DATA BOOK UPDATE 1 1991

Integrated Device Technology, Inc.

1991

DATA BOOK UPDATE 1

2975 Stender Way, Santa Clara, California 95054 Telephone: (408) 727-6116 • FAX: (408) 492-8674

Printed in U.S.A.

©1991 Integrated Device Technology

GENERAL INFORMATION

CONTENTS OVERVIEW

Historically, Integrated Device Technology has presented its product offerings entirely under one cover.

In an effort to simplify this information for our customers, it has been divided into four separate data books - Logic, Specialized Memory, RISC and Static RAM.

This 1991 Update offers new and revised information from each of the four 1991 Data Books. Also included is a current, complete packaging section for alilDT product groups. This section will be updated in each subsequent data book.

The Table of Contents contains a listing of the products in the Update. All data sheets are designated by their corresponding Data Book (A = Logic, B = Specialized Memories, C = RISC, and D = Static RAM) and page numbered individually. For example, Updated 1 C, centered at the bottom of the page, refers to the 1991 RISC Data Book. The corresponding page number is shown in the lower right corner. New data sheets and application notes follow the partial and complete data sheets in the section with the data book that they will appear in when next published.

A header bar atthe top of each change to a partial or complete data sheet indicates which 1990-91 data book the original data sheet can be found in. The reference is organized by data book, section and page number.

IDT, a recognized leader in high-speed CMOS technology, produces a broad line of products. This enables us to provide a complete CMOS solution to designers of high performance digital systems. Not only do our product lines include industry standard devices, they also feature products with faster speed, lower power, and package and/or architectural benefits that allow the designer to achieve significantly improved system performance.

To find ordering information: Start with the Ordering Information chart at the back of each new data sheet. Updated data sheets - for which only the updated information has been included - should be used in reference with the complete data sheet in the appropriate 1991 Data Book.

To find product data: Start with the Table of Contents, organized by data book (data books are organized with partially updated data sheets at the front, followed by updated full data sheets, then new data sheets) or with the numeric Table of Contents organized across all product lines. These indexes will direct you to the pagels) of the partial, full or new data sheet. Included in the update sections is a header bar above the change which has a reference for locating the complete data sheet in the appropriate 1991 Data Book. Data sheets may be of the following type:

ADVANCE INFORMATION - contain initial descriptions, subject to change, for products that are in development, including features and block diagrams.

PRELIMINARY - contain descriptions for products soon to be, or recently, released to production, including features, pinouts and block diagrams. Timing data are based on simulation or initial character- ization and are subject to change upon full characterization.

FINAL - contain minimum and maximum limits specified over the complete supply and temperature range for full production devices.

New products, product performance enhancements, additional package types and new product families are being introduced frequently. Although this update is published in an effort to keep our customers informed of new and changing data, ~ is impossible for itto remain current. Please contact your 10caiiDT sales representative to determine the latest device specifications, package types and product availability.

UPDATE 1 1.1

to cause the failure of the life support device or system, or to affect its safety or effectiveness.

Note: Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best possible product. IDT does not assume any responsibility foruse of any circuitry describedotherthan the circuitry embodied in an IDT product. The Company makes no representations that circuitry described herein is free from patent infringement or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent, patent rights or other rights, of Integrated Device Technology, Inc.

The IDT logo is a registered trademark, BUSMUX, Flexi-pak, BiCEMOS, Cache RAM, CEMOS, Flow-thru EDC, IDT/ux, MacStation, REAL8, RISC SubSystem, RISController, RISCore, SmartLogic, SyncFIFO, TargetSystem, and R3051 are trademarks of Integrated Device Technology, Inc.

FAST is a trademark of National Semiconductor Corporation.

Intel and i486 are trademarks of Intel Corporation.

GENERAL INFORMATION

1991 DATA BOOK UPDATE 1 TABLE OF CONTENTS

PAGE

Contents Overview ... '" ... ... ... ... ... ... 1.1 Table of Contents ... ... ... ... ... ... ... ... .... ... ... ... ... ... ... ... 1.2 Numeric Table of Contents ... ... ... ... ... ... ... ... ... ... ... 1.3

TECHNOLOGY AND CAPABILITIES...

2

QUALITY AND RELIABILITY ...

3

PACKAGE DIAGRAM OUTLINES

Package Diagram Outline Index ... ... ... .... ... ... ... ... ... ... ... ... 4.2 Monolithic Package Diagram Outlines ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 4.3 Module Package Diagram Outlines ... '" ... ... ... .... ... ... .... ... ... 4.4

1990/91 LOGIC DATA BOOK UPDATES

PARTIALLY UPDATED DATA SHEETS

LAST BK. UPDATEPG.

IDT54/74FCT240T Inverting Octal Buffer/Line Driver ... A6.10 ... ;... A - 2 IDT54/74FCT241T Inverting Octal Buffer/Line Driver ... A6.10 ... A - 2 IDT54/74FCT244T Inverting Octal Buffer/Line Driver ... A6.10 ... A - 2 IDT54/74FCT540T Inverting Octal Buffer/Line Driver ... A6.10 ... A - 2 IDT54/74FCT541T Inverting Octal Buffer/Line Driver ... A6.10 ... A - 2 IDT54/74FCT299T 8-lnput Universal Shift Register w/Common ParalielllO Pins ... A6.13... A - 3 IDT54/74FCT399T Quad Dual-Port Register ... A6.17... A - 5 IDT54/74FCT543T Non-inverting Octal Latched Transceiver. ... A6.19... A - 5 IDT49FCT804 High-Speed Tri-Port Bus Multiplexer ... A6.29... A - 6 IDT54/74FCT240 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 IDT54/74FCT241 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 I DT54/74FCT244 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 IDT54/74FCT540 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 IDT54/74FCT541 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 IDT54/74FCT299 8-lnput Universal Shift Register w/Common ParalielllO Pins ... A6.43 ... A - 8 IDT54/74FCT399 Quad Dual-Port Register. ... A6.47... A - 10 IDT54/74FCT543 Non-inverting Octal Latched Transceiver ... A6.49... A - 11 UPDATED FULL DATA SHEETS

IDT73210 Fast Octal RegisterTransceiverw/Parity ... A5.9 ... A - 14 IDT73211 Fast Octal Register Transceiver w/Parity ... A5.9 ... A - 14 IDT49C466 64-BitCMOSFlow-ThruEDCUnit... ... A5.13 ... A-30 IDT49FCT805A Buffer/Clock Driver w/Guaranteed Skew ... A6.30 ... A-54 I DT 49FCT805 Buffer/Clocl< Driver w/Guaranteed Sl<ew ... ... ... .... ... ... ... A6.30 ... ... A-54 IDT49FCT806A Buffer/Clock Driver w/Guaranteed Skew ... A6.30 ... A-54 IDT49FCT806 Buffer/Clock Driver w/Guaranteed Skew ... ; ... A6.30 ... A-54 IDT54/74FBT2240A Inverting Octal Buffer/Line Driver w/25Q Series Resistor ... A6.67... A - 61 IDT54/74FBT2240 Inverting Octal Buffer/Line Driver w/25Q Series Resistor ... A6.67... A - 61 IDT54/74FBT2244A Inverting Octal Buffer/Line Driver w/25Q Series Resistor ... A6.68 ... A - 67 IDT54/74FBT2244 Inverting Octal Buffer/Line Driver w/25Q Series Resistor ... A6.68... A - 67 IDT54/74FBT2373A Octal Transparent Latch w/3-State and 25Q Series Resistor ... A6.69 ... A - 73

UPDATE1 1.2

NEW DATA SHEETS AND APPLICATION NOTES

IDT54/74FCT826T 8-Bit Inverting Register w/Multiple Enable ... A - 88 AN-82 Clock Distribution Simplified wilDT Guaranteed Skew Clock Drivers ... ... ... ... A - 95 AN-84 IDT49FCT804 Tri-Port Bus Multiplexer ... ,... A-106

1990/91

SPECIALIZED MEMORIES DATA BOOK UPDATES

PARTIALLY UPDATED DATA SHEETS

IDT10484 IDT100484 IDT101484 IDT10A484 IDT100M84 IDT101M84 IDT10490 IDT100490 IDT101490 IDT10496RL IDT100496RL IDT101496RL IDT10506RL IDT100506RL IDT101506RL IDT7251 I DT7251 0 IDT7252 IDT72520 IDT72511 IDT72521 IDT7030 IDT7040 IDT7010 IDT70104 IDT7MB1006 IDT7MB1008 I DT7M 1 002 I DT7MP4034 IDT7MB4040 IDT7MC4032 I DT7MP4031 IDT7MP4036 IDT7MP4045

4K x 4 ECL 10K SRAM (Corner Power) ... B5.1 ... B-2 4K x 4 ECl 1 OOK SRAM (Corner Power) ... ... B5.1 ... B-2 4K x 4 ECl 101 K SRAM (Corner Power) ... B5.1 .... :... B-2 4K x 4 ECl 10K SRAM (Corner Power) ... B5.2 ... B-2 .4K x 4 ECl 1 OOK SRAM (Corner Power) ... B5.2 ... B-2 4K x 4 ECl 101K SRAM (Corner Power) ... B5.2 ... ;... B-2 64K x 1 ECl 10K SRAM ... B5.3 ... B-2 64K x 1 ECl 100K SRAM ... B5.3... B-2 64K x 1 ECl 101K SRAM ... B5.3... B-2 16K x 4 Self-Timed Reg Input, latch Output ... : ... ; ... B5.6... B- 3 16K x 4 Self-Timed Reg Input, latch Output ... B5.6... B-3"

16K x 4 Self-Timeq Reg Input, latch Output ... B5.6... B-3 64K x 4 SeJf-Timed Reg Input, latch Output ... B5.11 ... B-3 64K x 4 SeJf-Timed Reg Input, latch Output ... B5.11 ... B.- 3 64K x 4 Self-Timed Reg Input, latch Output ... B5.11 ... B-3.

