figures below

Resistance between terminal Y and terminal V (one ofV1L, V1R, V2L, V2R, V3L, V3R, V4L, and V4R) when load current flows through one of the terminals Yt to Yeo is specified

V1L.V1R 0

V3L.V3R 0

-

V4L.V4R 0

V2L.V2R

.... ....

under the following conditions:

Vcc-VEE=17V

V1L=V1R, V3L=V3R=Vcc-2/7 (Vee-VEE) V2L=V2R, V4L=V4R=VEE+2/7 (VCC~VEE)

A,rt;A VV AAA v'V

.... Tenninal Y

AAA -(Y, toY .. )

vv

W

Figure 1 Resistance between Yard V Term1nals The following is a des9Iiption of the range of

poWer supply voltage for liquid crystal dis- play drives. Apply positive voltage to V1L=

V1R and V3L=V3R and negative voltage to

-r----==_=_=_=_="_=_

~f'(V1L=V1R)

"-v --- V3 (V3L-V3R)

,,-v

- - - V4 (V4L=V4R) ________ V2 (V2L=V2R) Correlation between Driver

Output Wavefonn and Power supply Voltages for Uquid Crystal Display Drive

v ..

V2L::;V2R and V4L=V4R within the Il.V ran- ge. This range allows stable impedance on driver output (RoN). Notice the Il. V depends on power supply voltage Vee-VEE.

5.5

~

The Range of P _ Supply Voltaga for Uquid Crystal Display Drive

~

^{3 - - - - -}

8 Vee-V •• M Correlation between Power Supply Voitaga Vee-V .. and l>V

Figure 2 Power Supply Voltage Range

3. HD66100F and HD61100A

HD66100F HD61100A

LCD driver circuits =-co=m.:.:.m:.:..:.::.on~ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _

column 80 80

Power supply for LCD drive circuits (V) 3 to 6 5.5 to 17.0

Display duty static to 1/16 static to 1/128

Operating frequency (MHz) 1.0 MHz (max) 2.5 MHz (max)

Data fetch method Shift Latch

Package 1 00 pin Plastic 1 00 pin plastic OFP

OFP (FP-1 00) (FP-100)

4. HD61830 and HD61830B

Oscillator

Operating frequency (MHz) Display duty

Programmable screen size (Max) Other

Package Marking

~3El

HD61830AOO

®

Lot No.

JAPAN

HD61830 Internal 1.1 MHz static to 1/128 64x240 dots (1/64 duty) pin 6:C pin 7:R pin g:CPO

Type No.

®

~3El

HD61830BOO

Figure 3 Package Marking

HD61830B External 2.4 MHz static to 1/128 128 x 480 dots (1/64 duty) pin 6:CE pin 7:0E pin 9:NC

@

Lot No.

JAPAN

Type No.

5. HD61102 and HD61202

Display duty

Recommended voltage between Vee and VEE (V)

HD81102 static to 1/64 4.5 to 15.5

HD81202 1/32 to 1/64 8 to 17 Power supply limits of LCD driver

circuits voltage

Vee to VEE (no limit) shown in following fig- ures

Pin 88

Absolute maximum rating of VEE (V)

DY (output) Vee-17.0to Vee+O.3

NC (no connection) Vee-19.0 to Vee+O.3

Resistance between terminal V and terminal V (one of V1 L. V1 R. V2l. V2R. V3l. V3R. V4l and V4R) when load current flows through one of the terminals VI to V64 is specified under the following conditions:

Vee-VEE=i5V

ViL=ViR, V3L=V3R=Vee-2/7 (Vee-VEE) V2L=V2R, V4L=V4R=VEE+2/7 (Vee-VEE)

V1L.V1R

- - - 0

V3L.V3R - - - < 0

V4L.V4R 0

RON

Terminal V (V, to V84)

V2L.V2R

.---Q..--o---...J\

Figure 4 Resistance between Y and V Terminals

The following is a description of the range of power supply voltage for liquid crystal dis- play drives. Apply positive voltage to ViL = ViR and V3L=V3R and negative voltage to

-,----,....,.-="=

Vee V1 (V1 L=V1 R)

eN V3 (V3L=V3R)

6V

Correlation between Driver Output Waveform and Power supply Voltages for Uquid Crystal Display Drive

V4 (V4L=V4R) V2 (V2L=V2R) VEE

V2L=V2R and V4L=V4R within the AV ran- ge. This range allows stable impedance on driver output (RoN). Notice that A V depends on power supply voltage Vee-VEE.

