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Optimization of demolding temperature for throughput improvement of nanoimprint lithography

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Academic year: 2021

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Fig. 3 shows the cross-sectional profile evolution for an annealing time varying from 1 to 500 s
Fig. 3 shows that resist reflow was very sensitive to annealing time. Similar characterizations were carried out
Fig. 5. Feature height variation with respect to annealing time. A post demolding baking at 80, 90, 110 and 110  C were performed onto the printed lines.

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