512 x 18-Bit -1K x 9-Bit BiFIFO ... B6.19 ... B-3 512 x 18-Bit -1K x 9-Bit BiFIFO ... B6.19... B-3 512 x 18-Bit -1 K x 9-Bit BiFIFO ... B6.19... B-3 512 x 18-Bit -1K x 9-Bit BiFIFO ... B6.19... B-3 512 x 18-Bit BiFIFO ... B6.20 ... B-6 512 x 18~Bit BiFIFO ... B6.20 ... B - 6 . 8K (1 K x 8) Dual-Port RAM (MASTER) ... B7.2... B - 8 8K (1 K x 8) Dual-Port RAM (SLAVE) ... ;... B7.2... B - 8 9K (1 K x 9) Dual-Port RAM (MASTER) ... ;... B7.3... B-9 9K (1 K x 9) Dual-Port RAM (SLAVE) ... B7.3... B - 9 64K x 16 Dual-Port Static RAM Module ... : ... ; ... B8.7... B - 10 32K x 16 Dual-Port Static RAM Module ... B8.7... B - 10 16K x 32 Dual-Port Static RAM Module ... B8.9 ... B - 15 256K x 8 CMOS Static RAM Module ... B8.22 ... B - 17 256K x 9 CMOS Static RAM Module ... B8.26... B - 18 16K x 32 CMOS Static RAM Module w/Separate Data 1/0 .... ; ... B8.35... B - 18 16K x 32 CMOS Static RAM Module ... , ... B8.36... B - 20 64K x 32 CMOS Static RAM Module ... :... B8.39 ... B - 21 256K x 32 CMOS Static RAM Module ... B8.40 ... B - 22 UPDATED FULL DATA SHEETS

IDT10494 16K x 4 ECl 10K SRAM ... B5.4 ... B - 26 IDT100494 16K x 4 ECl 100K SRAM ... ,'.; ... ; ... B5.4 ... B - 26 IDT101494 16K x 4 ECl 1 01K SRAM ... B5.4 ... B - 26 IDT7M1001 128K x 8 Dual-Port Static RAMModule ... B8.4 ... ;.... B - 35 I DT7M 1 003 64K x 8 Dual-Port Static RAM Module ... ; ... B8.4 ... B - 35 I DT7MP4047 512K x 16 CMOS Static RAM Module ... B8.34...

B -

50

1990/91

SPECIALIZED MEMORIES DATA BOOK UPDATES (Continued)

NEW DATA SHEETS AND APPLICATION NOTES

LAST BK. UPDATEPG.

IDT10474 1Kx4ECL10KSRAM ... B-58 IDT100474 1 K x 4 ECl 100K SRAM ... B - 58 IDT101474 1Kx4ECl101KSRAM ... B-58 IDT10A474 1Kx4ECl10KSRAM ... B-67 IDT100A474 1K x 4 ECl 100K SRAM ... B - 67 IDT101A474 1Kx4ECl101KSRAM ... B-67 IDT10480 16Kx1 ECl10KSRAM ... B-76 IDT100480 16K x 1 ECl 10K SRAM ... B - 76 IDT101480 16K x 1 ECl 10K SRAM ... B - 76 IDT10514 256K x 4 ECl 10K SRAM ... B - 85 IDT100514 256K x 4 ECl 10K SRAM ... B - 85 IDT101514 256K x 4 ECl 10K SRAM ... B - 85 IDT10596RR 32K x 9 ECl 10K SRAM ... B - 94 IDT100596RR 32K x 9 ECl 10K SRAM ... B - 94 IDT101596RR 32K x 9 ECl 10K SRAM ... B - 94 IDT7099 36K (4K x 9-Bit) Synchronous Dual-Port RAM ... B - 104 Subsystems Custom Module Capabilities ... ... ... ... ... ... ... ... B - 113 IDT71 M024 128K x 8 CMOS Static RAM Module ... ... ... ... ... ... B - 114 I DT7M 1 011 1 K x 36 CMOS Dual-Port Static RAM Module ... B - 122 IDT7M1012 2K x 36 CMOS Dual-Port Static RAM Module... B - 122 IDT7M4048 512 x 8 CMOS Static RAM Module - Military ... B - 130 IDT7M4048 512 x 8 CMOS Static RAM Module - Commercial... B - 139 I DT7MB4048 512 x 8 CMOS Static RAM Module - Commercial... B - 139 IDT7M4068 256K x 8 CMOS Static RAM Module - Military ... B - 148 IDT7M4068 256K x 8 CMOS Static RAM Module - Commercial... B - 157 IDT7MB4068 256K x 8 CMOS Static RAM Module - Commercial... B - 157 IDT7M4077 256K x 32 BiCMOS/CMOS Static RAM Module ... B - 166 IDT7M7004 32K x 32 CMOS EEPROM Module ... B - 174 IDT7M7005 32K x 16 SMOS SRAM/EEPROM Module ... B - 180 IDT7MB4064 64K x 16 BiCMOS Static RAM Module ... B - 191 IDT7MB4065 256K x 20 BiCMOS/CMOS Static RAM Module ... B - 198 I DT7MB4066 256K x 16 BiCMOS/CMOS Static RAM Module ... B - 205 IDT7MB4067 256K x 32 CMOS Static RAM Module ... B - 212 IDT7MB6139 Dual (16K x 60) Data/Instruction Cache Module for IDT79R3000 CPU ... B - 218 IDT7MP1021 128K x 8 CMOS Dual-Port Static RAM Module ... B - 226 IDT7MP1023 64K x 8 CMOS Dual-Port Static RAM Module ... B - 226 IDT7MP4046 256K x 16 CMOS Static RAM Module ... B - 227 IDT7MP6074 256K IDT79R4000 Secondary Cache Module Block Family... B - 234 IDT7MP6084 1 MB IDT79R4000 Secondary Cache Module Block Family... B - 234 IDT7MP6094 4MB IDT79R4000 Secondary Cache Module Block Family... B - 234 IDT7MP6085 128K Byte CMOS Secondary Cache Module for the Intel™ i486™ ... B - 239 I DT7MP6087 256K Byte CMOS Secondary Cache Module for the Intel™ i486™ ... B - 239 I DT7MP6086 128K Byte CMOS Secondary Cache Module for the Intel™ i486™ ... B - 247 IDT7MP9244AT Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules... B - 256 I DT7MP9244CTZ Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules... B - 256 IDT7MP9244T Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules... B - 256 I DT7MP9245AT Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules... B - 256 I DT7M P9245CTZ Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... ... .... B - 256 I DT7MP9245T Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules... B - 256 The Subsystem's "FlexiPak™" CMOS Module Family ... B - 263 AN-83 Width Expansion of SyncFIFOsTM (Clocked FIFOs) ... B - 264

UPDATE 1 1.2 3

IDT79R3010AE RISC Floating Point Accelerator (FPA) ... C5.3... C - 4 IDT7RS107 R3000 CPU Modules for High Performance and

MultiProcessor Systems ... C7.5... C - 5 IDT7RS108 R3000 CPU Modules with 256K Cache ... C7.6... C - 8 IDT7RS110 Plug Compatible Family of R3000 CPU Modules· ... C7.8 ... C -11 UPDATED FULL DATA SHEETS

IDT79R3051 IDT79R3051 Family of Integrated RISControliers™ ... C5.5... C -16 IDT79R3052 IDT79R3051 Family of Integrated RISControliers™ ... C5.5... C -16 IDT7RS109 R3000 CPU Modules with 256K Cache ... C7.7... C - 42 IDT7RS901 IDT/sim System Integration Manager ROMabie Debugging Kernal... C8.9... C - 50 IDT7RS903 IDT/c Multi-Host C-Compiler System ... C8.10 ... C - 56 IDT7RS905 IDT/fp Floating Point Library for Use with R3000 Compilers ... C8.12... C - 62 NEW APPLICATION NOTES

AN-85 SRAM Timing Parameters for 40MHz R3000A Cache Design ... C - 66 AN-86 IDT79R3051™ System Design Example ... C -71 AN-87 IDT79R3000/R3001 System Performance Analysis ... C - 102 AN-88 DMA Techniques with IDT's R3000/R3001 RISC CPU ... ;... C -110 AN-89 R3051 TM Family Performance in Embedded Applications ... ... ... C -124

1991 SRAM DATA BOOK UPDATES

PARTIALLY UPDATED DATA SHEETS

IDT6116 2K x 8 with Power-Down ... D5.1 ... D - 2 IDT61298 64K x 4 with Output Enable and Power-Down ... D5.2... D - 3 IDT71256 32K x 8 with Power-Down ... D5.10 ... D - 3 IDT7164 8K x 8 with Power-Dowh ... D5.17... D - 5 IDT61 B298 64K x 4 BiCEMOS with Output Enable ... D6.1 ... D-5 IDT61 B98 16K x 4 BiCEMOS with Output Enable ... D6.2... D - 6 IDT71 B256 32K x 8 BiCEMOS ... D6.8... D - 7 IDT71 B258 64K x 4 BiCEMOS ... , ... ; D6.9... D - 8 UPDATED FULL DATA SHEETS

IDT71589 32K x 9 Burst Mode with Power-Down ... D5.16... D - 12 IDT71B229 16K x 9 x 2 BiCEMOS Cache RAM ... D6.7 ... D - 20

IDT SALES OFFICE, REPRESENTATIVE AND DISTRIBUTOR LOCATIONS

IDT100474 IDT100480 IDT100484 IDT100490 IDT100494 I DT1 00496Rl I DT1 00S06Rl IDT100S14 IDT100S96RR IDT100A474 IDT100A484 IDT101474 IDT101480 IDT101484 IDT101490 IDT101494 IDT101496Rl IDT101S06Rl IDT101S14 IDT101S96RR IDT101A474 IDT101A484 IDT10474 IDT10480 IDT10484 IDT10490 IDT10494 IDT10496Rl IDT10S06Rl IDT10S14 IDT10S96RR IDT10A474 IDT10A484 IDT49C466 IDT49FCT804 IDT49FCT805 IDT49FCT80SA IDT49FCT806 IDT49FCT806A IDTS4/74F8T2240 I DTS4/74F8T2240A IDT54/74F8T2244 IDT54/74F8T2244A IDTS4/74F8T2373 IDTS4/74F8T2373A I DTS4/74F8T2841 IDTS4/74F8T2841A I DT54/74FCT240 IDTS4/74FCT240T IDT54/74FCT241 IDT54/74FCT241T I DTS4/74FCT244

NUMERICAL TABLE OF CONTENTS

LAST BK. UPDATEPG.

