Towards a reliability analysis method of wide band gap power electronic components and modules

This is an author-deposited version published in:

http://oatao.univ-toulouse.fr/

Eprints ID: 10705

To cite this version:

Parent, Guillaume and Massiot, Gregor and Rouet, Vincent and Munier,

Catherine and Vidal, Paul-Etienne and Carrillo, Francisco Towards a

reliability analysis method of wide band gap power electronic components

and modules. (2013) In: European Microelectronics and Packaging

Conference , 09 September 2013 - 12 September 2013 (Grenoble, France).

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Toward a Reliability Analysis Method of Wide Band Gap Power

Electronic Components and Modules



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1 Introduction 

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2.2 Destructives analyses (DA)



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5 Accelerated ageing tests considered 

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6 Conclusion 

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7 References

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