MANUAL Memory

STD 7000 7701

16K Static Ram Memory Card

USER'S MANUAL

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7701

16K Static Ram Memory Card USER'S MANUAL

10/81

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7701 16K STATIC RAM MEMORY CARD USER~S MANUAL

SECTION SECTION 2 SECTION ₃ SECTION 4 SECTION ₅ SECTION 6 SECTION 7 SECTION 8 SECTION 9 SECTION 10 APPENDIX A

TAB LEO F CON TEN T S

Data Sheet

Functional Description Card Address Mapp i,ng

Read, Wri te, and Bus Control Electrical Spec if i cat ions Mechanical Specificqtions

2114 1024 x

4

Bit Stat i cRam Description Schematic

Assemb 1 y Drawing

Ser i es 7000 Memory Card Timing

Plan #133 Thermal Application Note For Microprocessor Systems Using STD/Series 7000 Cards

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u@@@ 7701

~l(lc') [~;)UJJ®~~~~~~~~--~-·-·:MEMORY CARD

16K BYTE STATIC RAM MEMORY CARD

This card provides sockets for up to 16,384 bytes of Read-Write or PROM Memory. The card uses 2114 type RAMs or equivalent and has sockets for 16 pairs of RAMs. Alternately the card wi" accept 3625 type PROMs or equivalent. PROMs and RAMs can not be mixed on the same card.

The 7701 decodes 16 address lines, and can be mapped into either 8K or 16K bytes of consecutive address space. An on-card jumper system allows users to establish which 16K segment of a 64K microprocessor memory each 7701 occupies.

FEATURES

• Sockets for 16K bytes of 2114L RAMs or 3625 PROMs

• User selectable card address

• All STO BUS lines buffered

• Minimal logic bus loading

• All Ie's socketed

• Single +5V operation

• Use Pro-Log 01004, 1Kx8 memories (two 2114L's)

II ^3-STATE _BUS

DATA BUS

Do-D7 I CONTROL

¢ Q4

MEMRQ"

RD"

WR"

MEMU"

ADDRESS A13-A15

ADDRESS A10-A12

ADDRESS Ao-A.

)

,.

-

^READ

,. _{CONTROL WRITE}

-

~

-

^CARD

3/ ^SELECT P-

DECODER I

l

CHIP 1.0..

SELECT r-

31 ^DECODER

,

101 I BUF

11K STATIC RAM

SHADING INDICATES SOCKETS ONL Y

$ i,e liM' au

= ... -

"\

11/

,

101

,

1

DATA 1/

,

RAM ARRAY IK.I

""IW

DATA

~

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IKd ^{•• AV} -RIW

DATA

HU

/ - I l l '" ADORE I I

/

7701

"INDICATES ACTIVE LOW LOGIC

2. FUNCT10NAL DESCRIPTION

The 7701 1s organized to accept 16 pair (32 sockets) 2114L 1024 x 4-bit statis RAMs. 'Although the card may be populated with less than the full complement of 21l4L chips, the data bus drivers are enabled anytime a valid address is present even if memory chips are not plugged in. The card

address range is chosen to prevent bus contention with other system memory elements including processor on-card memory, other memory cards, and memory mapped I/O. Each pa i r of the 211lll's add 1 K 8-b it bytes of RAM, wh i ch are designated memory blocks 0 -15 (MBO - MB1S).

Each memory block consists of2 each (1024 x4) 2l14L RAMs. (Reference Assembly Diagram 102687)

PROM OPTION

; \.. v 11.) ""

~ ~

(V

2..0:;:

..

-~~----~

________ 1 r----...-..-- ...

^~---~

- ... _-,

, (v I~) ,v,,~+

.

^{<VLlj ,}

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--- -

^----~

I (VIi) M BS (V2.~;

~---

_r----~~

- ---t

... - . j , (YI S) N\ ~~ (\.t l..l) ,

~--- ... ---~.J

, ... . - ... . . . - . _ ... 1 - - - 1

: tUI'-) M117 (V:l.4):

~-^{v(' P (:: ~}

---..,.

