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Identifying and evaluating aging signatures in light emitting diode lighting systems

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Figure

Figure I.17: High power LED packaging.
Figure I.30: Comparison of Rth for each LED chip in 1–, 4–, and 16–chip packages [23] .
Figure I.32: Dislocations in GaN and discontinuations in Au–metallization [26] .
Figure I.39: Maximum EL output power as a function of the integrated Mg concentration [39] .
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