5.0

3

The Range of Power Supply Voltage for Uquid Crystal Display Drive

Correlation between Power Supply Voltage Vee-VEE and 6V

Figure 5 Power Supply Voltage Range

6. HD61103A and HD61203

Recommended voltage between Vee and Vee (V)

HD61103A 4.5t017

HD61203 8 to 17 Power supply limits of LCD drive

circuits voltage

Vee to Vee (no limit) shown in figures below Output terminal shown in following figure 4 shown in following figure 5

Resistance between terminal Y and terminal V (one of V1L, V1R, V2L, V2R, V5L, V5R, V6L and V6R) when load current flows through one of the terminals Xl to X64. This value is specified under the following conditions:

V1l,V1R 0

V6l,V6R 0

V5l,V5R 0

V2l,V2R

Vee-VEE=17V

V1L=V1R, V6L=V6R=Vee-l/7 (Vee-VEE) V2L=V2R, V5L=V5R=VEE+1/7 (Vee-VEE)

RON

Terminal V (V, to V64)

Figure 6 Resistance between Y and V Terminals Here is a <;I.eseription of the range of power

supply voltage for liquid crystal display drive.

Appiy postive voltage to V1L = V1R and V6L = V6R and negative voltage to V2L = V2R and

L>V

Vee V1 (V1 l, =V1 R) V6 (V6l=V6R)

- - - - V5 (V5l=V5R) V2 (V2l=V2R)

VEE

Figure 7 Correlation between Driver Output Waveform IlIld Power Supply Voltages for Liquid Crystal Display Drive

V5L = V5R within the t:.. V range.

This range allows stable impedance on driver output (RON). Notice that t:..V depends on power supply voltage Vee-VEE.

The Range of Power Supply Voltage for Uquid Crystal Display Drive

3.5---~---

~

2---

>

<J

17

Figure 8 Correlation between Power Supply Voltage Vee-Va and AV

Vll V1R

V6l V6R

V5l V5R

--r:=-

PMOS

PMOS

--r:=-

Vee NMOS

NMOS

Vll.V1R

V6l.V6R~

V5l.V5R

V2l.V2R

V2l V2R

Figure 10 HD61203 Output Termiral

Figure 9 HD61103A Output Termiral

7. HD61602, HD61603, HD61604, and HD61605

HD61602 HD61603 Power supply (Voo) 2.2-5.5V 2.2-5.5V Instruction word 8 bits X 2 4 bits X 4 LCD power supply circuit Yes

Segment terminals 51 64

Display size Static 6 digits + 3 marks 8 digits

frame frequency 33Hz 33Hz

(fosc= 1 00 kHz) 1/2 duty 12 digits + 6 marks - 65Hz

1/3 duty 17 digits 208Hz

1/4 duty 25 digits + 4 marks - 223Hz

HD61604 HD61605 4.5-5.5V 8 bits X 2 4 bits x 4

51 64

6 digits + 3 marks 8 digits

98Hz 98Hz

1 2 digits + 6 marks - 195Hz

17 digits 521 Hz

25 digits + 4 marks - 781Hz

8. LCD-II Family (H044780U, H066702R and H066710)

LCD-II

Item (HD44780U)

Power supply voltage 2.7 V-S.S V

Liquid crystal drive 3.0 V to 11 V voltage VLCD

Maximum display 8 characters digits per chip x 2 lines

Segment display None

Displaye duty cycle 1/8, 1/11, and 1/16

CGROM 9,920 bits

(208: S x 8 dot characters and 32: S x 10 dot characters)

CGRAM 64 bytes

DDRAM 80 bytes

SEGRAM None

Segment signals 40

Common signals 16

Liquid crystal drive waveform A Number of displayed 1 or 2 lines

Low power mode None

Horizontal scroll Character unit CPU bus timing 2 MHz (S-V operation)

1 MHz (3-V operation)

Package QFP1420-80

80-pin bare chip

Common

n _{!LJ ...}

^r1

^rll !L1 ... L

ⁿ

^r'l

I !