"-o"""~"

r---M"Bi ----,

~ LV lS) lU33) :

.. --- ---4

., ^{- ---} -...---- --

^{..-~ .-~,}

'''\l~ f (,

+

~~~) _~J~_:J

1--' -- ..-. ~~ - ~ ... _ ,

'(\I 1.'1) M ~ '0

(...J as) ,

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..:--- ---"

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,2: -;-37):

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r --- ... - -- ... .-...- ---;

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'1 C'" t

~)

;

.-- ^,---

I(\J~\) 1V1I~J"\-^{... ---~}

^{- ---}

^{. -}

^{... ---}

^{- .} (v~q) ^---.

^.---_,

^I

~-_, _ _ _ _ ~--l

r---,

I (U'l'l.) ~AB 1.5 (1I~~ I

~---.

-..J

\I f~'~(\' ~C'.y~\\...

The card is designed to accept type 3625 PROMs in place of 2114 RAMs with an increase in card power consumption. PROMs and RAMs may not be mixed on the same card. If this option is exercised be sure to cut traces and ground pin

10 of all ch ips.

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3. CARD ADDRESS MAPPING

0000 3FFF 4000 7FFF 8000 BFFF COOO FFFF

o =

^SX1~ (Lower 8K)

Sy~,: (Upp'e r 8K) 16K BANKfl

=

SELECT CARD SELECT

~ ADDRESS RANGE

'A'tsn4* ~

{ SO 0000"1 FFF S 1 2000 -t 3FFF

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0 0 001

{ S2 4000 +5FFF

S3 6000~7FFF

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1 0

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1 1

{ S4 8000 +9FFF - sx~'~

S5 AOOO ."BFFF --Sy~;~

1 0 0 1 0 1

{ S6 COOO -+DFFF S 7 EOOO ..,. FFFF 1 1 0

1 1 1

CARD SELECT DECOD I NG 74LS42 (U4)

Lower 8K Upper 8K

The upper three (A15, A14, A13) address lines are decoded by an 74LS42 (U4) for card address selection. A15 and A14 are decoded to select one of the four 16 banks. Address line A13 is decoded for selection of the lower 8K

(SX*) and the upper 8K (SV*) of the 16K bank.

14-1...S+~

I'IIt"'~~@-~ ^D (IJ~)

II 0 -

16

} C (:,'<> '"

~.

f I"Ff

AI5

^@

^,~

c. s"

S5

~'4.@-~-.

^{'4, & .sc,...}

~ ~

()()<:) ""

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S~

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^{IS A .$2..}

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SY

*"

0PflE1< ~K ~t£eT\~

4 - - - . - - - - ; ; ... .s X)t LOw€R cat< s~LEc.· .. noN

_==IM:",,,,,,· 41.

The next lower three addres:s 1 t'nes' (A12~ All~ Ala) are decoded by. two each '74LS42, U5and U6, U5 is strobed bY' S.X"~ ltne and select~ the lower 8 addres:s

banks. u6 is strobed by Sy* line a~d sel~cts the upper 8 addres~ 6ank~, U5 and U6 are designated Chi'p Select Decoders on the s:chematt'c dt'agram,

CHIP 5ELECr DECODER~

AI\

AIO @-'---";:+--

SKlf

Each chtp enable 1 ine goes to ptn 8 (cE~'~l of a patr of 2114L chi'ps~p (1 K block) The lower ten address 1 ines are used for dlrect address lng of the 1 K chi'p pat rs, and are buffered bY' U3 and U7.

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FROM CARD SELECT DECODER

SX~~ LOWER 8K

FROM CARD SELECT DECODER

SY~': LOWER 8K

(U6) CHIP ENABLE

CE t;.K~':

CE2K~~

CE3K1:

CE4K~':

CE5K~~

CE6K*

CE7K~~

CE8K

(U5) CHIP ENABLE

CE9K~':

CE I OK~':

CE11~'~

CE12K~'~

CE l3K~':

CE 14K~':

CEI5K~':

CE l6K~':

5

CHI.P ~ET

UPPER LOWE~

U9 Ul7 UIO Ul8 U 11 U19 Ul2 U20 Ul3 U21 U14 U22 Ul5 U23 Ul6 u24

CH I, P SET UPPER LOWER U25 U33 U26 U34 U27 U35 u28 U36 U29 U37 U30 U38 U3l U39 U32 u40

BLQCK MBa MBI MB2 MB3 MB4 MB5 MB6 MB7

BLOCK MB8 MB9 MBIO MBlI MBl2 MBl3 MBl4 MBl5

SH I. PPED

ADDRESS RANGE 8000 - 83FF 8400 - 87FF 8800 - 8BFF 8coo - 8FFF 9000 ... 93FF 9400 - 97FF 9800 - 9BFF 9COO ... 9FFF

AOOO - A3FF A400 - A7FF A800 - ABFF ACOO - AFFF BOOO ... B3FF B400 - B7FF B800 - BBFF BCOO ... BFFF

---'---

pAGE ^.l[)MP: e: 1\

~ ^{0 1 2 3 4} 5 ⁶ 7 8 9 ^{A B} C 0 E F ~~t{t!J O~ N\1

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MEMORY ADDRESS MAP & JUMPER SELECTION TABLE POR lK MEMORY BLOCK

Card Add,... Selection

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4. READ, WRITE, AND BUS CONTROL

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Q.V -S ~~ 'f f:-E.R S

?4L.S~~+

o'J u2

~fMirt ~

L---u

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^{TO wE*" MJ... WR\TE (p,~ ~\\A.\'-\0) EN~ (!,H-\P$ ( $}

The write strobe to the 2114L chips. qnd the read/wrrte control s(gnals for BUS BUFFER di recttonql control is, the implementati"on of the followi'ng Booleqn Logic:

ROM;'· ^=: [(SX + Sy) • MERQ • READ]

WRM;'·::= [(SX + Sy) • MERo. • WR ITE]

If Intel Mask ROM 3625 is to be used, It is necessary to cut the two traces of the WRM* line and ground pin 10 of qllmemory sockets! Pads qre provided

for this option. (PROMs. and RAMs may not be mixed on the same card).

NOTE: The Card's data bus drivers (74LS244) Ul and U2 are enabledanytlme a valid address is present even if memory chips qre not plugged in. The card address range is chosen to prevent bus content ion wi'th other system memory elements including processor on-card memory, other memory cards, and memory mapped I/O.

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5. ELECTRICAL SPECIFICATIONS Vcc :::; +5V ±5%

Icc = 2.08A maximum (l.6A typical) with RAM Power 8.0 watts (typ rca 1) ~'d~

Sockets fully loaded (65mA per RAM maximum)

Address, Data, and Control Busses meet all STD BUS general electrIcal specifications except: A10, All ~ A12 ~ These address bus Inputs present 2 LSTTL loads maximum each.

STD/7701 EDGE CONNECTOR PIN LIST PIN NUMBER PIN NUMBER

OvrPUT (.DtU"e.) LS., ... OUTPUT (DRIVE) L4S. '\II..

INPUT (LOADING) ~L INPUT (LOADING) ~1tt.

MNEMONIC ^'," MNEMONIC

+5 VOLTS VCC 2 1 VCC +5 VOLTS

GROUND GNO 4 3 GNO GROUND

-5V 6 5 -5V

07 1 55 8 ^I---7

f - - -

65 1 03

06 1 5~ 10 9 ^~!; 1 02

05 1 56 12 11 ~'$ 1 01

04 1 55 14 13 ~5 1 DO

A15 1 16 15 1 A7

A14 1 18 17 1 AS

A13 1 20 19 1 A5

A12 2 22 21 1 A4

A11 2 24 23 1 A3

A10 2 26 25 1 A2

A9 1 28 27 1 A1

A8 1 30 29 1 AO

RO' 1 32 31 1 WR'

MEMRO' 1 34 33 IORO'

MEMEX' 1 36 35 IOEXP'

MCSYNC' 38 37 REFRESH'

STATUS 0' 40 39 STATUS l '

BUSRO' 42 41 BUSAK'

INTRO' 44 43 INTAK'

NMIRO' 46 45 WAITRO'

PBRESET' 48 47 SYSRESET'

CNTRl' 50 49 CLOCK'

PCI IN 52 51 OUT PCO

AUX GNO 54 53 AUX GNO

AUX -v 56 55 AUX +V

"Designates Active Low Level Logic

Edge Connector Pin List

**

See Appendix A, Thermal Considerations

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6. MECHAN,CAL $PEClF~CAT{QN$

The Series 7000 cards conform to the STD BUS standards, with the following additional requirements, including those shown.

STD BUS CONNECTOR CARD EDGE

.600 (1.52 CM)

6.5 (16.51 CM)

.250

(.64 CM)... . - CARD .250 (.64 CM) [ .

EJECTOR

-+--~A---~,'--~----~

DATUM

4.48 I/O

.0150x45° MIN BEVEL

(11.38 CM) INTERFACE CARD EDGE 4.1

BOTH SIDES ENTIRE LENGTH

.06 R, 2 PL

5.7 (14.48 CM)

TOLERANCES: .XX =+.025, .XXX=+.0050

(10.41 CM)

Series 7000 STD BUS Standard Card Outline

3.375±.002 (8.57 CM)

.300+.005 -.000 (.76 CM)

Series 7000 STD BUS Edge Card Finger Specifications

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7. 21141024 x 4 BIT STATIC RAM DESCRIPTION

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PIN C£)l'-.\F1QVRf»i'~"'"

2114

RAM

PIN NAMES ACTIVE STATE AO - A9 Address tnputs· High

DO - 03 Data tnput/Output High

CE"~ Chip Enable Low

WE"~ Wri te Enable High Read/Low Write

Vee Power ^(+5V)

-

-:!:- Ground

..

10

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^(D?)

01 lo(.j

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A'5

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"13

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PCO

PC' A9

AS

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A4- ,.3 112

AO

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TYP (-TYP)

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'rID WRM",---l

- - - .

TYP (TYP)

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4. REF DF.~::h/:..;(QNS MT ~6K. U:CA"N6 'PlJRPC·-::ES :NLY A\lO MA,( ~.J6T" AFFEAR CN A~n..A.L ;;0..1<, ...

& \,'PPED AT 80')(l- <erFF. A'l:D :·M.P;>E:D AT A:lJO- bFFF.

&,-INOICATE.S PiN NO. I m: SOCKETS ('1'(p).

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SC'"'~IVIATIC NO. 102686 PA:n S LIST NO.10<='6B3

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REFERENCE ONLY

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PRO-LOG CORPORATION I

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SERIES 7000 MEMORY CARD TIMING

Series 7000 cards are designed to communicate over the STD BUS backplane in any combination without user timing considerations. The following information is provided to accommodate the useof pin compatible memory chip variations which can be used in the Series 7000 memory cards.

