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Production of ultra-high-vacuum chambers with integrated getter thin-film coatings by electroforming

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Academic year: 2021

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Figure

Figure 1.7. SEM micrographs of TiZrV coatings sputtered at 100 ◦ C on smooth copper substrate (a) and on rough copper substrate (b)
Figure 2.4. In (a) drawing of proposed flanges. In (b) stainless steel flanges after production, prior to nickel plating, for v.1 and v.2 designs.
Figure 3.4. Grain boundaries revealed after the micro-etching and grain size enumeration pattern according to ASTM-E112 [96].
Figure 4.1. UTS electro-mechanical testing machine. In (a) tensile test set-up. In (b) compression test set-up.
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