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Giant step bunching occurrence during graphene growth on 4H SiC(0001)

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HAL Id: hal-03039790

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Submitted on 4 Dec 2020

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Giant step bunching occurrence during graphene growth on 4H SiC(0001)

Haitham Hrich, Matthieu Paillet, Tianlin Wang, Jean-Manuel Decams, Sylvie Contreras, Perine Landois

To cite this version:

Haitham Hrich, Matthieu Paillet, Tianlin Wang, Jean-Manuel Decams, Sylvie Contreras, et al.. Giant step bunching occurrence during graphene growth on 4H SiC(0001). Graphene 2020 on line, Oct 2020, On line, France. �hal-03039790�

(2)

400 600 800 1000 1200 1400 1600 1800 2000

800 2800 4800 6800 8800

800 sccm Ar

790 sccm Ar + 10 sccm H2

0 2 4 6 8 10 12

0 0.5 1 1.5 2 2.5 3

Average Terraces width Wafer 1

Average Terraces width Wafer 2

CONTACT PERSON REFERENCES

Giant step-bunching occurrence during graphene growth on 4H-SiC(0001)

Haitham HRICH

a

, Matthieu PAILLET

a

, Tianlin WANG, Jean-Manuel DECAMS

b

, Sylvie CONTRERAS

a

, Périne LANDOIS

a

T he main obstacle to the use of graphene on the industrial scale is the growth of a large and homogenous monolayer graphene. Concerning this issue, it is worth noting that our group has recently developed a reproducible and controlled growth process of a monolayer graphene on SiC(0001) by sublimation at low Ar pressure. i.e. 10 mbar [1]. Still, the control of the electronic properties of the obtained graphene by this process is very challenging. E.g. the mobility on our graphene on 4H-SiC(0001) is around 2000 cm

2

v-

1

s

-1

at RT which is in the range of the measured mobilities on similar substrates [2]. Yet, it is still very low when compared with the mobilities reported for suspended graphene [3]. It is well accepted that the electronic properties of graphene on SiC are highly sensitive to the substrate underneath. It was reported that the mobility of graphene on SiC(0001) increases with increasing SiC steps width, and its resistance increases with increasing SiC steps height [4;5]. This means that the electronic properties of graphene on SiC(0001) can be tuned by controlling the height and width of the terraces that results from the surface reconstruction of SiC before the growth .i.e. Step bunching phenomenon.

Motivations

[1] P. Landois et al Phys. Chem. Chem. Phys. 2017, 19, 15833–15841.

[2] E. Arslan et al Electron. Mater. Lett. 2014, 10, 387

[3] H. Chang et al Adv. Funct. Mater. 2013, 23, 1984–1997 [4] Dimitrakopoulos et al Appl. Phys. Lett. 2011, 98, 222105 [5] F.M. Ross et al Nature Mater. 2012,11 114–119

State of the art : Step bunching on SiC(0001)

Movement of the surface atoms at high temperature and the formation of high steps and wide terraces

Our sublimation process to grow graphene

HTA-100 characteristics (prototype)

Gas lines: Ar, N

2

, CH

4

, C

2

H

4

, C

3

H

8

, H

2

Stainless steel water-cooled chamber Up to 2000°C

Ramp rate up to 10 °C/s

Vacuum range: Atmosphere to 10

-6

Torr Sublimation or CVD

https://www.annealsys.com/products/rtp-and-rtcvd/zenith-150.html H. Matsunami et al, Materials Science and Engineering: R: Reports.1997, 20, 25–166

Growth process: 10 mbar, 1750°C

A

G-graphene

/A

G-HOPG

How to control step bunching on SiC(0001) ?

Temperature ramp Miscut angle (θ) 1 °C/s 0.66 °C/s

2 µm

Bao et al, Appl. Phys. Lett. 2016, 109, 081602

The width of terraces is sensitive to SiC miscut angle even if ‘‘small’’

(θ<0.1°)

H

2

etching

Steps width increases with lowering the

temperature ramp

- Remove polishing damages

- Delay the buffer layer graphene formation

Dimitrakopoulos et al, Appl. Phys. Lett.

2011, 98, 22105

G.R. Yazdi et al, Carbon. 2013, 57, 477–484

Kruskopf et al, Thin solid films.

2018, 659, 7-15

Results

H 2 etching

Terraces characterizations: Raman and AFM, complementary technics

A

2D

counts.s

-1

.cm

-1

(50 µm x 50 µm) 10201 spectra

Graphene formation delayed

Topo

Phase

Without H

2

With H

2

Wafer miscut Angle

0 2 4 6 8 10 12

0 0.5 1 1.5

T° ramp (°C/s)

7 µm

Temperature ramp effect

Larger terraces at low T ramp confirming our previous results

Evidence of H

2

effect by MO (DIC)

Miscut uncertainty ~ 0.5°

Tankeblue, China

T er ra ce s widt h ( µm)

T ramp at 0.33°C/s, 10 mbar, 1740°C, 800 sccm Ar

J Enslin et al Phys. Status Solidi A . 2019, 216, 1900682

Conclusions and perspectives Acknowledgments

This project is supported by the region of Occitanie and Annealsys.

A ve ra ge te rr ac es wid th (µm)

a

Laboratoire Charles Coulomb, UMR 5221 Université de Montpellier, France

b

Annealsys, 139 rue des Walkyries, Montpellier, France

P. Landois et al , Phys. Chem. Chem. Phys., 2017, 19, 15833--15841 N. Camara, Phys. Rev. B, 2009, 80, 125410

We have identified in the state of art the parameters allowing the control of step bunching on SiC(0001). We have started testing some of those parameters (temperature ramp, H

2

etching…) and regular steps with a width up to 15 µm have been obtained. As far as we know, our steps are by far larger than those reported in the literature i.e. 100 of nanometers to some µm. The main challenge now would be to cover the large steps by monolayer graphene. Once a reproducible and well controlled process is identified, we will measure the electronic properties of the obtained graphene. At the same time we are exploring some alternative ways to enhance the electronic properties of our graphene such as limiting the buffer layer effect and optimizing the growth on the C face of SiC.

Raman map at 532 nm

Both wafers are 4H-SiC(0001) on axis. No clear wafer effect is observed.

Others 4H 4H vs 6H

HR-XRD to determine the miscut with an uncertainty around 0.015 21 nm

6 nm

40°

10°

2 µm

-20 80 180 280

1200 1700 2200 2700 Graphene+Buffer Layer Buffer Layer

150

3500

Wafer 1 Wafer 2

3 Samples 10 Samples

Int en si ty (c ou nts .s

-1

) 10µm 10µm

Time (s)

T emp er atu re ( °C)

Raman shift cm

-1

Tianlin wang, thesis, University of Montpellier, 2018

3 µm

[email protected]

532 nm

0

Special thanks to L2C-Team PV2D for their help with the AFM characterizations.

Special thanks to L2C-team SCBD for the RAC software that allows the treatment of Raman spectra/map.

Large terraces up to 15 µm with H

2

covered with buffer layer Perspectives

1°C/s 0.1°C/s

Dec re as in g T ° ra mp Inc re as in g t er ra ce s width

No terraces

[email protected]

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