Figure lO-' shows the functional blocks of the 7700 Memory cards. The delays contributed by these blocks are added to the memory chip delays and access times to determine the AC characteristics of the card. The table in Figure ,o~ gives maximum propagation delays for the memory card. For exact delays use the IC manufacturer's data sheets and the appropriate schematics.

MEMlX·

ADDIIISI BUI(HIGH,

ADDAESI IIUS (LOW)

ADONSI MIll OIl MIl AIItIA'I DATA

DECODIIIS IlUfnU

o---c

fl ^...

^{a.-. DATA aw , I}

¹⁾

^~

~ ADOIIEIII

_._.

DATA BUS

AOOIIESS IlUfnIlI

'--<

-,

^{_ T I}

CONTIIOl

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(T"'" ^&,

MI_-'" ^110-

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^{~ WIIITI} CIIICUlTIIY _lENT ONLY ON IIAM CAIIDI.

.,.. ^NOTU

F'cau.re \0-1 Memory Card Functional Blocks

PROPAGATION DELAY LOAD CONDITIONS

CIRCUIT

FROM TO . TpD MAX CL RL

MEMORY CHIP ADDRESS ADDRESS BUS ENABLE

DECODERS OR OR 75 ns 15 pF

-

MEMEX' READIWRITE ENABLE

ADDRESS ^BUFFERS ADDRESS ^BUS MEMORY CHIP ^ADDRESS 35 ns 160 pF

-

MEMORY CHIP DATA (OUT) DATA BUS 20 ns 45 pF 4.7Kn

DATA DATA MEMORY CHIP

25 ns 80 pF

BUFFERS BUS DATA (IN)

-

READ WRITE CONTROL VALID OUTPUT ENABLE 30 ns

READ DECODER ROM' 100 pF 4.7Kn

WRITE OUTPUT OR 70 ns

CONTROL RD', WR', WRM' (RAMs ONLY) OR MEMRQ'

f 1C\0C't. \C)-a. Generalized Maximum Delays For Memory Cards

For example, the 2114 RAM chlpts speclfted Data Read a.cce~s~ ttJ1)e from em addre~s change (AO-A9) is 450ns. I n the 7701. th is increased by the add res's buffers (35ns}

and data buffers (20ns) to 505n5. In thts case the decoding of A1Q-A15 and the Data Bus buffer control are presumed to occur during the RAM data access' ttme,

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PLAN #133 - THERMAL APPL1'CATION NOTE FOR MICROPROCESSOR SYSTEMS USING STD/SERIES 7000 CARDS

TABLE OF CONTENTS SECTION 1

SECTION ,2 SECTION 3 SECTION It SECTION 5 SECTION 6 SECTION 7

ILLUSTRATIONS FIGURE 1 FIGURE 2

TABLES TABLE 1 TABLE 2 TABLE 3

INTRODUCTION

THERMAL CONSIDERATIONS FOR STD SYSTEMS CONFIGURING A TYPICAL SYSTEM

FAILURE RATE ACCELERATION DUE TO T J THERMAL RESISTANCE OF ICs

FORCED AIR COOLING CONCLUSION

THERMAL AND ELECTRICAL ANALOGY

HEAT FLOW IN ENCLOSED DIGITAL SYSTEM

TYPICAL NOMINAL POWER DISSIPATION FOR SERIES 7000 CARDS THERMAL RESISTANCE OF TYPICAL IC PACKAGES

FAILURE RATE AS A FUNCTION OF T J

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THERMAL APPLICATION NOTE FOR MICROPROCESSOR SYSTEMS USING STD/SERIES 7000 CARDS SECTION 1 - INTRODUCTION

The failure rate of many electfical components is an exponenti~l function of junction temperature. Temperature rise from ambient to Junction temperature depends on many factors such as power density i.e. watts/inch³, air velocity over the high dissipating components, thermal ·resistance .(junction-to-case) and dissipation of the component, and the thermal characteristics of the cabinet which houses the system.

This application note is intended to aid the user in estimating and solving his thermal problems. Sample analyses of two Series 7000 Systems are included, as well as suggestions for minimizing thermal effects.

Heat flow is analogous to current flow in an" electrical circuit. The electrical and thermal equivalent are presented in Figure 1.

AT

TH£R.nAL

CIRCuIT

= p,

_{I:l V"~ I.}

_Ii

llT

-

'Re

THE~"1AL

EGuf-lTIONS

THERMAL ELECTRICAL I !

SYMBOL NAME UNITS /SYMBOL NAME UNITS

I

i

P POWER (HEAT WATTS I CURRENT AMPS

FLOW)

T TEMPERATURE °c

DIFFERE;NCE

I

^{V VOLTAGE 01 FF~:} VOL TSI

-

j

i R'

e

THERMAL RESISTANCE °C/W

j R ELECTRICAL OHMS!

I RESISTANCE ⁱ

~ I

r

FIGURE 1 - THERMAL AND ELI

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Figure 2 shows STD cards as heat sources in an enclosed .digital system. The heat generated by a card is the sum of numerous heat sources: the

heat generated by ICs plus any singular components. Most heat is generated in the different junctions within the IC. An average thermal resistance between any junction and the case is assumed. Heat flow from an IC with a junction

te~perature TJ encounters the junction-to-case thermal resistance ReJC and raises the. case temperature to TC' From the IC case, the heat flows through ReCAI to the ambient air in the enclosure, and finally through ReA to give TA the ambient temperature·outside the enclosure