I I

I I ·

Segment

lfLfLJll1J1Jl1l

I ,

I ,

Dnnnnnn

Common-segment

I U ^u

^~

U

^{U U}

L

I ,

I ,

L. .. :

I 1 frame I

Figure 11 Waveform A (1/3 Duty, 1/3 Bias)

LCD-II/20 LCD-II/Fa

(HD86702) (HD86710)

S V±10 % 2.7 V-S.S V

(standard)

2.7 V-S.S V (low voltage)

3.0 Vto 7.0 V 3.0 V to 13.0 V 20 characters 16 characters x 2 lines/

x 2 lines 8 characters x 4 lines

None 40 segments

1/8, 1/11, and 1/16 1/17 and 1/33 7,200 bits 9,600 bits (160: S x 7 dot (240: S x 8 dot characters and characters) 32: S x 10 dot

characters)

64 bytes 64 bytes

80 bytes 80 bytes

None 8 bytes

100 40

16 33

B B

1 or 2 1,2, or 4

None Available

Character unit Dot unit

1 MHz 2 MHz (S-V operation)

1 MHz (3-V operation) LQFP2020-144 QFP1420-100 144-pin bare chip 100-pin bare chip

common!l----lJiL-Jl , ,

^I ,

I ,

I I

: I' :

Segment

I !--I ----II

I ~ ^:

Common-segment

,

I I

'...

_{1 frame}

..:.

_{: 1 frame}

..:

I _:

Figure 12 Waveform B (1/3 Duty, 1/3 Bias)

9. HD66204, HD66214T and HD66224T

HD86204 HD86214T HD86224T

Datainput (bit) 4 4 4/8

Packge 100-pin plaslic QFP TCP TCP (8mm)

FP-l00, TFP-l00 Die

10. HD66205, HD66215T and HD66115T

HD866205 HD86215T HD86115T

LCD drive circuits 80 100/101 160

Power supply for LCD drive circuits (V) -10to-28 (Vee -Vee) -10to-28 (Vee -Vee) +14to +40 (VLco-GND)

11. HD66106F and HD66204

HD86106F

LCD drive circuits voltage + 14 to +35 (VLco-GND)

Display Duty 1/100 to 1/400

Operating frequency (MHz) 6.0 MHz

Function column and common driver

12. HD66106F, HD66107T and HD66110RT

HD66106F HD86107T

LCD drive circuits 80 160

Data transfer 4-bits 4/8-bits

Operating frequency (MHz) 6 8

Power supply for LCD drive circuits 14 to 37 14 to 37

Packge 100-pin plastic TCP

QFP (FP-l00A)

13. HD63645, HD64645 and HD64646

CPU interface Package Other

HD63645F 68 family 80-pin plastic QFP (FP-80)

HD64645F 80 family 80-pin plastic QFP (FP-80)

HD66204 -10 to -28 (Vee-Vee) 1/64 to 1/200 8 MHz column driver

HD66110RT 160 4-bits/8-bits 12 28 to 40 TCP (9mm)

HD64646FS 80 family 80-pin plastic QFP (FP-80A)

HD64646 has another LCD drive interface in HD64645

Package Information

Package Information

The Hitachi LCD driver devices use plastic flat packages to reduce the size of the equipment in which they are incorporated and provide higher

density mounting by utilizing the features of thin liquid crystal display elements.

Package Dimensions

Scale: 312 FP-54

25.6:t0.4

"-

OUt

0.35:t0.10

!H

¹¹¹

0.15 ⁰

.... ...

_G! ^{N l:}

-

0

Code FP-54 EIAJ

JEDEC HD43160AH

Applicable LSI

FP-60

25.UO.4

O.35tO.10 0.15

Applicable LSI

FP-60A

24.B±0.4

Applicable LSI

:z: ~

N N

en

- ^o

HD44103, HD441 05, HD61830, HD61830B

N

o

HD44100R

Code FP-60 EIAJ

JEDEC

Code FP-60A EIAJ SC-582-F JEDEC

FP-80

Applicable LSI

FP-80A

...

_o

+t N

....

-

Applicable LSI

17 2:t0 3 014

60 41

61

\

80

,

0~:t0.10Jl ....

_0.131M!

- ..

Code FP-80A EIAJ

JEDEC HD61602, HD61603, HD61604, HD61605, HD63645, HD64645, HD44102

40

21 20 "'"

....

~ 0

-

..

j

T

)(

..

:E

1ft 1ft o

HD61602

1.6

Code EIAJ JEDEC

FP-80A

FP-80B

Applicable LSI

TFP-80

:-;!

+t

"!