1 K x 4 ECl 1 OOK SRAM ... ... ... ... ... ... ... 8 - S8 16K x 1 ECl 10K SRAM ... ... ... ... 8 - 76 4K x 4 ECl 100K SRAM (Corner Power) ... 8S.1 ... 8 - 2 64K x 1 ECl 100K SRAM ... 8S.3 ... 8 - 2 16K x 4 ECl 100K SRAM ... ... ... ... 8S.4 ... 8 - 26

"16K x 4 Self-Timed Reg Input, latch Output" ... 8S.6... 8 - 3

"64K x 4 Self-Timed Reg Input, latch Output" ... 8S.11 ... 8 - 3 256K x 4 ECl 10K SRAM ... 8 - 8S 32K x 9 ECl 10K SRAM ... ... ... ... 8 - 94 1 K x 4 ECl 100K SRAM ... ... ... ... ... ... 8 - 67 4K x 4 ECl 100K SRAM (Corner Power) ... 8S.2... 8 - 2 1 K x 4 ECl 101 K SRAM ... ... ... ... ... 8 - 58 16K x 1 ECl 10K SRAM ... ... ... ... ... 8 - 76 4K x 4 ECl 101K SRAM (Corner Power) ... 85.1 ... 8 - 2 64K x 1 ECl 101K SRAM ... 8S.3... 8 - 2 16K x 4 ECl 101 K SRAM ... ... ... ... ... 8S.4 ... 8 - 26

"16K x 4 Self-Timed Reg Input, latch Output" ... 8S.6... 8 - 3

"64K x 4 Self-Timed Reg Input, latch Output" ... c... 85.11 ... 8 - 3 256K x 4 ECl 10K SRAM ... 8 - 85 32K x 9 ECl 10K SRAM ... ... ... ... ... ... ... ... 8 - 94 1Kx4ECl101KSRAM ... 8-67 4K x 4 ECl 101K SRAM (Corner Power) ... 85.2 ... 8 - 2 1 K x 4 ECl 10K SRAM ____________________________________________________________________ .. _... 8 - 58 16K x 1 ECl 10K SRAM ______________________________________________________________________ ... ... 8 - 76 4K x 4 ECl 10K SRAM (Corner Power) ... 85.1 ... 8 - 2 64K x 1 ECl 10K SRAM ... 8S.3 ... 8 - 2 16K x 4 ECl 10K SRAM ... ... ... ... 85.4 ... ... 8 - 26

"16K x 4 Self-Timed Reg Input, latch Output" ... 8S.6... 8 - 3

"64K x 4 Self-Timed Reg Input, latch Output" ... ... ... 8S.11 ... 8 - 3 256K x 4 ECl 10K SRAM ... ... ... 8 - 85 32K x 9 ECl 10K SRAM ... 8 - 94 1 K x 4 ECl 10K SRAM ... ... ... ... ... ... 8 - 67 4K x 4 ECl 10K SRAM (Corner Power) ... 8S.2 ... 8 - 2 64-8it CMOS Flow-ThruEDC Unit.. ... AS.13 ... A - 30 High-Speed Tri-Port 8us Multiplexer ... ... ... ... ... A6.29 ... A - 6 Buffer/Clock Driver w/Guaranteed Skew... ... ... ... A6.30 ... A - S4 8uffer/Clock Driver w/Guaranteed Skew... ... ... A6.30 ... A - S4 8uffer/Clock Driver w/Guaranteed Skew... ... ... ... A6.30 ... A - S4 8uffer/Clock Driver w/Guaranteed Skew... ... ... ... A6.30 ... A-54 Inverting Octal 8uffer/Line Driver w/2SQ Series Resistor ... A6.67... A - 61 Inverting Octal Buffer/Line Driver w/2SQ Series Resistor ... A6.67... A - 61 Inverting Octal Buffer/Line Driver w/25Q Series Resistor ... A6.68 ... A - 67 Inverting Octal 8uffer/Line Driver w/25Q Series Resistor ... ... A6.68 ... A - 67 Octal Transparent latch w/3-State and 2SQ Series Resistor ... A6.69 ... A - 73 Octal Transparent latch w/3-State and 2SQ Series Resistor ... A6.69 ... A - 73 1 O-Bit Memory latch w/2SQ Series Resistor ... A6.71 ... A - 80 10-8it Memory latch w/2SQ Series Resistor ... ... ... A6.71 ... A - 80 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 Inverting Octal 8uffer/Line Driver ... ... ... ... A6.10 ... A - 2 Inverting Octal 8uffer/Line Driver ... ... ... ... A6.40 ... A - 8 Inverting Octal 8uffer/Line Driver ... ... ... A6.10 ... A - 2 Inverting Octal 8uffer/Line Driver ... A6.40 ... A - 8

UPDATEll.3

IDT54174FCT399T IDT54174FCT540 IDT54/74FCT540T I DT54/74FCT541 IDT54/74FCT541T IDT54174FCT543 IDT54/74FCT543T IDT54174FCT826T IDT6116

IDT61298 IDT61B298 IDT61B98 IDT7010 IDT70104 IDT7030 IDT7040 IDT7099 IDT71256 IDT71589 IDT7164 IDT71B229 IDT71B256 1DT71B258 IDT71M024 IDT7251 IDT72510 IDT72511 IDT7252 IDT72520 IDT72521 IDT73210 IDT73211 IDT79R3000A IDT79R3000AE IDT79R3010A IDT79R3010AE IDT79R3051 IDT79R3052 IDT7M1001 IDT7M1002 IDT7M1003 IDT7M1011 IDT7M1012 IDT7M4048 IDT7M4048 IDT7M4068 IDT7M4068 IDT7M40n IDT7M7004 IDT7M7005 IDT7MB1006

Quad Dual-Port Register ... .... ... ... ... ... ... ... ... ... A6.17... ... ... A - 5 Inverting Octal Buffer/Line Driver ... A6.40 ... A - 8 Inverting Octal Buffer/Line Driver ... A6.10 ...

A -

2 Inverting Octal Buffer/Line Driver ... :... A6.40 ... A - 8 Inverting Octal Buffer/Line Driver ...•.. ; ... A6.10 ... A - 2 Non-inverting Octal Latched Transceiver ... A6.49 ... A - 11 Non-inverting Octal Latched Transceiver ... : ... ~ ... A6.19... A - 5 8-Bit Inverting Register w/Multiple Enable ... :... A - 88 2K x 8 with Power-Down ... ;... D5.1 ... D - 2 64K x 4 with Output Enable and Power-Down ... D5.2... D - 3 64K x 4 BiCEMOS with Output Enable ... D6.1 ... D-5 16K x 4 BiCEMOS with Output Enable ... D6.2... D - 6 9K (1 K x 9) Dual-Port RAM (MASTER) ... B7.3 ... B ~ 9 9K (1 K x 9) Dual-Port RAM (SLAVE) ... B7.3 ... B - 9 8K (1 K x8) Dual-Port RAM (MASTER) ... ,.... B7.2 ... B - 8 8K (1 K x 8) Dual-Port RAM (SLAVE)... B7.2... B - 8 36K (4K x 9-Bit) Synchronous Dual-Port RAM ... ,... B - 104 32K x 8 with Power-Down ... ~ .. ~... D5.10 ... D - 3 32K x 9 Burst Mode with Power-Down ... D5.16... D - 12 8K x 8 with Power-Down ... :... D5.17 ... ... D - 5 16K x 9 x 2 BiCEMOS Cache RAM ... : ... D6.7... D" 20 32K x 8 BiCEMOS ... .'... D6.8 ... ... D - 7 64K x 4 BiCEMOS ... D6.9 ... .... ... D - 8 128K x 8 CMOS Static RAM Module ... ... B - 114 . 512 x 18-Bit-1K x 9-Bit BiFIFO ... B6.19... B-3 512 x 18-Bit-1Kx 9-Bit BiFIFO ... B6.19 ... B-3 512 x 1B-Bit BiFIFO ... B6.20 ... B - 6·

512 x 1B-Bit-1K x 9-Bit BiFIFO ... : ... B6.19... B-3 512 x 1B-Bit -1K x 9-Bit BiFIFO ... ;0 •••••••••••••••••••••••••••••••••••••• B6.19... B-3 512 x 18-Bit BiFIFO ... B6.20 ... B - 6 Fast Octal Register Transceiver w/Parity ... ... A5.9 ... A - 14 Fast Octal Register Transceiver w/Parity ... A5.9 ... A - 14 RISC CPU Processor ... C5.1 ... C - 2 RISC CPU Processor ... C5.1 ... C - 2 RISC Floating Point Accelerator (FPA) ... ;... C5.3... C - 4 RISCFloating Point Accelerator (FPA) ... : ... C5.3 ... C - 4 IDT79R3051 Family of Integrated RISControllers™ ... C5.5 ... C - 16 IDT79R3051 Family of Integrated RISControllers™ ... C5.5 ... C - 16 12BK x B Dual-Port Static RAM Module ... : ... BB.4... B - 35 16K x 32 Dual-Port Static RAM Module ... : ... BB.9...