- ^-

JUNCTION enclosure

HEAT

SOURCES

Tc..

ReJC IC CASE

ReCAI

I l

r

I I

I

(

AMB I ENT IN ENCLOSURE l f

ReA

- - - --

.J

TA

AMBIENT OUTSIDE ENCLOSURE

TJ - IC junction temperature TC - IC case temperature

TAl';" Ambient temperature in enclosure TA - Ambient temperature outside enclosure ReJC - Thermal resistance, junction-to-case

ReCAI- Thermal resistance, junction-to-ambient in enclosu~e

ReA - Thermal resistance, ambient in enclosure to ambient outside enclosure

FIGURE 2 - HEAT FLOW IN ENCLOS£D DIGITAL SYSTEM

When many heat sources are involved, the thermal circuit becomes quite complex.

The use of analysis with assumptions, approximations, and experimental techniques is necessary to understand the problems and find practical solutions.

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SECTION 2 - THERMAL CONSIDERATIONS FOR STD SYSTEMS

Pro-Log Series 7000 logi.c cards are designed with components rated at +70⁰C oi higher. We recommend a maximum ambient free-air temperature of +55°C for this system. This provides for a +30⁰C temperature rise over normal room temperatur~

Card placement and card rack orientation are imp~rtant considerations in configuring a system. Distribution of power throughout the card rack can contribute to optimizing system performance and lifetime. Even power dis- tribution can be achieved by spacing high power-dissipating cards between cards of lower power.

In an STD/Series 7000 system a sequence of six cards such as 7803 CPU, 7702 ROM, 7602 I/O, 7701 RAM, 7502 I/O, 7604 I/O is a good example of even power distribution. This sequence was used in Example 2. Nominal pO\'Jer dissipation for these and other Series 7000 cards is listed in Table 1.

Further temperature reduction can be achieved by leaving a card slot empty

adjacent to the component side of a high power dissipating card, or by· providing forced air cooling to improve air circ~lation in the card rack.

This application note includes sample calculations for two system situations.

Example 1 is for three fully loaded 7701 RAM cards on 1/21: and 1" centers.

Example 2 is for six cards sequenced as listed above, for 1/2" centers and again

for 1" spacing on component side of 7701 RAM card. (See Configuring a Typical system)O To determine whether a particular card's temperature parameters will

be exceeded, the user can calculate the maximum acceptable ambient temperature with the method outlined below.

1.

2.

3.

4.

Measure the case temperature (TC) of the hottest device or devices on the card(s) in question. This can be accompl ished by placing a thermocouple probe imbedded in silicone grease in the sockets under .selected IC's. Typically this Te will result in the worst case

junction temperature (TJ ).

Use the data in Table 2 to determine the maximum acceptable device junction temperature (TJ). This table shows different failure

~cceleration factors for different temperatures (TJ ).

Use Table 3 to find the approximate thermal resistance junction- to-case for the device or devices being considered. For more

accurate caku'lations use the ReJC from the specific device manufacturer.

Using the manufacturer's data sheets, determine the maximum power the device dissipates.

5. Calculate the maximum TA acceptable. See sample calculations.

6. If the card cage is enclosed, measure the exhaust temperature (T )

'after the temperature has stabilized. If this temperature is mu~h

O·

above TA, subtract TA from TA, and lO\A/er the acceptable TA' calculated for the system by this amount.

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CARD. NO .. CARD NAME NOMINAL POWER WATTS 7504 TRIAC 16.75W (maximum) 7502 RELAY 1. 50

7506,7503 OPTO ISOLATE[

2.90 INPUT

7601 TTL I/O 1. 50 7602 TTL IN ^1. 10 7603 TTL I/O 1. 75 7604 TTL 110 2.3)

()

^{7701 RAM 8.00}

7702 CPU ROM 1 .00 7801 CPU 8085 5.00 7802 CPU 6800 6.30 7803 CPU z80 6.00

TABLE 1 - TYPICAL POWER DISSIPATIONS FOR SERIES 7000 CARDS

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EXAMPLE 1 SAMPLE CALCULATIONS 7701 MEMORY CARD

Equations, Assumpti9ns and Constants Absolute T a

J

=

125 C Desired Maximum T

J

=

^1t50C

Hottest IC for ],101 RAM card is 2114L in center of card