1ft

-

60 61

80

0.SO:t0.10 0 0

Applicable LSI

HD64646, HD44780U

40

21

I ..

:t

HD44780U

1ft

..

o

_+t

... d

Code FP-80B EIAJ

JEDEC

Code TFP-80 EIAJ

JEDEC

FP-100

Applicable LSI

FP-100A

Applicable LSI

- ..

^'.7tO.3

Code FP-100 EIAJ

JEDEC HD61100A, HD61102, HD61103A, HD66204, HD66205, HD61200, HD61202, HD61203, HD66100F

HD66106F, HD66710

Code FP-100A EIAJ

JEDEC

Applicable LSi

TFP-100

...

o +I

'"

III

-

76

100

0.50±0.10

Applicable LSI

15 6:1:03 :]14.0

75 51

~.J

_0.101M! ²⁵

0.80

0.30

Code FP-100B EIAJ

JEDEC

HD66100F

50

~1

'I' 26

~iMi'ii.i.ii.i.i ^•• I~

Code TFP-100 EIAJ

JEDEC

HD66204, HD66205, HD61202, HD61203

FP-144A

:;l

+t o

N N

109

144

Applicable LSI

22 otO 3 020 108

~0.08111!!J1

73

36 72

~

37

....

....

1.0iO.2

rtiiiiiiiiiiiiq~

^0-(

...

o cO +t N

;;;

HD66702

0.5 O.stO.l

Code FP-144A EIAJ SC-596-A JEDEC

Notes on Mounting

1. Damage from Static Electricity

Semiconductor devices are easily damaged by static discharges, so they should be handled and mounted with the utmost care. Precautions are discussed below.

1.1 Work Environment

Low relative humidity facilitates the accumulation of static charge. Although surface mounting pack- age devices must be stored in a dry atmosphere to prevent moisture absorption, they should be handled and mounted in a work environment with a relative humidity of 50% or greater to prevent static buildup.

1.2 Preventing Static Buildup in Handling

1.

Avoid the use of insulating materials that easily

accumulate a static charge in workplaces where mounting operations are performed. In particu- lar, charged objects can induce charges in semi-

conductors and fmished PC boards even without direct contact. Recommended measures include the use of anti-static work garments, conductive carrier boxes, and ionized air blowers.

2. Ground all instruments, conveyors, work bench- es, floor mats, tools, and soldering irons to prevent the accumulation of static charges. Lay conductive mats (with a resistance on the order of 10⁹ Cl to 1011 Cl) on workbenches and floors and ground them. (See figure 1.)

3. Personnel should wear grounding bracelets on . their arms or legs. To prevent electric shocks, insert a resistor of 1 Mil or greater in series as shown in figure 2.

4. If soldering irons are used, use low voltage (12 V to 24 V) soldering irons designed for use with semiconductors. Ground soldering iron tips as shown in figure 3.

<D

High resistance conductive mat (grounded)

®

Personal ground (bracelet)

@ High resistance conductive mat (grounded)

@ Humidifier

@ Anti-static work clothes

®

Anti-static shoes

Figure 1 Static Electricity Countermeasures for Semiconductor Handling

1.3 Preventing Semiconductor Discharges

Semiconductors are not damaged by static charges on the

package

or chip itself. However, damage will occur

if

the lead frame contacts a metal object and the charge dissipates.

Grounding the

metal object does not help in this situation.

The following measures should be taken.

1.

Avoid contact or friction between semiconduc- tors and easily charged insulators.

2.

Avoid handling or working with semiconductors on metal surfaces. Semiconductors should be handled on grounded high resistance mats.

3. If

a semiconductor may be chaIged,

do

not allow that device to contact any metal objects.

lA Precautions during Mounting

1.

Grounded high resistance mats must be used when mounting semiconductors on PC boards.

Ground mats before handling semiconductors.

Particular caution is

required

following conduc- tivity testing, since

capacitors

on

the

PC board may.retain a chaIge.

2. PC

boards can

also acquire a static charge by contact, friction, or induction.

Thke

precautions to prevent discharge through contact with

trans-

port boxes or other metal objects during

Irans-

portation. Such precautions include the use of anti-static bags or other techniques for isolating the PC boards.