B -

15 64K x B Dual-Port Static RAM Module ... BB.4 ...• B - 35 1 K x 36 CMOS Dual-Port Static RAM Module ...•.... B - 122 2K x 36 CMOS Dual-Port Static RAM Module ... ;... B - 122 512 xB CMOS Static RAM Module - Military ... : ... ~.... B - 130 512 x B CMOS Static RAM Module - Commercial ... B - 139 256K x B CMOS Static RAM Module - Military ... B -14B.

256K x B CMOS Static RAM Module - Commercial .. , ... ,... B - 157 256K x 32 BiCMOS/CMOS Static RAM Module ... ~ ... B -166 32K x 32 CMOS EEPROM Module ... B -174 32K x 16 SMOS SRAM/EEPROM Module ... B -1BO 64K x 16 Dual-Port Static RAM Module ... B8.7... B -10

NUMERICAL TABLE OF CONTENTS (CONTINUED) LAST BK. UPDATE PG.

IDT7MB100B IDT7MB4040 I DT7MB404B IDT7MB4064 I DT7MB4065 IDT7MB4066 IDT7MB4067 I DT7MB4068 IDT7MB6139 IDT7MC4032 IDT7MP1021 IDT7MP1023 IDT7MP4031 I DT7MP4034 I DT7MP4036 IDT7MP4045 I DT7MP4046 I DT7MP4047 I DT7MP6074 IDT7MP60B4 IDT7MP60B5 IDT7MP60B6 IDT7MP60B7 I DT7MP6094 IDT7MP9244AT I DT7MP9244CTZ I DT7MP9244T I DT7MP9245AT I DT7MP9245CTZ I DT7MP9245T IDT7RS107

32K x 16 Dual-Port Static RAM Module ... ... BB.7 ... . 256K x 9 CMOS Static RAM Module ... .... ... BB.26 ... . 512 x B CMOS Static RAM Module - Commercial. ... . 64K x 16 BiCMOS Static RAM Module ... . 256K x 20 BiCMOS/CMOS Static RAM Module ... . 256K x 16 BiCMOS/CMOS Static RAM Module ... . 256K x 32 CMOS Static RAM Module ... . 256K x 8 CMOS Static RAM Module - Commercial ... . Dual (16K x 60) Data/Instruction Cache Module for IDT79R3000 CPU ... . 16K x 32 CMOS Static RAM Module w/Separate Data 110 ... BB.35 ... . 12BK x B CMOS Dual-Port Static RAM Module ... . 64K x B CMOS Dual-Port Static RAM Module ... . 16K x 32 CMOS Static RAM Module ... ... ... BB.36 ... . 256K x B CMOS Static RAM Module ... ... ... ... ... BB.22 ... . 64K x 32 CMOS Static RAM Module ... ... ... ... .... BB.39 ... . 256K x 32 CMOS Static RAM Module ... BB.40 ... . 256K x 16 CMOS Static RAM Module ... . 512K x 16 CMOS Static RAM Module ... BB.34 ... . 256K IDT79R4000 Secondary Cache Module Block Family ... . 1 MB IDT79R4000 Secondary Cache Module Block Family ... . 12BK Byte CMOS Secondary Cache Module for the Intel™ i4B6™ ... . 12BK Byte CMOS Secondary Cache Module for the Intel™ i4B6™ ... . 256K Byte CMOS Secondary Cache Module for the Intel™ i4B6™ ... . 4MB IDT79R4000 Secondary Cache Module Block Family ... . Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... . Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... . Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... . Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... . Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... . Fast CMOS 32-Bit Buffer/Line Driver and Bidirectional Transceiver Modules ... . R3000 CPU Modules for High Performance and

MultiProcessor Systems ... C7.5 ... . IDT7RS10B R3000 CPU Modules with 256K Cache ... C7.6 ... . IDT7RS109 R3000 CPU Modules with 256K Cache ... C7.7 ... . IDT7RS110 Plug Compatible Family of R3000 CPU Modules ... C7.B ... . IDT7RS901 IDT/sim System Integration Manager ROMabie Debugging Kernal ... CB.9 ... . IDT7RS903 IDT/c Multi-Host C-Compiler System ... CB.10 ... . IDT7RS905 IDT/fp Floating Point Library for Use with R3000 Compilers ... CB.12 ... . Subsystems Custom Module Capabilities ... . The Subsystem's "FlexiPak™" CMOS Module Family ... .

UPDATE 1 1.3

B - 10 B -1B B - 139 B - 191 B -19B B- 205 B - 212 B - 157 B - 218 B - 18 B - 226 B - 226 B -20 B - 17 B -21 B - 22 B - 227 B -50 B - 234 B - 234 B - 239 B - 247 B - 239 B - 234 B - 256 B - 256 B - 256 B - 256 B - 256 B - 256 C - 5 C-8 C -42 C -11 C -50 C -56 C -62 B - 113 B - 263

3

II

TECHNOLOGY AND CAPABILITIES fI

QUALITY AND RELIABILITY II

PACKAGE DIAGRAM OUTLINES

PACKAGE DIAGRAM OUTLINE INDEX

SECTION

MONOLITHIC PACKATE DIAGRAM OUTLINES... 4.3

PKG.

P16-1 P22-1 P28-2 P32-2 P18-1 P20-1 P24-1 P24-2 P28-1 P32-1 P40-1 P48-1 P64-1 D16-1 D18-1 D20-1 D22-1 D24-1 D28-3 D24-3 D24-2 D28-1 D40-1 D28-2 D32-1 D40-2 C20-1 C22-1 C24-1 C28-1 C32-3 C28-2 C32-2 C48-1 C24-2 C28-3 C32-1 C40-1 C68-1 C64-1 C64-2 PG68-2 PG84-2 PG68-2 PG84-2 G68-1 G84-1

DESCRIPTION

16-Pin Plastic DIP (300 Mil) ... , ... . 22-Pin Plastic DIP (300 Mil) ... . 28-Pin Plastic DIP (300 Mil) ... . 32-Pin Plastic DIP (300 Mil) ... ..

18-Pin Plastic DIP (300 Mil - Full lead) ... ..

20-Pin Plastic DIP (300 Mil - Full lead) ... ..

24-Pin Plastic DIP (300 Mil - Full lead) ... ..

24-Pin Plastic DIP (600 Mil) ... ..

28-Pin Plastic DIP (600 Mil) ... . 32-Pin Plastic DIP (600 Mil) ... ..

40-Pin Plastic DIP (600 Mil) ... ..

48-Pin Plastic DIP (600 Mil) ... ..

64-Pin Plastic DIP (900 Mil) ... . 16-Pin CERDIP (300 Mil) ... ..

18 Pin CERDIP (300 Mil) ... ..

20-Pin CERDIP (300 Mil) ... ..

22-Pin CERDIP (300 Mil) ... ..

24-Pin CERDIP (300 Mil) ... ..

28-Pin CERDIP (300 Mil) ... ..

24-Pin CERDIP (400 Mil) ... ..

24-Pin CERDIP (600 Mil) ... . 28-Pin CERDIP (600 Mil) ... . 40-Pin CERDIP (600 Mil) ... ..

28-Pin CERDIP (wide body) ... . 32-Pin CERDIP (wide body) ... . 40-Pin CERDIP (wide body) ... ..

20-Pin Sidebraze DIP (300 Mil) ... ; ... , 22-Pin Sidebraze DIP (300 Mil) ... . 24-Pin Sidebraze DIP (300 Mil) ... . 28-Pin Sidebraze DIP (300 Mil) ... . 32-Pin Sidebraze DIP (300 Mil) ... . 28-Pin Sidebraze DIP (400 Mil) ... . 32-Pin Sidebraze DIP (400 Mil) ... . 48-Pin Sidebraze DIP (400 Mil) ... . 24-Pin Sidebraze DIP (600 Mil) ... . 28-Pin Sidebraze DIP (600 Mil) ... . 32-Pin Sidebraze DIP (600 Mil) ... . 40-Pin Sidebraze DIP (600 Mil) ... . 68-Pin Sidebraze DIP (600 Mil) ... . 64-Pin Sidebraze DIP (900 Mil) ... . 64-Pin Topbraze DIP (900 Mil) ... ..

68-Lead Plastic Pin Grid Array (cavity up) ... . 84-Lead Plastic Pin Grid Array (cavity up) ... . 68-Lead Plastic Pin Grid Array (cavity up) ... . 84-Lead Plastic Pin Grid Array (cavity up) ... . 68-Lead Pin Grid Array (cavity up) ... ..

84-Lead Pin Grid Array (cavity up) ... ..

UPDATE1 4.2

PAGE

34 34 34 34 35 35 35 36 36 36 36 36 36

1

II

1 1 1 1 1 2 2 2 2 2 2 2 3 3 3 3 3 4 4 4 5 5 5 5 5 6 7 49 49 49 49 21 22

G208-1 208-Lead Pin Grid Array (cavity up) ... . GU68-2 68-Lead Pin Grid Array (cavity down) ... . G84-2 84-Lead Pin Grid Array (cavity down) ... . G84-4 84-Lead Pin Grid Array (cavity down) ... . G144-1 144-Lead Pin Grid Array (cavity down) ... ..