&.

RWC = 45⁰C/watt

Pmax(2l14L)

=

^0.37

w

T_J

=

Te + RSJC . (Pmax)

~T

=

^T_J maximum desired - T

J calculated Maximum T

A

= TA measured +AT

Calculations for 7701 Memory Card with 16K/2114L's convection/

coorlnq 1/2ⁱ' Spacing

&

TA

=

23.2⁰

e

TC

=

93.20

C (measured)

T

Jf.

93. 2°C :'" (45°C/W) ( · 37W) T L.93.20C + 17°C = l10·.2oC

J - '

~T

=

115°C ~ l10.2o

C

=

4.8°c Max i mum T A'

=

23. 2o

C+.l •• 8°C=28°C

1" Spacing

&

TA

=

23.2⁰

e

Te = 65.2o

C (measured)

T J ='6 5 ;~; 20(: + ( 4 5°

c

/w·) • 37W T

=65'

~1oe + l7°e = 82. 2⁰e

I J

.6T = l1s6e ~ ~2. 2.o

e =

32.8

Max i mum T f( = 23. 2°C. + 32. aOC=56°c

&

The data taken was on the center card of 3 adjac-ent memory cards.

~ Abreviations: TA

=

Temperature ambient, T

J

=

Temperature junction, TC = Temperature case, ReJC

=

Thermal resistance junction to case, P = Power

&

The data was taken on cards mounted in a Pro-Log card cage with 3/8" rubber feet

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DJta WJS tJken on the center card of 3

memoO~rds

on the IndIcated spacing _~ ^{i~ " \}

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SECTION 3 - CONFIGURING A TYPICAL SYSTEM

The three card spacing arrangements below show three possible system configurations to distribute power dissipation and heat. The first two correspond to the cal-

culations in example 2 which follows. An improvement of 6°C in the calculated TA' was attained by the addition of a space near the cODponent side of the 7701 RAM card. The third configured system may not be optimal. The additional space may give better result if it is also on the component side of the RAM card. This depends on the power

dissipated on the card adjacent to the circuit side of the RA~ card and other system characteristics.

First attempt for power distribution Example 2 (See sample calculation T

A, = 52⁰C)

Second attempt for power distribution

(~ee example 2 sample calculation TA^,=56OC)

Third attempt for power distribution

(no sample calculations included in text)

s... s...

Ql Ql

-0 -0

""

^{N N rt\ ..:t -0 -0}

s... C 0 0 0 0 0 0 s... c

ro Ql 00 ... '-'>

'"'

^{~ '-'> ro Q)}

O~ ^x Ql

'"' '"'

^{r-.... r-....}

"'" '"'

^{O~ x} Ql

r ^w

^{lW 1 J75W}

^{0 i I}

^{I I 2 3W}

t-- 7W---i 1-10.85W1 . ..- 8. 1 W -I I-1 2.0 5W-I

t-1

o.

1 W - i I:- 4. 05\01 -+

s...

Ql L

-0 ^Q}

-0 C

""

^{N N Q) rt\ ..:::r-} "'0 -0

L Q) 0 0 0 U 0 0 0 ^1- C

ro~ co

'"'

^{~ ro}

'"'

^{'-'> '-0 ro Q}}

U x

'"' '"' '"'

^{0- r-....}

'"'

^{... U+J}

Q) (/) x

Q}

[] _& ~

^! 75W;

^m

i I

lW 8\~ i

OW ^j 2.i3W ^I

I I

t-- 7W - 1 1-= 9. 1 W --f .... 4. 05W -4

~ 8. ^{1 W -t f-}9. 7 5W ~

1-2. lW ^{- I} t-l2.05W-i

s...

Ql -0 -0 C

""

^{N N Ql Q.) CV"\ ..:::t}

L Q.) 0 0 0 U 0 U 0 0

I'O~ 00

'"'

^{~ ro}

'"'

^{1'0 '-D '-'>}

u x

'"' '"' '"'

^{0- r-.... 0- ... r-....}

Q.) (/) (/)

+ ₊ ^{11 ill}

^{OW I'}

r

^{8\~ ,~\} 1

^[J

~ ^{I I i} 75W 1. 1W

I

^OW

I

^{j ! 2.J~J}

1--7W ----4 '-9.1W~ t- 4. 05W-4

A 11 cards on 1/2"

centers.

Power distribution . in groups of 3 card slots

As above excep t 111 spacing on component side of 7701 RAM card.

s...

Q) -0 ""0

L C _1'0 Q.) As above except

u~ _x 1" space on both

Q) sides of 7701

~ _I

^{RA'1 card}

t-8.1W""1 ^I-8. 05W--l t--4.05'tH

l -2. l\.J-i I- 9. 75W-{

~

Primary consideration should be given to the space provided on the component side for the high power dissipating card.

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EXAMPLE 2 -CALCULATION STD/7000 MIXED CARD SYSTEM

Equations, Assumptions and Constants 7701 Memory Card with 16K/2114L's convection cooling

°

Absolute T

J

=

125 C Desired Maximum T

J

=

^115°C

Hottest IC for 7701 RAM card is 2114L in center of card

RaJc:: 45°C/watt Pmax (2114L)

=

O.37W TA ~ 24°C

T J

=

T C + Raj C . (Pmax)

1/2' ^t spac i ng

TA

=

24.8°C

TC

=

70.8°C(measured)

°

TJ

=

70.8 C + (45⁰C/W}(0.37W) TJ

=

70.8°C + 17°C

=

87.8°0 AT

=

T

J maximum desired - T

J Calculatedl AT

=

115°C - 87.8°c

=

27.2°C T A' maxi mum - T A measured + AT Maximum T

A ⁼

^{24.8°C + 27.20C}

°

TA,max

=

52 C

I

1" spac i ng component· side 7701 on 1)

TA of 24.8°C

TC

=

64.8°C(measured)

TJ "64.8°C + (45⁰C/W)(0.J7W) TJ 64.8°C + 17°C

=

