T A within operating temperature range, Vss = +5.0V ±5%, V GG = Voo = -12V ±5%, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Voltage Levels
Logical "1" IL = 1.6 mA sink .4 V
Logical "0" IL = l00pA source 2.4 V
Input Voltage Levels
Logical "1" Vss - 4.0 V
Logical "0" Vss - 2.0 V
Power Supply Current
Iss (Note 4) Vss = 5, VGG = -12, VLL = -12, TA = 25°C 23 37 mA
Iss (Note 4) Vss = 5, VGG = -12. VLL = -3.TA =125°C 20 mA
Input Leakage VIN = Vss - lOV 1 jlA
Input Capacitance (Note 1) f= 1.0 MHz, V
,N
= OV 5 15 pFOutput Capacitance (Note 1) f= 1.0 MHz. V
,N
=OV 4 10 pFAddress Time (Note 2) TA = 25°C, Vss = 5 150 700 900 ns
T ACCESS VGG
=
V Ll = -12VOutput AND Connections (Note 3) 20
Note 1: Address time is measured from the change of data olJ any input or Chip Enable line to the output of a TTL gate.
(See Timing Diagram.) See curves for guaranteed limit over temperature.
Note 2: Capacitances are measured periodically only,
Note 3:. The address time follows the following equation: T ACCESS
=
the specified limit + (N - 1) x 25 ns where N=
Number of AND connections.Note 4: Outputs open.
Note 5: All addresses and outputs are in negative true logic with the exception of LO. Ll. and L2 which are in positive logic.
performance characteristics
1400 1200 1000
J800 .
.... BOO 400 200
Typical Access Time vs Supply Voltage
VLL '" VGG
tZ5°C IT.=71I"C 25°C
1&.2 11.0 11.8 Vss + IVGG I IV)
Powe, Supply Current
VI Temperature
811 H
~1=l+l+fi;-;:ri~"1
Vss=5.OV10~~~~~tv~G;G:=~VL~L~=~-I~ZV~
BO
~++tt~++tt~
-5°B
1
40 MAXIMUM~ 30
TYPICAL ZO
10
-50 -25 0 25 50 15 100 125 TEMPERATURE 1°C)
timing diagram/address time
Eo"
EOUT
1400
Guaranteed Access Time vs Supply Voltage
1200 IZ5°C
~.= 10°C _ 1000 Z5°C
.! or; 800 ....
&00 400 200
16.2 11.0 11.8 Vss+IVGol (V)
Powe, Supply Current
V5 Voltage
&0 C 50 .540
~ 30 20 10
IB.2
TIME
MAXIMUM TYPICAL
11.0 I1.B Vss + IVoG I (V)
3-61
RAMs
MM1101lMM110111MM1101A/MM1101AlIMM1101A2, MM4250 256-bit fully decoded static random access memory
general description
The MMll0l family of fully decoded 256 word x l-bit random access memories are monolithic MOS integrated circuits using silicon gate low threshold technology to achieve bipolar compatibility. They are static, require no clocks, and hold information indefinitely, subject to the integrity of the power supply voltages.
features
• Fast access times MMll01A2 500 ns max 1.0 j.ls max 1.5 j.lS max 650 ns max MM 11011, MM 11 01 A 1
MMl101, MMll01A MM4250
• Improved speed/power product MM1101A2 1/3 of 1101A 1.5 mW/bit
• Low power operation
block and connection diagrams
A, A, A, A,
DATA OUT
DATA OUT
cs
RIW DATA IN
10
,
11
13
14
16 15 12
X INPUT BUffERS
OUTPUT BUffER
Vee'" PIN 5 Vo"'PIN4 Voo '" PIN 8
Z56 BIT RAM PLANE
• Fewer system components - bipolar compatible input and output
• Secondsourceflexibility-MMll0l, MMll01A MM11011, MM1101A 1 second sources avail-able
• TRI-STATETM output - wired OR capability
• Specified ambient temperature O°C to + 70°C, for MMll01 family; _55°C to +125°C for MM4250
applications
• High speed buffer memories
• Local memory store
Dual-In-Line Package
INPUT As 1 16 CHIP SElECT
INPUTA7 2 15
READIWRITE INPUT A& 3 14 DATA OUT
Vo 13 DATA OUT
V~ 12
DATA IN
INPUT A4 11
INPUT A3
INPUT Ao 10
INPUT A,
Voo
,
INPUT A2
TOP VIEW Order Number MM1101 D, MM1101AD. MM1101A1D, MM1101A2D, MM11011D
or MM4250D See Package 3 Order Number MM1101N.
MM1101AN. MM1101A1N.