Metal or conductive material

Insulated

wire

Figure 1 Personal Ground

100VAC$

cf ^~II

^12Vto24V

Figure 3 Soldering Iron Grounding Example

2. Precautions Prior to Reflow Soldering

Surface mount packages that hold large chips

are

weaker than insertion mount packages. Since the whole package is heated during the reflow opera- tion, the characteristics described below should be considered when determining the handling used prior to reflow soldering and the conditions used in thereflow operation.

2.1 Package Cracking Mechanism in Reftow Soldering

Packages that have absorbed moisture

are

thought to crack due to the mechanism shown in figure 4.

Moisture absorbed during storage diffuses through the interior of the package. When a package in this state is passed through the reflow furnace, that moisture rediffuses. Some of it escapes along the boundary between the resin and the frame. This

can

lead to boundary separation. As the pressure in this space increases the resin warps, finally result- ing in a crack.

The Fick diffusion model

can

be used to calculate the diffusion of moisture in resin:

The volume of moisture absorbed by the package

can

be expressed as follows:

Q

(t)

= JC

^{(x, t) dx}

The increase in internal pressure

can

be calculated from the moisture diffusion during reflow heating by using the C (x, t) function.

Figure 5 shows the relationships between the maxi- mum stresses when packages of various moisture absorption states

are

heated, the adhesion strength between the resin and frame at various tempera- tures, and the strength of the resin itself. While this model indicates that cracks will result in this example when the moisture absorption ratio exceeds 0.2 wt% in a VPS (vapor phase soldering at 215°C) process, actual tests show that cracks result in packages with a.moisture absorption ratio of 0.25 wt%. This indicates that the model is valid.

Therefore moisture management should focus on the moisture content in the vicinity of the frame.

EJ ---~----

• .1£... _ 0

rrc

at

ax

²

c: Package Internal moisture density

0: Water diffusion coefficient

• 1 molH~

--+ 22.4.ellatm

• pV=nRT

• o(T»fad(T)

fad: Resin bonding strength 0: Generated stress

• W^max = a Eha4 3 P a: Form coefficient E: Resin Young's modulus P: Internal pressure a: Tab shorter dimension h: Thickness olthe resin

under the tab .om .. ->F(T)

a² om ..

=

Bt;2 P F (T): Resin strength

p: Form coefficient

Figure 4 Package Crack Generation Mechanism

10 10

~ 8

,

j

I ^I 8

I! I

1S _I

~ 6 ^I 6

'8t<'

/(OMLX)SAT

11 ~ I

~~

^I

i-=

^{4 4}

Ie

^MOisture absorption ratio

.~ (85°C 85%RH)

1

²

s:: ___

^{0.3 wt 2}

:i

^0.2wt

0 0

100 150 200

Temperature (OC)

!~ i

ii _e=

1!!?

FigureS Temperature Dependence of Resin Adhesive Strength, Mechanical Strength, and Generated Stress

3. Recommended Soldering Conditions

Soldering temperature stipu1ations must be fol- lowed and the moisture absorption states of plastic packages must be carefully monitored to prevent degradation of the reliability of surface mount packages due to thermal shock. This section pre-

sents Hitachi's recommended soldering conditions.

3.1 Recommended Soldering Temperatures See table I.

18ble 1 Recommended

Ie

Soldering Temperatures Method

Vapor-phase reflow

Infrared reflow Hot-air reflow

Recommended Conditions

~l!! _ii1

:::J

GIl!

30s,

a'_t ^~

~

' \ About 60

s

1 to 5°C/s

Time

235OC, maximum

1 to 50Cts Time

10 s,

Notes

Since TSOP, TQFP, and packages whose body thickness is less than 1.5 mm are especlally vulnerable to thermal shock, we recommend limiting the soldering conditions to a maximum temperature of 230°C for a maximum time of 10 seconds for these packages.

4. Moisture Absorption Prevention Conditions

Plastic packages absorb moisture when stored in a high humidity. If devices are mounted using solder reflow techniques when they have absorbed mois- ture they are susceptible to reflow cracking.

Products that are particularly susceptible to the influence of absorbed moisture are packed in moisture-proof packing. These products should be handled under the following conditions after opening the moisture-proof packing.

4.1 Storage and Handling after Opening Moisture-Proof Packing

Storage temperature:

SoC

to

30°C

Storage humidity: Under 60% relative humidity Time between unpacking and reflow soldering:

1. If specified on the label attached to the moisture-proof packing, or in the delivery specifications: follow those specifications.