81.8°c AT = l15^uC - 8l.8^uc

=

33.2^uC

Max T

A ⁼

^{24.8°c + 33.20C}

⁼

^58°C

T

A

max.

=

58°C

NOTE: these calculations are for the first two of three examples of configuring a system for even power (heat distribution). See figure

The data taken on cards mounted in a Pro-Log CR16A card cage with 3/8" rubber feet.

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~ SECTION 4 - FAILURE RATE ACCELERATION DUE TO T J

•

Table 2 indicates the relative failure rate as a function of junction temperature based on the assumption that the Arrhenius relationship is valid and that the average activation energy is 0.6eV. T

J

=

5SoC is used as the reference

temperature. It should be noted that different device manufacturers' assumptions may vary from those upon which the acceleration factors in Table 1 are based.

Additional design margin is recommended if T

J is above 10soe. Also, a more thorough analysis should be done if the designer's system causes T

J to exceed 10SoC for any length of time.

TABLE 2 - FAILURE RATE AS A FUNCTION OF T J RECOMMENDATIONS T_J ACCELERAT I ON F~rrOltS

Relative to 55 C Incremental

Good 55°C 1 .00 1 .8

Operating 65°C 1. 87 1.87

Range 7SoC 3.39 1.7S

85°C 5.92 1.70

95°C 10.04 1.65

Acceptable for lOSoC 16.56

Intermittant l150e 26.62 1 .61

Operation Not

Recommended l250e 41.78 1 .57

Example: The MTBF (mean time to failure) for a device with T

J

=

55°C will on the average be 3.39 times longer than the MTBF for

the same device with T o

J

=

75

c .

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SECTION 5 - THERMAL RESISTANCE OF ICs

Typical thermal resistance values of standard plastic integrated circuit packages are shown in Table 3. The values shown do not imply any guar- antee, but represent the latest and best available data. Steady-state thermal conditions are assumed in the resistance measurements. Also, the following definitions apply:

Table 3 Conditions and Definitions

R

eJc -

Thermal resistance from junction to case using freon as a heat

sink. This parameter offers good reapeatability and a high degree (±5%) of correlation.

~JA- Thermal resistance from junction to still air (250

C ambient) with package in a specified socket. This parameter is highly dependent on test conditions which are difficult to reproduce accurately.

°C/WATT

&

SOCKET USED FOR POWER PACKAGE DESCRIPTION RaJC ±5% RaJA ±15% RaJA MEASUREMENT (mW)

8- Pin P 1 as tic DIP 52 95 Augat 300

14- or 16- Pin Plastic DIP 45 90 Augat 300

24-p i n Plastic DIP 35 65 Barnes 500 -

14- or l6-Pin Ceramic DIP 20 70 Augat 300

24 lead Ceramic, Kovar Lid 15 50 14 or 16 lead with glass seal 27 95 24 lead ceramic with glass seal 12 50

14- or l6-pin Ceramic Flat Pak 45 160 Barnes Carrier/ 500

(a lloy mounted) Contactor

14-Pin Ceramic Flat Pak 70 190 Mech-Pak Carrier 300 (g 1 ass mounted)

8- or lO-Pin Plug-In 40 120 Barnes 400

(a l10y mounted)

8- or 10-Pin Plug-In 90 170 Barnes 700

(glass mounted)

TABLE 3 - THERMAL RESISTANCE OF TYPICAL IC PACKAGES

~

For more accurate calculations use values given by the device manufacturer

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SECTION 6 - FORCED AIR COOLING

The card cage configuration shown below was used to evaluate the effects

of forced-air cooling. A 37cfm (no head) fan was mounted over each 8-slot section of the card cage. The temperature was then monitored at different locations

on the center card of the three adjacent 7701 RAM cards.

It was found that for this forced-air cooling configuration, the hottest IC on the card was at the top center of the memory chip array. The case temperature (TC) of the hottest 2114Ls was, in every instance, within 20⁰C of ambient (TA)'

Note that, without forced-air cooling, the hot spot on the card was at the center of the memory chip array rather than at the top of the card.

For design of systems using forced-air, refer to fan manufacturer litera- ture such as "How to Select the Optimum Fan for Your Application" by Pamotor Corp., 770 Airport Blvd., Burlingame, Ca., 94010.

Ai r flo\..., from

37 cfw fans mour.ted in sheet metal plate (yl diameter mounting holes)

c

l~) ~r ~'~4-l~~J)

----'--'--'-r

~:J

^J

~c --r=-r~-"::."'C"\t-' 0

I ^I

^I

^I

I i

^I

I

I I ^I

I

o

I I I

¹

=

~(-.4--:-

...

~-b[-.iJ.

^r+.:J::d_D