G144-3 144-Lead Pin Grid Array (cavity down) .. , ... ;~ ... . G175-1 175-Lead Pin Grid Array (cavity down) ... . G208-2 208-Lead Pin Grid Array (cavity down) ... . S016-1

S018-1 S020-2 S024-2 S028-2 S028-3 S016-6 S020-6 S024-6 S016-2 S020-1 S024-4 S024-8 S028-5 S028-4.

S032-2 S032-3 S048-1 S056-1 S020-7 S024-7 J20-1 J28-1 J44-1 J52-1 J68-1 J84-1 J18-1 J32-1 L20-2 L28-1 L44-1 L48-1 L52-1 L52-2 L68-2 L68-1 L20-1 L22-1 L24-1

16-Pin Small Outline IC (gull wing) ... . 18-Pin Small Oulline IC (gull wing) ... . 20-Pin Small Outline IC (gull wing) ... . 24-Pin Small Outline IC (gull wing) ... . 28-Pin Small Outline IC (gull wing) ... . 28-Pin Small Outline IC (gull wing) ... . 16-Pin Small Outline IC (EIAJ - .050 pitch) ... ; ... . 20-Pin Small Oulline IC (EIAJ - .050 pitch) ... . 24-Pin Small Outline IC (EIAJ - .050 pitch) ... :: ... . 16-Pin Small Outline IC (J-bend) ... . 20-Pin Small Outline IC (J-bend) ... : ... . 24-Pin Small Outline IC (J-bend) ... . 24-Pin Small Outline IC (J-bend) ... . 28-Pin SlTlall Outline IC (J-bend - 300 mil) ... . 28-Pin Small Outline IC (J-bend _ 350 mil) ... ; ... . 28-Pin Small Outline IC (J-bend - 300 mil) ... . 32-Pin Small Outline IC (J-bend - 400 mil) ... . 48-Pin Small Oulline IC (SSOP - JEDEC) ... . 56-Pin Small Oulline IC (SSOP - JEDEC) ... . 20-Pin Small Outline IC (SSOP - EIAJ) ... ; ... . 24-Pin Small Outlien Ie (SSOP - EIAJ) ... . 20-Pin Plastic Leaded Chip Carrier (square) ... ..

28-Pin Plastic Leaded Chip Carrier (square) ... ..

44-Pin Plastic Leaded Chip Carrier (square) ... . 52-Pin Plastic Leaded Chip Carrier (square) ... . 68-Pin Plastic Leaded Chip Carrier (square) ... . 84-Pin Plastic Leaded Chip Carrier (square) ... . 18-Pin Plastic Leaded Chip Carrier (rectangular) ... . 32-Pin Plastic Leaded Chip Carrier (rectangular) ... ; ... . 20-Pin Leadless Chip Carrier (square) ... . 28-Pin Leadless Chip Carrier (square) ... . 44-Pin Leadless Chip Carrier (square) ... ; ... . 48-Pin Leadless Chip Carrier (square) ... . 52-Pin Leadless Chip Carrier (square) ... . 52-Pin Leadless Chip Carrier (square) ... . 68-Pin Leadless Chip Carrier (square) ... . 68-Pin Leadless Chip Carrier (square) ... . 20-Pin Leadless Chip Carrier (rectangular) ... . 22-Pin Leadless Chip Carrier (rectangular) ... . 24-Pin Leadless Chip Carrier (rectangular) ... : ... .

26 27 28 29 30 31 32 33 37 37 37 37 38 38 39 39 39 40 40 40 40 41 41 41 41 42 42 43 43 47 47 47 47 47 47 48 48 18 18 18 18 19 19 19 19 20 20 20

SECTION

MONOLITHIC PACKATE DIAGRAM OUTLINES (Continued) ... 4.3

PKG. DESCRIPTION

L28-2 L32-1 E16-1 E20-1 E24-1 E28-1 E28-2 CQ84-1 F20-1 F20-2 F24-1 F28-1 F28-2 F48-1 F64-1 F68-1 F68-2 F84-1 F84-2 F172-1 F172-2 PQ80-2 PQ100-1 PQ100-2 PQ120-2 PQ128-2 PQ132-1 PQ144-2 PQ160"2 PQ184-2 PQ208-2 PG208-2

28-Pin Leadless Chip Carrier (rectangular) ... . 32-Pin Leadless Chip Carrier (rectangular) ... . 16-Lead CERPACK ... ; ... . 20-Lead CERPACK ... . 24cLead CERPACK ... . 28-Lead CERPACK ... . 28-Lead CERPACK ... . 84-Lead CERQUAD (J-bend) ... . 20-Lead Flatpack ... . 20-Lead Flatpack (.295 body) ... . 24-Lead Flatpack ... . 28-Lead Flatpack ... . 28-Lead Flatpack ... : ... . 48-Lead Flatpack ... . 64-Lead Flatpack ... . 68-Lead Flatpack ... . 68-Lead Flatpack ... . 84-Lead Flatpack ... . 84-Lead Flatpack ... . 172-Lead Quad Flatpack (cavity up) ... . 172-Lead Quad Flatpack (cavity down) ... . 80-Lead Plastic Quad Flatpack (EIAJ) ... , ... . 100-Lead Plastic Quad Flatpack (JEDEC) ... ..

100-Lead Plastic Quad Flatpack (EIAJ) ... . 120-Lead Plastic Quad Flatpack (EIAJ) ... . 128-Lead Plastic Quad Flatpack (EIAJ) ... . 132-Lead Plastic Quad Flatpack (JEDEC) ... . 144-Lead Plastic Quad Flatpack (EIAJ) ... , ... . 160-Lead Plastic Quad Flatpack (EIAJ) ... . 184-Lead Plastic Quad Flatpack (EIAJ) ... , ... . 208-Lead Plastic Quad Flatpack (EIAJ) ... . 208-Lead Plastic Pin Grid Array (cavity up) .... : ... : ... . SECTION

MODULE PACKATE DIAGRAM OUTLINES ... 4.4

PKG. DESCRIPTION PART NUMBER

DIP (DUAL IN-LINE PACKAGES)

PAGE

20 20 16 16 16 16 16 17 8 8 8 8 8 9 9 10 11 12 13 14 15 45 44 45 45 45 44 46 46 46 46 49 PAGE

M1 32-Pin 0.400mil x 0.820mil LCC ... 71 M024, 71 M025 ... 1 M2 32-Pin 400mil Sidebraze DIP ... 71 M024, 71 M025 ... 2 M3 32-Pin 600mil Sidebraze DIP ... 71 M024, 71 M025 ... ... 2 M4 28-Pin Ceramic Sidebraze DIP ... : ... :7M205, 7M206, 7M207 ... 3 M5 28-Pin Ceramic Sidebraze DIP ... 7M4042 ... 3 M6 32-Pin Ceramic Sidebraze DIP ... 7M4048 "C" ... 4 M7 32-Pin Ceramic Sidebraze DIP ... 7M4048 "N" ... 4 M8 32-Pin Ceramic Sidebraze DIP ... 7M4068 "C" ... 5 M9 32-Pin Ceramic Sidebraze DIP ... 7M4068 "N" ... 5 M10 32-Pin Ceramic Sidebraze DIP ... 8M824 "C" ... 6 M11 32-Pin Ceramic Sidebraze DIP ... 8M824 "N" ... 6

UPDATE 1 4.2 3

II

M13 M14 M15 M16 M17 M18 M19 M20 M21 M22 M23 M24 M25 M26 M27 M28 M29 M30 M31 M32

32-Pin FR-4 Plastic DIP ... 7MB4068 ... 7 40-Pin Ceramic Sidebraze DIP ... 7M624 .... ;... 8 40-Pin Ceramic Sidebraze DIP ... 7M812 ... 8 40-Pin Ceramic Side braze DIP ... 7M912 ... ... 9 40-Pin Ceramic Sidebraze DIP ... 8M612 ... 9 40-Pin Ceramic Sidebraze DIP ... 8M624 ... 10 40-Pin FR-4 Plastic DIP ... 7MB4064 ... 10 44-Pin FR-4 Plastic DIP ... 7MB4009 ... 11 44-Pin FR-4 Plastic DIP ... 7MB4040 ... 11 48-Pin Ceramic Sidebraze DIP ... 7M4016 ... 12 48-Pin FR-4 Plastic DIP ... 7MB4065 ... 12 48-Pin FR-4 Plastic DIP ... 7MB4066... 13 58-Pin Ceramic Sidebraze DIP ... 7M134, 7M144, 7M135,

7M145, 7M137 ... 13 60-Pin Ceramic Sidebraze DIP ... 7M1004 ... 14 60-Pin Ceramic Sidebraze DIP ... 7M1005 ... 14 60-Pin Ceramic Sidebraze DIP ... 7M4017 ... 15 60-Pin FR-4 Plastic DIP ... 7MB4067 ... 15 64-Pin Ceramic Sidebraze DIP ... 7M1001 ... 16 64-Pin Ceramic Sidebraze DIP ... 7M1003 ... 16 64-Pin Ceramic Sidebraze DIP ... 7M6032 ... 17 QIP (QUAD IN-LINE PACKAGES)