MM1101A2N or MM11011N See Package 15
4-1
absolute maximum ratings
All Input or Output Voltages with Respect to the Most Positive Supply
Voltage, V ss +0.3V to -20V
Supply Voltages Voo and Vo with -16V
Respect to Vss
Power Dissipation at Room Temperature Operating Temperature
MMll0l Family MM4250 Storage Temperature
Lead Temperature (Soldering, 10 sec)
dc characteristics
SYMBOL TEST CONDITIONS
MIN TVP MAX
I " Input Load Current VIN = 0.0 0.001
(All Input Pins)
"0 Output Leakage Current VOUT = O.OV, CS = Vss - 2.0V 0.001
r
Power Supply Current, Voo"-~' )
Read Cycle MMll0l, MMll01A 1.5
MMll0ll, MMll01Al 1.0
MMll01A2 500.0
MM4250 650.0
,~ Address to Chip Select Delay MM1101, MMll01A, MM11011, MMll01Al MMll01A MM4250
'.
Access Time MMll0l, MMll01AMMll0ll, MMll01Al
Note 3: Capacitances are measured periodically only.
TYP
ac characteristics (con't)
WRITE CYCLE IMM1101, MMll0l1, MM1101A, MM1101Al, MMll01A2)
SYMBOL TEST MIN TYP
MAX UNITS
INote 2)
twe Write Cycle O.B iJ.S
two Address to Write Pulse Delay 0.3 iJ.S
twp Write Pulse Width 0.4 iJ.s
tow Data Set up Time 0.3 iJ.S
'OH Data Hold Time 0.1 iJ.S
WRITE CYCLE IMM4250)
'wo Write Cycle 1.0 iJ.s
'wd Address to Write Pulse Delay 0.35 iJ.S
twp Write Pulse Width 0.50 iJ.S
'dw Data Set-up Time 0.35 iJ.S
'dh Data Hold Time 0.15 iJ.s
CHIP SELECT AND DESELECT IMM1101, MMll011, MM1101A, MMll01Al, MM1101A2, MM4250)
'ew Chip Select Pulse Width 0.4 iJ.S
'cs
Access Time Through Chip 0.2 0.3 iJ.SSelect Input
teo Chip Deselect Time 0.1 0.3 iJ.S
Note 1: All voltage measurements are referenced to ground.
Note 2: Typical values are at T A ::= +25°C and nominal supply voltages.
Note 3: Capacitances are measured periodically only.
Note 4: Maximum value for tac measured at minimum read cycle.
typical performance characteristics
MM1101A, MM1101A1,
Typical Access Time vs Typical Access Time vs MM1101A2, MM4250
Voltage Temperature Operating Region
MM1101A
VDO-Jovr
1400 TA -25"C1000 Vcc - 5.0V
t7yoo',-9V,C
1200 Cl =20 pF 18!
800 Vuo--IV'"
1 TTL LOAD MM1101A,-:- I-Q ..
;Df>--UIV ..s 1000 MM1101Ai 11!i!
100 MM1101Aj~ ~!i!
-~~
16;: rs!-~" ;: 800 C> TYPICAL OPERATING
~
600 ~:~~~~~ ~
.voo--g~_=t±~
600- ...
- t - ~ ~ > o 15 14 - l -- I -I
,,"GUARANTEE REGION.l17V1
..
400 • Voo-1 .... v ~,
_ OPi~ATINGt: :.l
r+~;ov
VDD --9V "- 400 ~ ~ 13 12-t
REGIONl' 200 1-- MMll01A2,MM4250 - l -
I
200 ~VDD~-'V
" .
11I I
-1 -6 -9 -10 -11 -30 -10 10 30 50 10 8 10 12 14 16
Vo (V) TEMPERATURE 1°C) Vss- VOD (VI
ac test circuit
Test Setup for MM1101A and MM1101A Speed Measurement 'SV
ADDRESS
Iv~ IVD IVDD
oATA.. v
+3:n
INPUT MM1101A MMll01/ OUTPUT 1 OUTPUT,~
ANYCONDITIONS OF TEST
C,
-=
tTL GAT.Input pulse amplitudes: OV to +5.0V.
Input pulse (lse and fall times:::; 10 liS.
Speed measuremelltsare referenced to the 1.SV level (unless otherwise noted);
at the OUt(:lllt of the TTL gate (t"" s; 10 ns) Cl So 20 pF.
4·3
... 0
"'\,0 c(N
oo:t
;::E :E:E :E .
... N
C(C(
...
0 0
...
...
:E:E :E:E
... ... ... o ... ...
:E :E
...
... o
... ...
:E :E
switching time waveforms
Read Cvcle Chip Select and Deselect
I---,,,---~.j
AEAO/WRITE
ADDRESSES
'-v-i(
.~~l
(r:r- ____________
~______ __
________ '_':r-L
AODRESSES
'.---IJT-r-OUTPUTS
OUTPUTS
. ---'
Write Cvcle Power Switching For Reduced Power Applications
ADDRESSES
ADDR,SSES :
--r ____________________ _
---./~2:'Dns
v" ---7.:~
Vo AND CS LEAD V.
REAOIWRITE ',<,:; lOOns
OUTPUTS
DATA IN
Voo :-9Vt5"
Note 1: All inputs of the MM1101 A accept standard TTL outputs with Vce = +5.0V ±5%.
Note 2: Maximum value for tAC measured at minimum read cycle.