2. If not specified on the label attached to the moisture-proof packing or in the delivery speci- fications: perform reflow soldering within 168 hours (one week) with the product stored under the conditions specified above.

4.2 Baking

4.2.1 Baking is Required in the Following Situations

1. If the desiccant indicator has turned pink.

2. If the storage period following unpacking exceeds the specifications for that period.

4.2.2 Recommended Baking Conditions 1. TSOP and TQFP:

12Soe

for 4 hours

2. Packages other than TSOP and TQFP:

125°C

for 16 hours to 24 hours

3. If specified in the delivery specifications or other documentation, follow those specifications.

4.2.3 Other Points

Use heat-proof trays in the baking operation.

Surface Mounting Package Han- dling Precautions

1. Package temperature distribution The most common method used for mounting a surface mounting device is infrared reflow.

Since the package is made of a black epoxy resin, the portion of the package directly exposed to the infrared heat source will absorb heat faster and thus rise in tempera- ture more quickly than other parts of the package unless precautions are taken. As shown in the example in figure 6, the surface directly facing the infrared heat source is 20' to 30'C higher than the leads being soldered and 40' to 50'C higher than the bottom of the package. If soldering is performed under these conditions, package cracks may occur.

To avoid this type of problem, it is recom- mended that an aluminum infrared heat shield be placed over the resin surface of the package. By using a 2-mm thick aluminum heat shield, the top and bottom surfaces of the resin can be held to 175'C when the peak temperature of the leads is 240'C.

(Resin) Infrared rays

300

~~SU~

'TS

^{T2 T,}

250 (Solder)

U ~

e

²⁰⁰

::J

~

.,

Co 150

$ E

100

time (sec)

Figure 6 Temperature Profile During Infrared Heat Soldering (Example)

2. Package moisture absorption

The epoxy resin used in plastic packages will absorb moisture if stored in a high-humidity environment. If this moisture absorption becomes excessive, there will be sudden vaporization during soldering, causing the interface of the resin and lead frame to spread apart. In extreme cases, package cracks will occur. Therefore, especially for thin packages, it is important that moisture- proof storage be used.

To remove any moisture absorbed during transportation, storage, or handling, it is recommended that the package be baked at 125'C for 16 to 24 hours before soldering.

3. Heating and cooling

One method of soldering electrical parts is the solder dip method, but compared to the reflow method, the rate of heat transmission is an order of magnitude higher. When this method is used with plastic items, there is thermal shock resulting in package cracks and a deterioration of moisture-resistant characteristics. Thus, it is recommended that the solder dip method not be used.

Even with the reflow method, an excessive rate of heating or cooliIig is undesirable. A rate in temperature change of less than 4'C/

sec is recommended.

4. Package contaminants

It is recommended that a resin-based flux be used during soldering. Acid-based fluxes have a tendency of leaving an acid residue which adversely affects product reliability.

Thus, acid-based fluxes should not be used.

With resin-based fluxes as well, if a residue is left behind, the leads and other package parts will begin to corrode. Thus, the flux must be thoroughly washed away. If cleans- ing solvents used to wash away the flux are left on the package for an extended period of time, package markings may fade, so care must be taken.

The precautions mentioned above are gen- eral points to be observed for reflow. How- ever, specific reflow conditions will depend on such factors as the package shape, printed circuit board type, reflow method, and device type.

For details on surface mounting small thin packages, please consult the separate man- ual available on mounting. If there are any additional questions, please contact Hitachi, Ltd.

Features of TCP (TAB Technology)

The structure and materials used by Tape Carrier Package (TCP) give it the following features as compared with conventional packages:

Thin, Lightweight, and Fine Pitch

With thickness less than 1 mm and fme-pitch leads, a reduced pad pitch on the device enables more functionality in a package of equivalent size.

Specifically, these features enable:

• Thin and high defmition LCM (Liquid Crystal display Module)

• Lightweight and ultra-high pin count systems

Flexible Design

The following can be tailored to the design of the system (e.g. motherboard design):

• Pattern layout

• TCPdesign

TCP Applications

Thinness, ultra-high pin count, and fme pitch open up new possibilities of TCP applications for com- pact and highly functional systems. Figure 1 shows some applications of TCP-packaged chips.

Personal computers;

word processors

LCO*driver LCOmodules Calculators and

organizers

Memory Workstations

Computers

Figure 1 Examples of TCP.Packaged Chip Applications