M33 100-Pin FR-4 Plastic alP ... 7MB6036 ... 18 M34 100-Pin FR-4 Plastic alP ... " ... 7MB6046 ... 19 M35 100-Pin FR-4 Plastic alP ... 7MB6056 ... 20 M36 104-Pin FR-4 Plastic alP ... 7MB6136 ... 21 M37 104-Pin FR-4 Plastic alP ... 7MB6146 ... 22 M38 104-Pin FR-4 Plastic alP ... 7MB6156 ... 23 M39 120-Pin FR-4 Plastic alP ... 7MB6049 ... 24 M40 120-Pin FR-4 Plastic alP ... 7MB6061 ... 25 M41 128-Pin FR-4 Plastic alP ... 7MB6040 ... 26 M42 128-Pin FR-4 Plastic alP ... 7MB6044 ... 27 M43 128-Pin FR-4 Plastic alP ... 7MB6139 ... 28 M44 132-Pin FR-4 Plastic alP ... 7MB6064 ... 29 M45 132-Pin FR-4 Plastic alP ... 7MB1 006 ... 30 M46 132-Pin FR-4 Plastic alP ... 7MB1008... 31 M 4 7 1 6 4 - P i n FR-4 Plastic alP ... 7MB6042 ... 32 HIP (HEX IN·LlNE PACKAGES)

M48 66-Pin Ceramic Sidebraze HIP ... , ... , ... 7M4003, 7M7004,

7M7005 ... ;... 33 M49 66-Pin Ceramic Sidebraze HIP ... 7M4013 "C" ... 34 M50 66-Pin Ceramic Sidebraze HIP ... 7M4013 "N" ... 35 M51 66-Pin Ceramic Sidebraze HIP ... 7M7014 ... 36 PGA (PIN GRID ARRAY PACKAGES)

M52 121-Pin Ceramic Sidebraze PGA ...•... 7M1002 ... 37 M53 121-Pin Ceramic Sidebraze PGA ... 7M1011, 7M1012 ... 38

SECTION PAGE

MODULE PACKATE DIAGRAM OUTLINES (Continued)... 4.4

PKG. DESCRIPTION PART NUMBER

SIP (SINGLE IN·LlNE PACKAGES)

M54 30-Pin Ceramic Sidebraze SIP ... 7MC4001 ... . 39 M55 30-Pin FR-4 Plastic SIP ... 8MP824 ... . 40 M56 36-Pin FR-4 Plastic SIP ... 7MP4008 ... . 41 M57 36-Pin FR-4 Plastic SIP ... 7MP4058 ... . 42 M58 40-Pin FR-4 Plastic SIP ... 8MP612 ... . 42 M59 40-Pin FR-4 Plastic SIP ... 8MP624 ... . 43 M60 45-Pin FR-4 Plastic SIP ... 7MP4046 ... . 43 M61 45-Pin FR-4 Plastic SIP ... 7MP4047 ... . 44 DSIP (DUAL SINGLE IN·LlNE PACKAGES)

M62 28-Pin FR-4 Plastic DSIP ... 7MP2005, 7MP2011 ... . 45 M63 36-Pin Ceramic Sidebraze DSIP ... 7MC4005 ... . 45 M64 88-Pin Ceramic Sidebraze DSIP ... 7MC4032 ... . 46 ZIP (ZIG-ZAG IN-LINE PACKAGES)

M65 42-Pin FR-4 Plastic ZIP ... 7MP4034 ... . M66 52-Pin FR-4 Plastic ZIP ... 7MP2009, 7MP2010 ... . M67 64-Pin FR-4 Plastic ZIP ... 7MP4031, 7MP4036 ... .

47

II

47 48 M68 64-Pin FR-4 Plastic ZIP ... 7MP4045 ... . 48 M69 75-Pin FR-4 Plastic ZIP ... 7MP9244, 7MP9245 ... . 49 SIMM (SINGLE IN-LINE MEMORY MODULE)

M70 64-Pin FR-4 Plastic SIMM ... 7MP1021, 7MP1023 ... . 50 M71 64-Pin FR-4 Plastic SIMM ... 7MP4036 ... . 50 M72 64-Pin FR-4 Plastic SIMM ... 7MP4045 ... . 51 M73 72-Pin FR-4 Plastic SIMM ... , ... 7MP6086 ...•... 51 M74 80-Pin FR-4 Plastic SIMM ... 7MP6074, 7MP6084,

7MP6094 ... . 52 M75 80-Pin FR-4 Plastic SIMM ... 7MP6085 ... . 52 M76 80-Pin FR-4 Plastic SIMM ... 7MP6087 ... . 53

UPDATE1 4.2 5

DUAL IN-LINE PACKAGES

b

'PJ I~

L p===============fi r--

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

3. THE MINIMUM LIMIT FOR DIMENSION b1 MAY BE .023 FOR CORNER LEADS.

16-28 LEAD CERDIP (300 MIL)

DWG

#

^{D16-1 D18-1 D20-1 D22-1 D24-1 D28-3}

#

OF LDS eN 16 18 20 22 24 28

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

A .140 .200 .140 .200 .140 .200 .140 .200 .140 .200 .140 .200 b .015 .021 .015 .021 .015 .021 .015 .021 .015 .021 .015 .021 b1 .038 .060 .038 .060 .038 .060 .045 .060 .045 .065 .045 .065

C .009 .012 .009 .012 .009 .012 .009 .012 .009 .014 .009 .014 D .750 .830 .880 .930 .935 1.060 1.050 1.080 1.240 1.280 1.440 1.485 E .285 .310 .285 .310 .285 .310 .285 .310 .285 .310 .285 .310 E1 .290 .320 .290 .320 .290 .320 .300 .320 .300 .320 .300 .320

e

.100 BSC .100 BSC .100 BSC .100 BSC .100 Bse .100 BSC L .125 .175 .125 .175 .125 .175 .125 .175 .125 .175 .125 .175

L1

.150 - .150 - .150

-

^{.150 - .150}

-

^.150

-

Q .015 .055 .015 .055 .015 .060 .015 .060 .015 .060 .015 .060 S .020 .080 .020 .080 .020 .080 .020 .080 .030 .080 .030 .080

S1 .005 - .005

-

.005

-

.005

-

.005

-

.005

-

ex

^{0' 15' 0' 15' 0' 15' 0' 15' 0' 15' 0' 15'}

PACKAGE DIAGRAM OUTLINES

DUAL IN-LINE PACKAGES (Continued)

24-40 LEAD CERDIP (400 & 600 MIL)

DWG

#

^{D24-3 D24-2 D28-1 D40-1}

#

OF LDS IN 24 24 28 40

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX

A .130 .175 .090 .190 .090 .200 .160 .220

b .015 .021 .014 .023 .014 .023 .014 .023

b1 .045 .065 .038 .060 .038 .065 .038 .065

e .009 .014 .008 .012 .008 .014 .008 .014

D 1.180 1.250 1.230 1.290 1.440 1.490 2.020 2.070

E .350 .410 .500 .610 .510 .545 .510 .545

E1 .380 .420 .590 .620 .590 .620 .590 .620

e

.100 Bse .100 Bse .100 Bse .100 Bse

L .125 .175 .125 .200 .125 .200 .125 .200

L1 .150 - .150 - .150

-

.150 -

Q .015 .060 .015 .060 .020 .060 .020 .060

S .030 .070 .030 .080 .030 .080 .030 .080

S1 .005 - .005 - .005

-

.005 -

ex

^{0' 15' 0' 15'}

o·

15' 0' 15'

28-40 LEAD CERDIP (WIDE BODY)

DWG

#

^{D28-2 D32-1 D40-2}

1#

OF LDS (N) 28 32 40

SYMBOL MIN MAX MIN MAX MIN MAX

A .090 .200 .120 .210 .160 .220

b .014 .023 .014 .023 .014 .023

b1 .038 .065 .038 .065 .038 .065

e .008 .014 .008 .014 .008 .014

D 1.440 1.490 1.625 1.675 2.020 2.070

E .570 .600 .570 .600 .570 .600

E1 .590 .620 .590 .620 .590 .620

e

.100 Bse .100 Bse .100 Bse

L .125 .200 .125 .200 .125 .200

L1 .150

-

^.150

-

^.150

-

Q

.020 .060 .020 .060 .020 .060

S .030 .080 .030 .080 .030 .080

S1 .005

-

^.005

-

^{.005 -}

ex

^{0' 15' 0' 15' 0' 15'}

UPDATE 1 4.3 2

20-32 LEAD SIDE BRAZE (300 MIL)

L

^S2

Q1 -_ .----I-cI==~~

rr=

-J-1--.--SEATING PLANE

,

^{-~u-- C}

I----

E1 - -

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG

#

^{C20-1 C22-1 C24-1 C2B-1 C32-3}

#

OF LOS eN) 20 22 24 2B 32

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

A .090 .200 .100 .200 .090 .200 .090 .200 .090 .200

b

.014 .023 .014 .023 .015 .023 .014 .023 .014 .023

b1

.040 .060 .03B .060 .040 .060 .040 .060 .040 . . . 060

C .OOB .015 .OOB .015 .OOB· .015 .OOB .015 .OOB .014

0 .970 1.060 1.040 1.120 1.1BO 1.230 1.380 1.420 1.580 1.640 E .260 .310 .260 .310 .220 .310 .220 .310 .. 280 .310 E1 .290 .320 .290 .320 .290 .320 .290 .320 .290 .320

e

^{.100 BSC .100 BSC .100 BSC .100 BSC .100 BSC}

L .125 .200 .125 .200 .125 .200 .125 .200 .100 .175

L1 .150

-

.150

-

.150

-

.150

-

^.150

^-

Q .015 .060 .015 .060 .015 .060 .015 .060 .030 .060 S .030 .065 .030 .065 .030 .065 .030 .065 .030 .065

S1 .005

-

.005

-

.005

-

.005

-

^.005

^-

S2 .005

-

.005

-

.005

-

^.005

^-

^.005

-

PACKAGE DIAGRAM OUTLINES

DUAL IN-UNE PACKAGES (Continued) 28-48 LEAD SIDE BRAZE (400 MIL)

It--. - - - D----t-I

48 LEAD OPTION

SEATING PLANE ..