~~~:;.hl-+"';; 1-:;~:;..L...L..:~~;~_11 ^1- ~ ~

^{i ' -}

^J ~ I@

'-i-+1I~ ,.urA-Tr"'" u-rr-u..JlAAu~u~~ u\.-"I'T""" u-I:~ u~ufL-"TT"'""' u-...,-r-u..l:~UIPl'ff4-u-rr-u-rr-U..Ol~ulr--~

II

,,0 \.(\()

^1.1.()'-

card

exten'--der-_P-:-'l----,----A;-~- ^I

^J

Y

moved in groups of 3 to

L

3/8" rubber feet

different locations of fully (4 pIes.)

loaded ca rd rack c

o o

(1/2" mounting centers)

25

SECTION 7 - CONCLUSION

If power dissipation is evenly distributed throughout an STD/Series 7000 system, convection cooling is often sufficient to maintain the ambient

in the enclosure at an acceptable level. However this should never be assumed. Rather the designer should assess his particular system's thermal

requirements.

It should be noted that the deslred ambient ^~ay also be limited by com- ponents other than ICs. For example, the temperature.limitations of special components,such as batteries, may add additional temperature constraints to the system.

By applying the principles presented in this application note, the designer can determine the thermal profile of his system and optimize its life

expectan~y.

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2411 Garden Road Monterey, California 93940 Telephone: (408) 372-4593

TWX: 910-360-7082

1066908 5K 10/81