- - - E 1 -

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG # C28-2 C32-2 C48-1

# OF LDS eN) 28 32 48

SYMBOL MIN MAX MIN MAX MIN MAX A .090 .200 .090 .200 .085 .190 b .014 .023 .014 .023 .014 .023

b1 .040 .060 .040 .060 .040 .060 C .008 .014 .008 .014 .008 .014 D 1.380 1.420 1.580 1.640 1.690 1.730 E .380 .420 .380 .410 .380 .410 E1 .390 .420 .390 .420 .390 .420

e .100 BSC .100 BSC .070 BSC L .100 .175 .100 .175 .125 .175

L1 .150 - .150 - .150 -

Q

.030 .060 .030 .060 .020 .070 S .030 .065 .030 .065 .030 .065

S1 .005 - .005 - .005 -

S2 .005 - .005 - .005 -

UPDATE1 4.3 4

24-68 LEAD SIDE BRAZE (600 MIL)

68 LEAD OPTION

L

^S2

Q

1 -_ ,---;.-I--I-====~

rt=

f--L--.---SEA TING PLANE

t

-~C

1 - - - E1 ---;--1

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG

#

C24-2 C28-3 C32-1 C40-'-1 C48-2 C68-1

#

OF LOS (N 24 28 32 40 48 68

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

A .090 .190 .085 .190 .100 .190 .085 .190 .100 .190 .085 .190

b

.015 .023 .015 .022 .015 .023 .015 .023 .015 .023 .015 .023

b1

.040 .060 .038 .060 .040 .060 .038 .060 .040 .060 .040 .060 C .008 .012 .008 .012 .008 .014 .008 .012 .008 .012· .008 .012 D 1.180 1.220 1.380 1.430 1.580 1.640 1.980 2.030 2.370 2.430 2.380 2.440 E .575 .610 .580 .610 .580 .610 .580 .610 .550 .610 .580 .610 E1 .595 .620 .595 .620 .590 .620 .595 .. 620 .595 .620 .590 .620

e

.100 BSC .100 BSC .100 BSC .100 BSC .100 BSe .070 Bse

L .125 .175 .125 .175 .100 .175 .125 .175 .125 .175 .125 .175

L1 .150

-

.150

-

.150

-

.150

-

.150

-

.150

-

^..

Q .020 .060 .020 .060 .020 .060 .020 .060 .020 .060 .020 .070 S .030 .065 .030 .065 .030 .065 .030 .065 .030 .065 .030 .065

S1 .005

-

.005

-

.005

-

.005

-

^.005

-

^.005

^-

S2 .005

-

.005

-

.005

-

.005

-

.005

-

.005

-

PACKAGE DIAGRAM OUTLINES

DUAL IN-LINE PACKAGES (Continued) 64 LEAD SIDE BRAZE (900 MIL)

I~·---D----~--~·I

fN

E

1

^'-t:::':1

rt::::r=~n::::r-t:=J' :-::=-r=n-=-r=T1:=-'

I

-1-'-...- SEATING PLANE

-~c

/ 0 4 - - E1 - - - I

NOTES:

1. ALL DIMENSIONS ARE IN INCHES. UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG

#

^C64-1

#

OF LDS eN) 64

SYMBOL MIN MAX

A .110 .190

b

.014 .023

b1

.040 .060

C .008 .015

D 3.160 3.240

E .884 .915

E1 .890 .920

e

.100 BSC

L .125 .200

L1 .150

-

Q .015 .070

S .030 .065

S1 .005

-

S2 .005

-

UPDATE1 4.3 6

64 LEAD TOP BRAZE (900 MIL)

~I·---D--~~~~~I

T E

^N

l~~

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG

#

C64-2

#

OF LDS eN) 64

SYMBOL MIN MAX

A .120 .180

b

.015 .021

b1

.o~o .060

C .009 .012

D 3.170 3.240

E .790 .810

E1 .880 .915

E2 .640 .660

e

.100 BSC

L .125 .160

L1

.150

-

Q .020 .100

S .030 .065

S1 .005

-

S2 .005 -

PACKAGE DIAGRAM OUTLINES

FLATPACKS

20-28 LEAD FLATPACK

D

1r-

^b

1 ^{f- S1}

^Q

L

E3

N I ^{t t}

E E2

1

L ^{~ [E3}

I '

L

K ~~

^{I I I}

-

^S

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG # F20-1 F20-2 F24-1 F28 1 F28 2

# OF LDS IN 20 20 1.295 BODY) 24 28 28

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX A .045 .092 .045 .092 .045 .090 .045 .090 .045 .115

b

.015 .019 .015 .019 .015 .019 .015 .019 .015 .019 C .003 .006 .003 .006 .003 .006 .004 .007 .003 .007

D - .540 - .540 - .640 .710 .. 740 .710 .740

E .340 .360 .245 .303 .360 .420 .480 .520 .480 .520

E2 .130 - .130 - .180 - .180 - .180 -

E3 .030 - .030 - .030 - ^{.040 - .040 -}

e ^{.050 BSC .050 BSC .050 BSC .050 BSC .050 BSC}

K .006 .015 .008 .015 - - - ^{- -} -

L .250 .370 .250 .370 .250 .370 .250 .370 .250 .370

Q

.010 .040 .010 .040 .010 .040 .010 .045 .026 .045

S - .045 - .045 - .045 - .045 - ^.045

S1 .000 - .005 - .005 - .005 - ^.005 -

UPDATE1 4.3 8

48-64 LEAD QUAD FLATPACK

t - - - -

E

- - - . - j

E2 I--E1 A2

- L - I-- L -

L

r ^e

D t

D D2 ~ -,

^b

PIN 1 I D 7

u D1 J

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG# F48-1 F64-1

# OF LDS (N) 48 64

SYMBOL MIN MAX MIN MAX

A .089 .108 .070 .090 A1 .• 079 .096 .060 .078 A2 ·.058 .073 .030 .045

b

.018 .022 .016 .020 C .008 .010 .009 .012 D/E - ^{. 750 .885 .915 .}

D1/E1 .100 REF .075 REF D2/E2 .550 BSC .750 BSC

e .050 BSC .050 BSC

L .350 .450 .350 .450

ND/NE 12 16

PACKAGE DIAGRAM OUTLINES

FLATPACKS (Continued) 68 LEAD QUAD FLATPACK

NOTES:

I - - - D - - - I

1---D1---~

1 - - -

D2

- - - I

PIN 1 ~PIN ^{1 INDEX}

- I--e

E2 E1 E

L

t

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG # F68-1

# OF LDS (N) 68 SYMBOL MIN MAX

A .080 .145

A1 .070 .090

b

.014 .021

C .008 .012

DIE 1.640 1.870 D1/E1 .926 .970 D2/E2 .800 BSC

e .050 BSC

L .350 .450

ND/NE 17

UPDATE 1 4.3 10

68 LEAD QUAD FLATPACK (FINE PITCH)

-

^L E

illi

^{PIN 1}

^{E1 V /}

VINDEX CO 45' X .01

1

RNER 5

T

^{03 01 0}

J

/ i,1

E3

I

':;,

e

I

i

A1

A

, ,

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED 2. Bse - BASIC LEAD SPACING BETWEEN CENTERS.

DWG

#

^F68-2

#

OF LDS (N) 68

SYMBOL MIN MAX

A .064 .084

A1 .054 .070

b .008 .013

C .0045 .008

D/E .860 1.100

D1/E1 .460 .500

D2/E2 .400 REF

e

.025 BSC

L

.200 .300

ND/NE 17

PACKAGE DIAGRAM OUTLINES

FLATPACKS (Continued)

84 LEAD QUAD FLATPACK (CAVITY DOWN)

D1 D2

e - - ___

D3 - - r P I N 1 IND

/ r P I N 1

• ,

~ 1

t

-

~

^{- E2 E1 E}

J

E3

L

II

L

D

t

DWG

#

F84-1

NOTES:

#

OF LDS eN)

SYMBOL MIN

84

MAX 1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

A

-

^,140

A1

-

EX MARK

1

^A

DET. "A"

J ^LA1

b .014

C .007

.105 .020 .013

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

3. CROSS HATCHED AREA INDICA TES

~AX

INTEGRAL METALLIC HEAT SINK.

I _

^I

D/E 1.485 1.615

D1jE1 1.130 1.170

D2/E2 1.000 BSC

D3/E3 .500 BSC

-Jlj: ~012

^MAX

AT BRAZE PADS

e

^{.050 BSC}

L .350 .450 DETAIL

A

ND/NE 21

UPDATE1 4.3 12

84 LEAD QUAD FLATPACK (CAVITY UP)

B

I

E3

~

_{

DWG

#

#

OF LOS (N) SYMBOL

A A1 b C

DIE

D1/E1 D2LE2 D3,1'E3

e

L ND/NE

01 02 I

J

PIN 1

I

-

I

I

e - I---

03 -

0

F84-2 84

MIN MAX

-

.140

-

^.105

.014 .020 .007 .013 1.485 1.615 1.130 1.170 1.000 BSC

. 500 BSC .050 BSC .350 .450

21

1

I

I

PIN 1 INDEX

-

E2 E1 E

I

^I

~l

^L

I-- ,

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS .

PACKAGE DIAGRAM OUTLINES

FLATPACKS (Continued)

172 LEAD QUAD FLATPACK (CAVITY UP - R3001)

01

I---i~~ r

PIN 1 IND EX MARK

t B-

1I E3L ⁰

DWG

#

F172-1

#

OF LOS (N) 172

SYMBOL MIN MAX

A - .130

A1 - .105

b .006 .010

C .004 .008

DIE 1.580 1.620

D1,{E1 1.135 1.165

D2/E2 1.050 BSC

D3/E3 .525 BSC

e

.025 Bse

L .220 .230

ND/NE 43

I

0

VrPIN

¹

V ,

-0 1

^{E2 E1 E}

0 J

L

t

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

UPDATE 1 4.3

DET. "A"

'---' .018 MAX

~

.008±.006 AT BRAZE PADS

DETAIL

A

14

172 LEAD QUAD FLATPACK (CAVITY DOWN - R3000A)

01

I---r~~ r

PIN 1 IND EX MARK

1 ^A

NOTE 3~

E3L t

1I

DWG

#

#

OF LOS eN) SYMBOL

A A1

b

C

DIE

D1jE1 D2jE2 D3/E3

e

L NDINE

V r P I N 1

,

m 1

^{E2 E1 E}

m J

F172-2 172

MIN MAX

-

.140

- .105

.006 .010 .004 .008 1.580 1.620 1.135 1.165 1.050 BSC

.525 BSC .025 BSC .220 .230

43 0

I

L

f

NOTES:

1. ALL DIMENSIONS ARE

IN

INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

3. CROSS HATCHED AREA INDICATES METALLIC HEAT SINK.

DET. "Au

.018 MAX

.008±.006 AT BRAZE PADS

DETAIL

A

PACKAGE DIAGRAM OUTLINES

CERPACKS

16-28 LEAD CERPACK

~---

D

---~

--n-

^{b Q}

L

N

E1

E ..

I I I

^L

I I I

K

--Ir-- - ^{e - -}

^SI--

NOTES:

1. ALL DIMENSION ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

DWG

#

E16-1 E20-1 E24-1 E28-1 E28-2

1#

OF LDS (N 16 20 24 28 28

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

A .055 .085 .045 .092 .045 .090 .045 .115 .045 .090

b .015 .019 .015 .019 .015 .019 .015 .019 .015 .019

C .0045 .006 .0045 .006 .0045 .006 .0045 .006 .0045 .006

D .370 .430 - .540

-

.640

-

.740

-

.740

E .245 .285 .245 .300 .300 .420 .460 .520 .340 .380

E1 - .305 - .305 - .440

-

.550 - .400

e

.050 BSC .050 BSC .050 BSC .050 BSC .050 BSC

K .008 .015 .008 .015 .008 .015 .008 .015 .008 .015

L .250 .370 .250 .370 .250 .370 .250 .370 .250 .370

Q .026 .040 .026 .040 .026 .040 .026 .045 .026 .045

S - .045

-

.045 - .045

-

.045

-

^.045

S1 .005 - .005 - .005

-

.000

-

^.005

-

UPDATE1 4.3 16

84 LEAD CERQUAD (J-BEND)

.040 X 45' ... ^,

, ...

, ,

...

t~1 ^~ _~

D D1 D3

+

[

JL:Jl::JL:Jl::J

I-

^E3

-I .1

E1 E

~ ^{L t t}

C A1 A

I

b~~I~

I.. .

^{D2/E2 ..}

^I

DWG

#

CQ84-1 NOTES:

#

OF LDS eN) 84

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE

SYMBOL MIN MAX

A .155 .200 SPECIFIED.

A1 .090 .120 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

b1 :022 .032

b .013 .023

C .006 .013

D/E 1.170 1.190

D1/E1 1.138 1.162

D2/E2 1.100 .1.150

D3/.E3 1.000 BSC

e

.050 BSC

ND/NE 21

PACKAGE DIAGRAM OUTLINES

LEADLESS CHIP CARRIERS

h X 45' 3 PL

J X 45' - j A 1 i

J B 1

"--f -"---"'~'lL-V"~~""-'--./L C ^~

^A

L

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

20-48 LEAD LCC (SQUARE)

DWG

#

^{L20-2 L28-1} L44-1 L48-1

1#

OF LOS (N 20 28 44 48

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX

A .064 .100 .064 .100 .064 .120 .055 .120

A1 .054 .066 .050 .088 .054 .088 .045 .090

B1 .022 .028 .022 .028 .022 .028 .017 .023

B2 .072 REF .072 REF .072 REF .072 REF

B3 .006 .022 .006 .022 .006 .022 .006 .022

D/E .342 .358 .442 .460 .640 .660 .554 .572

D1/E1 .200 BSC .300 BSC .500 BSC .440 BSC

D2/E2 .100 BSC .150 BSC .250 BSC .220 BSC

D3/E3 - .358 - .460 - .560 .500 .535

e

.050 BSC .050 BSC .050 BSC .040 BSC

e1 .015

-

^.015

-

^{.015 - .015}

-

h .040 REF .040 REF .040 REF .012 RADIUS

J .020 REF .020 REF .020 REF .020 REF

L .045 .055 .045 .055 .045 .055 .033 .047

L1 .045 .055 .045 .055 .045 .055 .033 .047

L2 .077 .093 .077 .093 .077 .093 .077 .093

L3 .003 .015 .003 .015 .003 .015 .003 .015

ND/NE 5 7 11 12

UPDATE 1 4.3

E

03

18

52-68 LEAD LCC (SQUARE)

OWG

#

^{L52-1 L52-2 L68-2 L68-1}

#

OF LOS (N 52 52 68 68

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX

A .061 .087 .082 .120 .082 .120 .065 .120

A1 .051 .077 .072 .088 .072 .088 .055 .075

81 .022 .028 .022 .028 .022 .028 .008 .014

82 .072 REF .072 REF .072 REF .072 REF

83 .006 .022 .006 .022 .006 .022 .006 .022

DIE .739 .761 .739 .761 .938 .962 .554 .566

01/E1 .600 Bse .600 Bse .800 Bse .400 Bse

02LE2 .300 Bse .300 Bse .400 8se .200 Bse

03/E3

-

^.661

-

.661

-

.862 ^- .535

e

.050 Bse .050 Bse .050 Bse .025 Bse

e1

.015 ^- .015 ^- .015 ^- .015 -

h .040 REF .040 REF .040 REF .040 REF

J .020 REF .020 REF .020 REF .020 REF

L .045 .055 .045 .055 .045 .055 .045 .055

L1 .045 .055 .045 .055 .045 .055 .045 .055

L2 .077 .093 .075 .093 .075 .095 .077 .093

L3 .003 .015 .003 .015 .003 .015 .003 .015

ND/NE 13 13 17 17

PACKAGE DIAGRAM OUTLINES

LEADLESS CHIP CARRIERS (Continued)

J

X

45°

h X 45°

3 PL

I

^{A 1 j}

~ _--j

^{D1 D} _D2

-+---1---.

E1 E

t

NOTES:

1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE SPECIFIED.

2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

~L3

B3~ 0

20-32 LEAD LCC (RECTANGULAR)

DWG

#

L20-1 L22-1 L24-1 L28-2 L32-1

#

OF LDS tN 20 22 24 28 32

SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

A .060 .075 .064 .100 .064 .120 .060 .120 .060 .120 A1 .050 .065 .054 .063 .054 .066 .050 .088 .050 .088 B1 .022 .028 .022 .028 .022 .028 .022 .028 .022 .028

B2 .072 REF .072 REF .072 REF .072 REF .072 REF

B3 .006 .022 .006 .022 .006 .022 .006 .022 .006 .022 D .284 .296 .284 .296 .292 .308 .342 .358 .442 .458

D1 .150 BSC .150 BSC .200 BSC .200 Bse .300 Bse

D2 .075 Bse .075 Bse .100 Bse .100 Bse .150 BSC

D3

-

.280

-

.280

-

.308

-

^.358

^-

^.458

E .420 .435 .480 .496 .392 .408 .540 .560 .540 .560

E1 .250 Bse .300 BSC .300 Bse .400 Bse .400 Bse

E2 .125 BSC .150 Bse .150 Bse .200 Bse .200 Bse

E3 - .410 - .480

-

.408 - .558

-

.558

e

.050 Bse .050 Bse .050 Bse .050 Bse .050 Bse

e1 .015 - .015 - .015 - .015

-

.015 -

h .040 REF .012 RADIUS .025 REF .040 REF .040 REF J .020 REF .012 RADIUS .015 REF .020 REF .020 REF L .045 .055 .039 .051 .040 .050 .045 .055 .045 .055 L1 .045 .055 .039 .051 .040 .050 .045 .055 .045 .055 L2 .080 .095 .083 .097 .077 .093 .077 .093 .077 .093 L3 .003 .015 .003 .015 .003 .015 .003 .015 .003 .015

ND 4 4 5 5 7

NE 6 7 7 9 9

UPDATE 1 4.3 20

68 PIN PGA (CAVITY UP)

¢B1

TOP VIEW

1 2 3 4 5

E1 E

-I

PIN 1

10~

SEATING PLANE

DWG

#

^G68-1

I #

OF PINS eN) 68 NOTES:

SYMBOL MIN MAX 1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE

A .070 .145 SPECIFIED.

¢B .016 . 020 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS .

¢B1

-

. 080 3. SYMBOL "M" REPRESENTS THE PGA MATRIX SIZE .

¢B2 .040 .060 4. SYMBOL "N" REPRESENTS THE NUMBER OF PINS

DIE 1.140 1.180 5. CHAMFERED CORNERS ARE lOT'S OPTION.

01/E1 1.000 BSC

e

.100 BSC

L .120 .140

M 11

Q .040 .06D